1 Getting started
2 Carrier board Design
- 2.1 Carrier board design guidelines
- 2.2 Integration guide
  - 2.2.1 Advanced routing and carrier board design guidelines
3 General Information
- 3.1 Product Highlights
  - 3.1.1 Hardware
  - 3.1.2 Software
- 3.2 Block Diagram
  - 3.2.1 Configurable routing options
    - 3.2.1.1 BoraX
    - 3.2.1.2 Bora Lite
4 Interfaces and Connectors
5 Electrical and Mechanical Documents
- 5.1 Schematics
- 5.2 Mechanical

Getting started[edit | edit source]

Kit Identification Codes[edit | edit source]

The development kits (DESK, XELK, XUELK, BELK, etc.) are identified by a couple of codes:

P/N Part Number identification code
S/N Serial Number identification code

These codes are printed on a label sticked to the box containing the kit.

For example, the following picture shows such a label of an Axel Ultra XELK (XELK-H-S) with Serial Number 0CFA

Label of Axel Ultra XELK (XELK-H-S)

These codes are required to complete the registration process of the kit.

Unboxing[edit | edit source]

Once you've received the kit, please open the box and check the kit contents with the packing list included in the box, using the table on this chapter as a reference.

The hardware components (SOM, carrier boards and display) are pre-assembled, as shown in the picture below:

Kit Contents[edit | edit source]

The following table list the kit components:

Component	Description	Notes
	BORA Xpress SOM (p/n DBXF4110S2R) SoC: Xilinx XC7Z030 (866Mhz, Speed "-3", Tj 0-100°C) SDRAM: 1 GB DDR3 NOR: bootable SPI flash 16 MB NAND: 1GB (SLC)	For more details, please refer to the BORA Xpress Hardware Manual By default, ARM cores frequency is set to 667 MHz and the example Vivado project is implemented for a "-1" device. This choice makes the software released with the kit compatible with possible variants based on different SoM models. In this regard, see also the order codes section.
	BORA Xpress Carrier board
	AC/DC Single Output Wall Mount adapter Output: +12V – 2.0 A
	microSDHC card with SD adapter and USB adapter

Order codes[edit | edit source]


Order code	Description
BXELK-H-S	This code refers to the default configuration detailed above
BXELK-H-S-D	This variant is like BELK-L-S, except the SOM, which is DBXD4110S2R.

microSD Layout[edit | edit source]

The microSD provided with the kit is used to store:

a bootable partition (mmcblk0p1, vfat) containing:
- binary images (u-boot and kernel images)
root file system partition (mmcblk0p2, ext4)

Kit contents[edit | edit source]

Component	Description	Notes
	BORA Xpress SOM (p/n DBXF4110S2R) SoC: Xilinx XC7Z030 (866Mhz, Speed "-3", Tj 0-100°C) SDRAM: 1 GB DDR3 NOR: bootable SPI flash 16 MB NAND: 1GB (SLC)	For more details, please refer to the BORA Xpress Hardware Manual By default, ARM cores frequency is set to 667 MHz and the example Vivado project is implemented for a "-1" device. This choice makes the software released with the kit compatible with possible variants based on different SoM models. In this regard, see also the order codes section.
	BORA Xpress Carrier board
	AC/DC Single Output Wall Mount adapter Output: +12V – 2.0 A
	microSDHC card with SD adapter and USB adapter

Order codes[edit | edit source]


Order code	Description
BXELK-H-S	This code refers to the default configuration detailed above
BXELK-H-S-D	This variant is like BELK-L-S, except the SOM, which is DBXD4110S2R.

Target setup and first boot[edit | edit source]

This section describes how to quickly start Bora/BoraEVB and BoraX/BoraXEVB systems included in the BELK/BXELK:

on target side, connect a null-modem cable on J17 DB9 connector, denoted also as UART1
on host side, connect the other end of the null-modem cable to a COM port and start your favorite terminal software that will be used to interact with the target's serial console; communication parameters are 115200-8-N-1
optionally connect the BoraEVB/BoraXEVB board to an Ethernet LAN by plugging cable into connector J8, also denoted as ETH0 on BoraEVB and BORAX ETHERNET on BoraXEVB
connect 12V power supply to JP2 or J7 connector, also denoted as PSU 12V
insert the microSD card in the slot J21, also denoted as MICROSD.

Bora+BoraEVB target setup for first boot

BoraX+BoraXEVB target setup for first boot

Bora Lite+Adapter+BoraXEVB target setup for first boot

Once power has been applied to the target, FSBL or U-boot SPL and U-Boot bootloaders will be fetched from the SPI NOR flash that equips Bora/BoraX/BORA Lite SOM and executed. Boot messages will be printed out to the serial console. Redundant U-Boot environment is stored in the NOR flash as well, as depicted in the following image.

NOR flash default partitioning (BELK 3.0.2 or older and BXELK 1.0.1 or older)

NOR flash default partitioning (BELK 4.0.0 or newer and BXELK 2.0.0 or newer)

By default, U-Boot is configured to retrieve Linux kernel image stored in the microSD card [1]. In turn, Linux kernel shall mount root file system from the mmcblk0p2 partition of the microSD card itself [2], [3]. At the end of boot process, Linux shell shall be available on the serial console. Default boot process does not download any bitstream to the Programmable Logic.

The following dump shows the typical messages printed out to the console during bootstrap process. This log refers to Belk-4.0.0 running on BORA SOM. For BORAX SOM similar messages are printed out to the console.


U-Boot SPL 2017.01-belk-4.0.0 (Jul 11 2017 - 15:58:04)
qspi boot
Trying to boot from SPI


U-Boot 2017.01-belk-4.0.0 (Jul 11 2017 - 15:58:04 +0200), Build: jenkins-BELK_u-boot-10

Model: Bora
Board: Xilinx Zynq
I2C:   ready
DRAM:  ECC disabled 1 GiB
Relocating to 3ff2e000, new gd at 3eaedee8, sp at 3eaedec0
NAND:  1024 MiB
MMC:   sdhci@e0100000: 0 (SD)
SF: Detected s25fl256s_64k with page size 256 Bytes, erase size 64 KiB, total 64 MiB
*** Warning - bad CRC, using default environment

In:    serial@e0001000
Out:   serial@e0001000
Err:   serial@e0001000
Model: Bora
Board: Xilinx Zynq
SF: Detected s25fl256s_64k with page size 256 Bytes, erase size 64 KiB, total 64 MiB
SF: Detected s25fl256s_64k with page size 256 Bytes, erase size 64 KiB, total 64 MiB
SOM ConfigID#: 00000001
SOM UniqueID#: 01234567:89abcdef
ds2431_readmem(): error in chip reset
ds2431_readmem(): error in reading buffer
ds2431_readmem(): error in chip reset
ds2431_readmem(): error in reading buffer
CB ConfigID CRC mismatch for 0x00000000 (was 0x00000000, expected 0x2144df1c) at block 3 (offset 96): using default
CB ConfigID#: ffffffff
CB UniqueID#: 00000000:00000000
Net:   ZYNQ GEM: e000b000, phyaddr 7, interface rgmii-id
eth0: ethernet@e000b000
Hit ENTER within 3 seconds to stop autoboot
starting USB...
USB0:   USB EHCI 1.00
scanning bus 0 for devices... 1 USB Device(s) found
       scanning usb for storage devices... 0 Storage Device(s) found

USB device 0: unknown device
** Bad device usb 0 **
switch to partitions #0, OK
mmc0 is current device
reading boot.scr
472 bytes read in 12 ms (38.1 KiB/s)
Running bootscript from mmc ...
## Executing script at 02080000
bootscript generated with command "mkimage -A ARM -T script -C none -n BELK -d bootscript.txt boot.scr"
reading uImage
3770880 bytes read in 642 ms (5.6 MiB/s)
reading bora.dtb
10647 bytes read in 19 ms (546.9 KiB/s)
Booting Bora/BoraX via mmc
## Error: "configid_fixup" not defined
## Booting kernel from Legacy Image at 02080000 ...
   Image Name:   Linux-4.9.0-belk-4.0.0-xilinx
   Image Type:   ARM Linux Kernel Image (uncompressed)
   Data Size:    3770816 Bytes = 3.6 MiB
   Load Address: 00008000
   Entry Point:  00008000
   Verifying Checksum ... OK
## Flattened Device Tree blob at 02000000
   Booting using the fdt blob at 0x2000000
   Loading Kernel Image ... OK
   Loading Device Tree to 1effa000, end 1efff996 ... OK
Switching to NAND storage before starting Linux

Starting kernel ...

Uncompressing Linux... done, booting the kernel.
[    0.000000] Booting Linux on physical CPU 0x0
[    0.000000] Linux version 4.9.0-belk-4.0.0-xilinx (jenkins@linuxserver2) (gcc version 6.2.1 20161016 (Linaro GCC 6.2-2016.11) ) #1 SMP PREEMPT Sun Jul 9 23:10:22 CEST 2017
[    0.000000] CPU: ARMv7 Processor [413fc090] revision 0 (ARMv7), cr=18c5387d
[    0.000000] CPU: PIPT / VIPT nonaliasing data cache, VIPT aliasing instruction cache
[    0.000000] OF: fdt:Machine model: Bora
[    0.000000] bootconsole [earlycon0] enabled
[    0.000000] cma: Reserved 16 MiB at 0x3f000000
[    0.000000] Memory policy: Data cache writealloc
[    0.000000] On node 0 totalpages: 262144
[    0.000000] free_area_init_node: node 0, pgdat c0a2d840, node_mem_map ef7f7000
[    0.000000]   Normal zone: 1536 pages used for memmap
[    0.000000]   Normal zone: 0 pages reserved
[    0.000000]   Normal zone: 196608 pages, LIFO batch:31
[    0.000000]   HighMem zone: 65536 pages, LIFO batch:15
[    0.000000] percpu: Embedded 14 pages/cpu @ef7d1000 s26124 r8192 d23028 u57344
[    0.000000] pcpu-alloc: s26124 r8192 d23028 u57344 alloc=14*4096
[    0.000000] pcpu-alloc: [0] 0 [0] 1
[    0.000000] Built 1 zonelists in Zone order, mobility grouping on.  Total pages: 260608
[    0.000000] Kernel command line: root=/dev/mmcblk0p2 rootwait rw console=ttyPS0,115200n8 debug earlyprintk
[    0.000000] PID hash table entries: 4096 (order: 2, 16384 bytes)
[    0.000000] Dentry cache hash table entries: 131072 (order: 7, 524288 bytes)
[    0.000000] Inode-cache hash table entries: 65536 (order: 6, 262144 bytes)
[    0.000000] Memory: 1013220K/1048576K available (6144K kernel code, 232K rwdata, 1512K rodata, 1024K init, 323K bss, 18972K reserved, 16384K cma-reserved, 245760K highmem)
[    0.000000] Virtual kernel memory layout:
[    0.000000]     vector  : 0xffff0000 - 0xffff1000   (   4 kB)
[    0.000000]     fixmap  : 0xffc00000 - 0xfff00000   (3072 kB)
[    0.000000]     vmalloc : 0xf0800000 - 0xff800000   ( 240 MB)
[    0.000000]     lowmem  : 0xc0000000 - 0xf0000000   ( 768 MB)
[    0.000000]     pkmap   : 0xbfe00000 - 0xc0000000   (   2 MB)
[    0.000000]     modules : 0xbf000000 - 0xbfe00000   (  14 MB)
[    0.000000]       .text : 0xc0008000 - 0xc0700000   (7136 kB)
[    0.000000]       .init : 0xc0900000 - 0xc0a00000   (1024 kB)
[    0.000000]       .data : 0xc0a00000 - 0xc0a3a1a0   ( 233 kB)
[    0.000000]        .bss : 0xc0a3a1a0 - 0xc0a8afb4   ( 324 kB)
[    0.000000] Preemptible hierarchical RCU implementation.
[    0.000000]  Build-time adjustment of leaf fanout to 32.
[    0.000000]  RCU restricting CPUs from NR_CPUS=4 to nr_cpu_ids=2.
[    0.000000] RCU: Adjusting geometry for rcu_fanout_leaf=32, nr_cpu_ids=2
[    0.000000] NR_IRQS:16 nr_irqs:16 16
[    0.000000] efuse mapped to f0802000
[    0.000000] slcr mapped to f0804000
[    0.000000] L2C: platform modifies aux control register: 0x02060000 -> 0x02460000
[    0.000000] L2C: DT/platform modifies aux control register: 0x02060000 -> 0x02460000
[    0.000000] L2C-310 erratum 769419 enabled
[    0.000000] L2C-310 enabling early BRESP for Cortex-A9
[    0.000000] L2C-310 full line of zeros enabled for Cortex-A9
[    0.000000] L2C-310 dynamic clock gating enabled, standby mode enabled
[    0.000000] L2C-310 cache controller enabled, 8 ways, 512 kB
[    0.000000] L2C-310: CACHE_ID 0x410000c8, AUX_CTRL 0x46460001
[    0.000000] zynq_clock_init: clkc starts at f0804100
[    0.000000] Zynq clock init
[    0.000000] ps_clk frequency not specified, using 33 MHz.
[    0.000012] sched_clock: 64 bits at 333MHz, resolution 3ns, wraps every 4398046511103ns
[    0.007870] clocksource: arm_global_timer: mask: 0xffffffffffffffff max_cycles: 0x4ce07af025, max_idle_ns: 440795209040 ns
[    0.018886] Switching to timer-based delay loop, resolution 3ns
[    0.024887] clocksource: ttc_clocksource: mask: 0xffff max_cycles: 0xffff, max_idle_ns: 537538477 ns
[    0.033937] timer #0 at f080c000, irq=17
[    0.038252] Console: colour dummy device 80x30
[    0.042581] Calibrating delay loop (skipped), value calculated using timer frequency.. 666.66 BogoMIPS (lpj=3333333)
[    0.053061] pid_max: default: 32768 minimum: 301
[    0.057843] Mount-cache hash table entries: 2048 (order: 1, 8192 bytes)
[    0.064345] Mountpoint-cache hash table entries: 2048 (order: 1, 8192 bytes)
[    0.071973] CPU: Testing write buffer coherency: ok
[    0.076890] CPU0: thread -1, cpu 0, socket 0, mpidr 80000000
[    0.082484] Setting up static identity map for 0x100000 - 0x100058
[    0.258340] CPU1: thread -1, cpu 1, socket 0, mpidr 80000001
[    0.258442] Brought up 2 CPUs
[    0.266979] SMP: Total of 2 processors activated (1333.33 BogoMIPS).
[    0.273360] CPU: All CPU(s) started in SVC mode.
[    0.278941] devtmpfs: initialized
[    0.285288] VFP support v0.3: implementor 41 architecture 3 part 30 variant 9 rev 4
[    0.293052] clocksource: jiffies: mask: 0xffffffff max_cycles: 0xffffffff, max_idle_ns: 19112604462750000 ns
[    0.303669] pinctrl core: initialized pinctrl subsystem
[    0.310015] NET: Registered protocol family 16
[    0.316110] DMA: preallocated 256 KiB pool for atomic coherent allocations
[    0.358364] cpuidle: using governor ladder
[    0.398352] cpuidle: using governor menu
[    0.414905] hw-breakpoint: found 5 (+1 reserved) breakpoint and 1 watchpoint registers.
[    0.422775] hw-breakpoint: maximum watchpoint size is 4 bytes.
[    0.428739] zynq-ocm f800c000.ocmc: ZYNQ OCM pool: 256 KiB @ 0xf0880000
[    0.435584] zynq-pinctrl 700.pinctrl: zynq pinctrl initialized
[    0.455610] vgaarb: loaded
[    0.458851] SCSI subsystem initialized
[    0.462817] usbcore: registered new interface driver usbfs
[    0.468276] usbcore: registered new interface driver hub
[    0.473587] usbcore: registered new device driver usb
[    0.479680] pps_core: LinuxPPS API ver. 1 registered
[    0.484514] pps_core: Software ver. 5.3.6 - Copyright 2005-2007 Rodolfo Giometti <giometti@linux.it>
[    0.493700] PTP clock support registered
[    0.499357] clocksource: Switched to clocksource arm_global_timer
[    0.520290] NET: Registered protocol family 2
[    0.525350] TCP established hash table entries: 8192 (order: 3, 32768 bytes)
[    0.532409] TCP bind hash table entries: 8192 (order: 4, 65536 bytes)
[    0.538840] TCP: Hash tables configured (established 8192 bind 8192)
[    0.545202] UDP hash table entries: 512 (order: 2, 16384 bytes)
[    0.551082] UDP-Lite hash table entries: 512 (order: 2, 16384 bytes)
[    0.557542] NET: Registered protocol family 1
[    0.562207] RPC: Registered named UNIX socket transport module.
[    0.567985] RPC: Registered udp transport module.
[    0.572752] RPC: Registered tcp transport module.
[    0.577445] RPC: Registered tcp NFSv4.1 backchannel transport module.
[    0.583922] PCI: CLS 0 bytes, default 64
[    0.588414] hw perfevents: enabled with armv7_cortex_a9 PMU driver, 7 counters available
[    0.598056] futex hash table entries: 512 (order: 3, 32768 bytes)
[    0.604966] workingset: timestamp_bits=30 max_order=18 bucket_order=0
[    0.612013] jffs2: version 2.2. (NAND) (SUMMARY)  Â© 2001-2006 Red Hat, Inc.
[    0.619910] bounce: pool size: 64 pages
[    0.623630] io scheduler noop registered
[    0.627583] io scheduler deadline registered
[    0.631928] io scheduler cfq registered (default)
[    0.639167] dma-pl330 f8003000.dmac: Loaded driver for PL330 DMAC-241330
[    0.645763] dma-pl330 f8003000.dmac:         DBUFF-128x8bytes Num_Chans-8 Num_Peri-4 Num_Events-16
[    0.654861] e0000000.serial: ttyPS1 at MMIO 0xe0000000 (irq = 145, base_baud = 3125000) is a xuartps
[    0.664307] e0001000.serial: ttyPS0 at MMIO 0xe0001000 (irq = 146, base_baud = 3125000) is a xuartps
à[    0.673432] console [ttyPS0] enabled
[    0.673432] console [ttyPS0] enabled
[    0.680527] bootconsole [earlycon0] disabled
[    0.680527] bootconsole [earlycon0] disabled
[    0.689751] xdevcfg f8007000.devcfg: ioremap 0xf8007000 to f086f000
[    0.696648] [drm] Initialized
[    0.712609] brd: module loaded
[    0.723100] loop: module loaded
[    0.728406] libphy: Fixed MDIO Bus: probed
[    0.735460] CAN device driver interface
[    0.741807] libphy: MACB_mii_bus: probed
[    0.840108] macb e000b000.ethernet eth0: Cadence GEM rev 0x00020118 at 0xe000b000 irq 148 (00:50:c2:1e:af:e0)
[    0.849977] Micrel KSZ9031 Gigabit PHY e000b000.etherne:07: attached PHY driver [Micrel KSZ9031 Gigabit PHY] (mii_bus:phy_addr=e000b000.etherne:07, irq=-1)
[    0.864140] e1000e: Intel(R) PRO/1000 Network Driver - 3.2.6-k
[    0.869913] e1000e: Copyright(c) 1999 - 2015 Intel Corporation.
[    0.876782] ehci_hcd: USB 2.0 'Enhanced' Host Controller (EHCI) Driver
[    0.883279] ehci-pci: EHCI PCI platform driver
[    0.887820] usbcore: registered new interface driver usb-storage
[    0.894012] e0002000.usb supply vbus not found, using dummy regulator
[    0.900703] ULPI transceiver vendor/product ID 0x0424/0x0006
[    0.906275] Found SMSC USB331x ULPI transceiver.
[    0.910910] ULPI integrity check: passed.
[    0.916630] mousedev: PS/2 mouse device common for all mice
[    0.922521] i2c /dev entries driver
[    0.926190] cdns-i2c e0004000.i2c: 100 kHz mmio e0004000 irq 142
[    0.933517] rtc-ds3232 0-0068: oscillator discontinuity flagged, time unreliable
[    0.943182] rtc-ds3232 0-0068: rtc core: registered ds3232 as rtc0
[    0.950800] ina2xx 0-0041: power monitor ina226 (Rshunt = 10000 uOhm)
[    0.959126] Xilinx Zynq CpuIdle Driver started
[    0.964011] sdhci: Secure Digital Host Controller Interface driver
[    0.970180] sdhci: Copyright(c) Pierre Ossman
[    0.974447] sdhci-pltfm: SDHCI platform and OF driver helper
[    1.039420] mmc0: SDHCI controller on e0100000.sdhci [e0100000.sdhci] using DMA
[    1.047063] usbcore: registered new interface driver usbhid
[    1.053610] usbhid: USB HID core driver
[    1.060557] nand: device found, Manufacturer ID: 0x01, Chip ID: 0xd3
[    1.066828] nand: AMD/Spansion S34ML08G1
[    1.070797] nand: 1024 MiB, SLC, erase size: 128 KiB, page size: 2048, OOB size: 64
[    1.079104] Bad block table found at page 524224, version 0x01
[    1.086183] Bad block table found at page 524160, version 0x01
[    1.092800] 8 ofpart partitions found on MTD device pl35x-nand
[    1.098568] Creating 8 MTD partitions on "pl35x-nand":
[    1.103708] 0x000000000000-0x000000040000 : "nand-SPL"
[    1.120695] 0x000000040000-0x000000100000 : "nand-uboot"
[    1.137009] 0x000000100000-0x000000140000 : "nand-uboot-env1"
[    1.153846] 0x000000140000-0x000000180000 : "nand-uboot-env2"
[    1.160646] mmc0: new SDHC card at address 0001
[    1.165619] mmcblk0: mmc0:0001 SD16G 14.6 GiB
[    1.170685] 0x000000180000-0x000000780000 : "nand-bitstream"
[    1.177693] 0x000000780000-0x000000800000 : "nand-device-tree"
[    1.183599]  mmcblk0: p1 p2
[    1.194709] 0x000000800000-0x000001000000 : "nand-linux"
[    1.211164] 0x000001000000-0x000020000000 : "nand-rootfs"
[    1.232466] NET: Registered protocol family 17
[    1.236842] can: controller area network core (rev 20120528 abi 9)
[    1.243084] NET: Registered protocol family 29
[    1.247450] can: raw protocol (rev 20120528)
[    1.251720] can: broadcast manager protocol (rev 20161123 t)
[    1.257345] can: netlink gateway (rev 20130117) max_hops=1
[    1.263160] Registering SWP/SWPB emulation handler
[    1.274219] rtc-ds3232 0-0068: hctosys: unable to read the hardware clock
[    1.283162] EXT4-fs (mmcblk0p2): mounting ext3 file system using the ext4 subsystem
[    1.592447] random: fast init done
[    1.748727] EXT4-fs (mmcblk0p2): recovery complete
[    1.756780] EXT4-fs (mmcblk0p2): mounted filesystem with ordered data mode. Opts: (null)
[    1.764840] VFS: Mounted root (ext3 filesystem) on device 179:2.
[    1.775504] devtmpfs: mounted
[    1.781627] Freeing unused kernel memory: 1024K (c0900000 - c0a00000)
INIT: version 2.88 booting
Starting udev
[    2.706500] udevd[702]: starting version 3.2
[    2.771034] udevd[703]: starting eudev-3.2
[    2.915949] EXT4-fs (mmcblk0p2): re-mounted. Opts: (null)
Mon Jul  3 00:01:52 UTC 2017
INIT: Entering runlevel: 5
Configuring network interfaces... udhcpc (v1.24.1) started
Sending discover...
Sending discover...
Sending discover...
No lease, forking to background
done.
Starting system message bus: dbus.
Starting Dropbear SSH server: dropbear.
Starting rpcbind daemon...done.
starting statd: done
exportfs: can't open /etc/exports for reading
NFS daemon support not enabled in kernel
Starting syslogd/klogd: done
Starting internet superserver: xinetd.
 * Starting Avahi mDNS/DNS-SD Daemon: avahi-daemon
   ...done.
Starting tcf-agent: OK

Poky (Yocto Project Reference Distro) 2.2.1 bora /dev/ttyPS0

bora login:

[1] bootscript is used to do this task.

[2] This root file system has been generated by Yocto build system.

[3] The microSD card is bootable itself, as explained here.

Target configuration for the development stage (`net_nfs`)[edit | edit source]

The default BELK/BXELK Virtual Machine network configuration is using NAT: this allows to accessing external network (i.e. Internet) using the host computer's networking connection. For software development using net_nfs with tftp/nfs protocols, please configure your VM network interface in Bridge mode (see below)

During the development stage, the target is usually connected via Ethernet LAN to the host machine and is configured to:

retrieve binary images (i.e. Linux kernel) via TFTP protocol
mount the development root file system via NFS protocol. This root file system is physically in the file system of the host machine as depicted here. An example of Bridge mode configuration can be found here

In DAVE Embedded Systems development kits, this configuration is generally denoted as net_nfs. U-Boot bootloader supports this configuration. Some U-Boot environment variables are needed to set it up.

For more information about how to set up and use TFTP and NFS servers, please refer to the following link Booting the system via nfs.

microSD layout[edit | edit source]

The microSD card provided with BELK/BXELK is partitioned as shown in the following image:

microSD card partitioning

Most of storage space is occupied by two partitions:

a FAT32 partition (mmcblk0p1) containing:
- For BELK <= 3.0.2 and BXELK <= 1.0.1 :
  - boot.bin boot image (containing FSBL, FPGA Bitstream an U-boot binaries)
  - U-Boot boot.scr bootscript
  - Linux kernel and DTB binary images
- For BELK 4.0.0 or newer and BXELK 2.0.0 or newer:
  - boot.bin u-boot SPL image
  - fpga.bit optional FPGA bitstream
  - u-boot.img u-boot image
  - U-Boot boot.scr bootscript
  - Linux kernel and DTB binary images
  - MVM image in OVA format
an ext3 partition (mmcblk0p2) containing the root file system for the target.

bootscript and root file system are used to boot the target as described in this section.

It is worth remembering that the microSD card is bootable and U-Boot environment is retrieved from (and stored to with saveenv) into the FAT partition as bora.env

Boot mode selection - S5[edit | edit source]

S5 is a dip-switch for the boot mode selection. The following table reports the available options and the related configurations:

	S5.1	S5.2	S5.3	S5.4	S5.5	S5.6	S5.7	S5.8
SPI-NOR	OFF	ON	OFF	ON	ON	ON	ON	OFF
SD-card	OFF	ON	OFF	ON	ON	OFF	ON	OFF
NAND (*)	OFF	ON	OFF	ON	ON	OFF	ON	ON
JTAG	OFF	ON	OFF	ON	ON	ON	ON	ON

(*) Boot mode from NAND in supported ONLY on BORA Lite SOM module

Reset Button[edit | edit source]

Reset button - S6[edit | edit source]

S6 is the hardware reset button connected to the MRSTn signal (J2.16 SOM connector)

Carrier board Design[edit | edit source]

History
Issue Date	Notes
2021/11/22	New documentation layout

Carrier board design guidelines[edit | edit source]

This page provides useful information and resources to system designers in order to design carrier boards hosting DAVE Embedded Systems system-on-modules (SOM).

These guidelines are provided with the goal to help designers to design compliant systems with DAVE Embedded Systems modules and they cover schematics and PCB aspects. They apply to several products that are listed on the top right corner of this page (see "Applies to" boxes).

Basic guidelines[edit | edit source]

In this section basic hardware guidelines valid for all DAVE Embedded Systems SOMs are detailed.

Schematics[edit | edit source]

Check mirroring and pinout of DAVE Embedded Systems system-on-modules (SOM) connector
Properly decouple DAVE Embedded Systems system-on-modules (SOM) power supply with large bulk capacitor and small bypass capacitor
Use low-ESR X7R capacitor if possible
Check for correct connection of TX and RX lines
Add series resistors as interface needs (see interface details)

PCB[edit | edit source]

PCB Tecnology[edit | edit source]

Use a PCB technology as advised in the following table

Parameter	Min	Typ	Max
Layers(number)	4	6	-
Power Plane Layers	2	4	-
Clearence(mils)	-	6	-
Trace Width(mils)	-	6	-
Vias hole (mechanical)	0,3		-
Minimum number of via for each power signal layer changes	2	3	-
Minimum number of via for each power signal SOM connector pin	1	2	-
Component package size	-	0603	-
PCB Height(mm)	1,4	1,6	-

If vias smaller than minimum advised size are used, take care to maintain an adeguate number of via when you change layer for each power signal.
PCB heights less than minimum advised can produce PCB heating and mechanical issues

PCB Basics Guidelines[edit | edit source]

Avoid stubs
Isolate clock and HI-SPEED signal (see interface specifications for further details)
Avoid voids on planes
Use Solid Connection for on plane vias
Place bulk and ByPass capacitor near DAVE Embedded Systems system-on-modules (SOM) power supply pins
Place series terminator resistor near the related transmitter

SOM Connectors[edit | edit source]

This section provides information and suggestions regarding the SOM mating connectors.

SO-DIMM[edit | edit source]

SO-DIMM mating connectors from different vendors may have slight differences in mechanical characteristics. One critical point is the position of the end of the mating area (please see the picture below), that can be slightly shifted inwards or outwards in respect to the retention holes on the carrier board. This can lead to a misalignment with the holes on the SO-DIMM modules, making difficult or impossible to insert the retentions screws or locking supports.

If you plan to use the holes as additional retention system, we recommend to pay attention to the mechanical characteristics when evaluating the SO-DIMM mating connectors to be mounted on the carrier board.

Power-up sequence[edit | edit source]

In order to prevent back powering effects, DAVE Embedded Systems' SOMs provide the signals required to handle power-up sequence properly. For instance, see the recommended sequence for the BORA SOM here.

In case the power-up sequence is not managed properly, the circuitry populating the SOM may be damaged.

Interfaces Guidelines[edit | edit source]

This section provides guidelines for the most used interfaces on DAVE Embedded Systems SOMs module.
Please refer to SOM's detailed pages for specific additional information.

Ethernet 10/100/1000[edit | edit source]

Case #1: PHY is integrated on SOM[edit | edit source]

This section refers to the case of PHY integrated on SOM such as Lizard and MAYA.

Schematics[edit | edit source]

If LAN connector with integrated magnetic is used:
- predispose ethernet protection diodes on ethernet lines
- Connect connector shield to an adeguate GND or shield Plane

PCB[edit | edit source]

Refer to this table for 10/100 differential pairs routing

Parameter for 10/100 differential pair	Min	Typ	Max
Differential Impedance(ohm)	-	100	-
Common Mode Impedance	-	50	-
Gap than TX and RX signals	2xgap	2xgap	-
Gap than other signals	2xgap	4xgap	-
Intra pair matching(mils)*	0	25	150
TX and RX via # mismatch*	0	0	1

Refer to this table for Gigabit differential pairs routing

Parameter for Gigabit Differential Pairs	Min	Typ	Max
Differential Impedance(ohm)	-	100	-
Common Mode Impedance	-	50	-
Gap than TX and RX signals	2xgap	2xgap	-
Gap than other signals	2xgap	4xgap	-
Intra pair matching(mils)*	0	10	10
Max PCB trace length	3"	5"	-
TX and RX via # mismatch*	0	0	1

* Not mandatory but recommended.

If LAN connector with integrated magnetic is used:
- do not route traces under the connettor, neither on opposite side
- place filter diode near connector
- place others signals far from connector
- Connect connector shield to an adeguate GND or shield Plane or Copper through numerous vias
If on board magnetic are used
- adeguately isolate system GND from magnetic connector side
- Connect connector shield to an adeguate GND or shield Plane or Copper through numerous vias if necessary
try to match as best as possible each differential pair (intrapair matching)
Keep as best as possibile the same route for TX and RX traces
If less than minimum gap is used, use a GND trace for improve trace separation

Case #2: PHY is not integrated on SOM and a RGMII PHY is used[edit | edit source]

This section refers to the case of:

PHY not integrated on SOM
Gigabit PHY populated on carrier board and connected to SOM through RGMII interface.

This solution is implemented on NaonEVB-Mid for example.

Schematics[edit | edit source]

Add series resistors (RPACK resistors recommended) to RGMII lines
Properly decouple PHY Power Supplies rails
Properly decouple every supply pin of Ethernet PHY
Properly separate analog Supply Rails

PCB[edit | edit source]

Parameter for RGMII interface	Min	Typ	Max
Common mode impedance(ohm)	-	50	-
Gap than other ethernet diff pair	4xwidth	-	-
Gap than other signals	4xwidth		-
Matching(mils)	-	-	200
Via Mismatch	0	0	1

Parameter for Gigabit Differential Pairs	Min	Typ	Max
Differential Impedance(ohm)	-	100	-
Common Mode Impedance	-	50	-
Gap than TX and RX signals	2xgap	2xgap	-
Gap than other signals	2xgap	4xgap	-
Intra pair matching(mils)	0	10	10
Max PCB trace length	3"	5"	-
TX and RX via # mismatch*	0	0	1

* Not mandatory but recommended.

Ground and VCC planes must be as large as possible
Avoid plane split and voids
Place bypass capacitor near every PHY supply pin
Connect every capacitor's pin to the plane with at least 2 vias and the shortest trace pattern
Place PHY device at least 1" (25mm) distance far away from connector
Keep MDIO clock signal isolated from other signals

Case #3: PHY is not integrated on SOM and a RMII PHY is used[edit | edit source]

This section refers to the case of

PHY not integrated on SOM
10/100 Ethernet PHY populate don carrier board and interfaced to SOM through RMII interface.

This solution is implemented for example in MayaEVB-Lite board.

Schematics[edit | edit source]

If possible, place series resistor to RMII interface signals
Properly decouple PHY Power Supplies rails
Properly separate analog Supply Rails
Properly decouple every supply pin of Ethernet PHY
Use a standard RMII PHY that supports correct clock mode (see SOM specification for further details)

PCB[edit | edit source]

Parameter for RMII interface	Min	Typ	Max
Reccomended Common mode impedance(ohm)	-	50	-
Gap between other signal	2xW		-

Since RMII signals are not critical such as RGMII, is not necessary a strong matching between signal
Avoid use of long traces
Avoid stubs
Keep as best as possibile the same routing for all RMII traces

Parameter for Ethernet Differential Pairs	Min	Typ	Max
Differential Impedance(ohm)	-	100	-
Common Mode Impedance	-	50	-
Gap than other TX and RX signals	2xgap	2xgap	-
Gap than other signals	2xgap	4xgap	-
Intra pair matching(mils)*	0	25	150
TX and RX via # mismatch*	0	0	1

* Not mandatory but recommended.

Ground and VCC planes must be as large as possible
Avoid plane split and voids
Place bypass capacitor near every PHY supply pin
Connect every capacitor's pin to the plane with at least 2 vias and the shortest trace pattern
Place PHY device at least 1" (25mm) distance far away connector
Keep MDIO clock signal isolated from other signals

USB[edit | edit source]

Schematics[edit | edit source]

Create schematic in accordance with DAVE Embedded Systems system-on-modules (SOM) USB specification ( see SOM detailed pages )

PCB[edit | edit source]

Parameter for USB Differential Pairs	Min	Typ	Max
Differential Impedance(ohm)	80	90	100
Common Mode Impedance	40,5	45	49.5
Gap than other signals	3xgap	5xgap	-
Intra pair matching(mils)	0	25	150
Max allowed stubs	-	-	0
Max traces length	-	-	note 1
Max allowed plane split under traces	-	-	0

note 1 see SOM detailed specifications

If a stub is unavoidable in the design, no stub should be greater than 200 mils.
Place a continuos reference plane underneath differential pair

HDMI[edit | edit source]

Schematics[edit | edit source]

Add a Transmitter Port Protection to HDMI lines
Use certified HDMI connector
Connector shield must be properly connected

PCB[edit | edit source]

Parameter for HDMI Differential Pairs	Min	Typ	Max
Differential Impedance(ohm)	85	100	115
Gap than other signals	3xgap	5xgap	-
Intra pair matching(mils) at 225MHz clock	0	20	250
Inter pair matching(mils) at 225MHz clock	0	250	1"
Max allowed stubs	-	-	0
Max allowed plane split under traces	-	-	0

Place a continuos reference plane underneath differential pair
Try to match lines as best as possible

SATA[edit | edit source]

Schematics[edit | edit source]

Use certified SATA connector

PCB[edit | edit source]

Parameter for SATA Differential Pairs	Min	Typ	Max
Differential Impedance(ohm)	80	100	120
Common Mode Impedance(ohm)	51	60	69
Gap than other signals	2xgap	-	-
Intra pair matching(mils	-	-	note 1
Inter pair matching(mils)	-	-	note 1
Max allowed stubs	-	-	0
Max allowed plane split under traces	-	-	0
Max allowed length	-	-	note 1

note 1 see SOM detailed specifications

Place a continuos reference plane underneath differential pair
Minimized vias use
No strong matching required between TX and RX, but keep same route for every differential pair

PCI Express[edit | edit source]

PCB[edit | edit source]

Parameter for PCI Express Differential Pairs	Min	Typ	Max
Differential Impedance [Ohm]	-	100	-
Common Mode Impedance [Ohm]	-	60	-
Gap than other signals (reccomended)	-	2xgap	-
Intra pair matching [mils]*	-	-	10
Max Total Length [in]*	-	-	12
Maximum allowed stub	-	-	0
Max allowed vias	-	-	6

* Including SoM trace length
Preferred underneath plane over entire trace length GND.

LVDS[edit | edit source]

PCB[edit | edit source]

Parameter for LVDS Differential Pairs	Min	Typ	Max
Differential Impedance [Ohm]	85	100	115
Common Mode Impedance [Ohm]	46.75	55	63.25
Gap than other signals (reccomended)	-	2xgap	-
Intra pair skew [mils]*	-	-	5
Inter pair skew [mils]**	-	400	-
Maximum allowed stub	-	-	0

Prefer to route traces on TOP layer, referring them to a continuos GND plane.
* Not includes SOM's length.
** Typical value can be relaxed depending on LVDS clock frequency

LCD Interface[edit | edit source]

Schematics[edit | edit source]

Please refer to DAVE Embedded Systems system-on-modules (SOM) carrier board documentationfor further information
Predispose series resistor terminator (RPACK for LCD data and single resistor for Clock and H-SYNC and V-SYNC)
Series resistor value may vary depending by PCB and schematic

PCB[edit | edit source]

If possible, use 50ohm common mode lines
Match LCD parallel signals in accordance with Pixel Clock frequency (further details in SOM specifications)
Avoid use of long traces connection (max 10" on PCB)
Avoid stubs

VIN Interface[edit | edit source]

Schematics[edit | edit source]

Please refer to DAVE Embedded Systems system-on-modules (SOM) carrier board documentation for further information
Predispose series resistor terminator (RPACK for LCD data and single resistor for Clock and H-SYNC and V-SYNC)
Series resistor value may vary depending PCB and schematic

PCB[edit | edit source]

If possible, use 50ohm common mode lines
Match VIN parallel signals in accordance with Pixel Clock frequency (further details in SOM specifications)
Avoid use of long traces connection (max 10" on PCB)
Avoid stubs

TVOUT[edit | edit source]

Schematics[edit | edit source]

Please refer to DAVE Embedded Systems system-on-modules (SOM) carrier board documentation for further information

PCB[edit | edit source]

Parameter for SATA Differential Pairs	Min	Typ	Max
Common Mode Impedance(ohm)	-	75	-
Gap than other signals	2xwidth	-	-

Keep analog TVOUT signal far from noise signals

I2C Interface[edit | edit source]

Schematics[edit | edit source]

Predispose properly pullup resistors on line in accordance with DAVE Embedded Systems system-on-modules (SOM)
Do not overload I2C lines with too much devices
Ensure that I2C devices are being properly initialized during power up

PCB[edit | edit source]

Isolate I2C clock from noise sensitive signals
Avoid stub

SD/MMC Interface[edit | edit source]

	Min	Typ	Max
Common Mode impedance SOM(ohm)	-	50	60
Matching required*	-	-	-
Max allowed parallel routing(mils)	-	-	1000
Max trace Length**	-	-	-
Max # of vias allowed	-	-	-

*This is not mandatory, however it is suggested in case trace length exceeds 10cm

**Overall trace length - i.e. Bora + carrier board - should not exceed 10cm. If this is not possible, try to avoid parallel routing in order to reduce crosstalk, and refer them to a ground plane.

CAN Interface[edit | edit source]

	Min	Typ	Max
Differential Mode impedance(ohm)	108	120	132
Matching required	-	-	-
Min Interpair spacing	-	4xgap	-
Max allowed parallel routing(mils)	-	-	-
Max trace Length	-	-	-
Max via allowed	-	-	-

Functional guidelines[edit | edit source]

Sudden power off management[edit | edit source]

From the architectural standpoint, modern embedded systems often resemble traditional PCs. For example:

they implement a rich set of I/O interfaces (large displays, Ethernet ports, USB ports, SDIO sockets etc.)
they likely run complex operating systems that derive from desktop world (linux, Android, Windows CE etc.)
they implement complex storage schemes (raw NAND, SSD, eMMC etc.).

One of the main difference between such systems and PCs is that the formers are - if appropriately designed - inherently resilient to sudden power fails. In any case, system designer should take into account these events and decide if and how manage them explicitly. Here are some typical techniques used to deal with this situation:

in case the system is used by human operators, the use of clean shutdown - triggered by the user himself - should be encouraged to prevent sudden power off. Technically speaking, this can be done via GUI (soft button) or mechanical device (push buttons and alike). In the latter case, push button controllers such as Linear LTC2954 can be very useful to implement this feature
in case no human operators interact with the system, more complex solutions might be required. This strategy is strongly dependent on hardware characteristics of SOM and must be approached on a case-by-case basis.

Thermal Management[edit | edit source]

Heat is generated by all semiconductors while operating and it is dissipated into the surrounding environment. This amount of heat is a function of the power consumed and the thermal resistance of the device package. Every silicon device on an electronic board must work within the limits of its operating temperature parameters (eg, the junction temperature) as specified by the silicon vendor.

Failure to maintain the temperature within safe ranges reduces operating lifetime, reliability, and performances and may cause irreversible damage to the system. Therefore, the product design cycle should include thermal analysis to verify that the device works within its functional limits. If the temperature is too high, component or system-level thermal enhancements are required to dissipate the heat from the system.

For detailed information, please refer to the following documents:

Integration guide[edit | edit source]

This page provides useful information and resources to system designers in order to integrate Bora SoMs in his/her application quickly. These information complement SoM-independent recommendations provided in the Carrier board design guidelines (SOM) page.

Several topics are covered, ranging from hardware issues to manufacturing aspects.

Advanced routing and carrier board design guidelines[edit | edit source]

Generally speaking, when designing a system-on-module (SoM) product it is impossible to know in advance the combination of interfaces and functionalities that will be implemented by the system integrator. This is even more true in case of Bora, due to the unprecedented flexibility and versatility of Zynq architecture. For this reason, Bora implements advanced routing schemes that, in combination with proper carrier board design, allow the implementation of high-speed complex interfaces that satisfy signal integrity requirements.

This chapter describes in detail such schemes and provides carrier board design guidelines accordingly.

In the following section the terms "Inter-pair matching" and "Intra-pair matching" are used. They indicate respectively:

length matching among pairs belonging to the same class or group
length matching between traces belonging to the same pair.

Suggested PCB specifications[edit | edit source]

	Min.	Typ.
Layers(number)	4	6
GND Plane Layers	1	2
Power Plane Layers	1	1
Vias hole (mechanical)* [mm]	0.3	-

*Smaller holes are deprecated because their limited current capacity and heat dissipation.

Power rails[edit | edit source]

Following power rails should be kept as short as possible and should be sized in order to minimize IR drop at maximum estimated current.

	Max estimated current	Required plane or copper areas
3.3V_SOM	application dependent	YES
VDDIO_BANK35	application dependent	NO
VDDIO_BANK13	application dependent	NO

Main SD/MMC interface[edit | edit source]

Signals: PS_MIO40_501, PS_MIO41_501, PS_MIO42_501, PS_MIO43_501, PS_MIO44_501, PS_MIO45_501.

Following table details routing rules implemented on Bora SoM.

	Value	UOM
Common Mode impedance	50	Ohm
Maximum Length Tolerance	200	mils

Main Gigabit Ethernet interface (ETH0)[edit | edit source]

Signals: ETH_TXRX0_P/ETH_TXRX0_M, ETH_TXRX1_P/ETH_TXRX1_M, ETH_TXRX2_P/ETH_TXRX2_M, ETH_TXRX3_P/ETH_TXRX3_M.

Following table details routing rules implemented on Bora SoM.

	Value	UOM
Common Mode impedance SOM	55	Ohm
Differential Mode impedance SOM	100	Ohm
Maximum Length Tolerance on SOM(intrapair)	10	mils
Maximum Length Tolerance on SOM(interpair)	400	mils

CAN interface[edit | edit source]

Signals: CAN_H/CAN_L.

Following table details routing rules implemented on Bora SoM.

	Value	UOM
Common Mode impedance SOM	-	Ohm
Differential Mode impedance SOM	110	Ohm
Maximum Length Tolerance on SOM(intrapair)	-	mils
Maximum Length Tolerance on SOM(interpair)	-	mils

XADC interface[edit | edit source]

Signals XADC_VP_R/XADC_VN_R (dedicated analog inputs).

Following table details routing rules implemented on Bora SoM.

	Value	UOM
Differential Mode impedance typ	100	Ohm
Maximum Length Tolerance on SOM(intrapair)	-	mils
Maximum Length Tolerance on SOM(interpair)	-	mils
Intrapair Matching required	10

Connecting the PUDC_B pin[edit | edit source]

On Bora SOM, PUDC_B pin is (J2 connector, pin 15) connected to VDDIO_BANK34 (3.3V) via 10K resistor, thus internal pull-up resistors are disabled on each SelectIO pin, until FPGA configuration completes.

Default behavior can be changed by appropriate circuitry at carrier board level to set it to logical 0.

PS' I²C buses[edit | edit source]

Xilinx released an important Answer Record related to Zynq PS I2C Controller on 19th September 2014 (http://www.xilinx.com/support/answers/61861.html), a long period after Bora public lunch.

A technical and functional assessment has been performed to find out the best solution to cope with this issue on Bora based systems (1). Bora SoM is conceived to address a wide range of different application environments that are by definition unknown at design stage. Therefore it is virtually impossible to find a one-size-fits-all solution that does not limit somehow Bora functionalities and is backward compatible. The followed approach has aimed to preserve:

system reliability
backward compatibility
system designer's freedom to choose the appropriate solution for his/her specific application.

Thanks to the Bora's I2C0 topology, Bora has undergone no changes to satisfy these requirements. The SoM in fact allows for:

implementing, at carrier board level, complex glitch filtering strategies such as the one suggested by Xilinx AR# 61861
avoiding waste of resources of PL if not strictly necessary (for instance when I2C0 functionality is not required at all).

The configuration depicted by the following figure shows in principle a solution integrating the workaround suggested by Xilinx AR# 61861:

PS I2C0 controller's signals are routed to PL via EMIO routing
MIO46/47 are disabled
glitch filter is digitally implemented in PL
I2C0 SDA and SCL lines are physically connected to PL at carrier board level.

(1) What here described refers to I2C0 controller that by default is routed on pins MIO46 and MIO47.

How to implement workaround suggested by Xilinx on BoraEVB[edit | edit source]

Plase note that the reference project with I2C glitch filter implemented in FPGA is available on request. Plase contact helpdesk@dave.eu

This project, built with Vivado 2014.4, is based on the default project for BELK (BORA rev.B and BORAevb rev.A).

Here we have changed I2C0 signals routing to EMIO pins through FPGA, implementing the I2C glitch filter with VHDL example code provided in Xilinx AR# 61861. The MIO46-MIO47 is then configured as input GPIO. This is accomplished from the FSBL generated within the provided project.

I2C interface is routed through FPGA to pins on BANK35:

I2C SCL => IO_L9P_T1_DQS_AD3P_35
I2C SDA => IO_L9N_T1_DQS_AD3N_35

The BANK35 MUST be powered at 1.8V

Test on BoraEVB[edit | edit source]

To test the solution, please make these connections on BORAevb rev.A:

1.8V supply for BANK35 : (J11.2 to J11.7)
I2C SCL : JP10.14 to JP21.5
I2C SDA : JP10.16 to JP21.3

Test on BoraXEVB[edit | edit source]

To test the solution, please make these connections on BoraXEVB:

1.8V supply for BANK35 : please refer to VDDIO_BANK35 possibility on BoraXEVB schematics
populate RPACK RP87
I2C SCL : JP30.9 to JP29.5
I2C SDA : JP30.11 to JP29.3

Programmable logic (PL)[edit | edit source]

For Bora SOM please refer to the following links:

For BoraX SOM please refer to the page.

For BoraLite SOM please refer to the page.

Traces length matching[edit | edit source]

A spreadsheet is available for download here, containing detailed information about signals routing. These information can be used to check nets matching of the overall system (carrier board + SOM).

For Bora/BoraEVB systems: File:Bora-routing.zip.

For BoraX/BoraXEVB systems: File:BoraX-BoraXEVB-combined-routing.zip.

For BoraLite/BoraXEVB systems: the presence of the Bora Lite adapter does not make sense to provide the routing information. Please refer to the Programmable logic page about information on internal BORA Lite routing. Please take carefully into account the design of the Carrier board considering every information related to the SO-DIMM socket and the tracenet on the Carrier

General Information[edit | edit source]

Product Highlights[edit | edit source]

The BORA Xpress SOM Evaluation platform presented here provides a compact solution for any industry and can be easily interfaced with Digital signal Processing application, Plant Automation Control thanks to IEC-61131 SW language environment and/or other GUI QT framework.

The following table summarizes the main hardware and software features available with BORA Xpress SOM EVB:

Hardware[edit | edit source]

Subsystem	Characteristics
CPU	Zynq 7000 Dual Core Cortex-A9 and Artix-7 FPGA
SD	microSD boot device
USB	OTG
Serial Ports	RS232 CAN interface
Ethernet0	Dual EMAC 10/100/1000Mbps
Ethernet1	Dual EMAC 10/100/1000Mbps (routed through EMIO)
Memory	External DDR3 SDRAM bank
Display	LVDS interface
Touchscreen	Resistive
Espansion	GPIO connector Digilent Pmod™ Compatible connector
WiFi	Socket for DWM Wireless Module
JTAG	JTAG and TRACE ports
PSU	12 to 24V DC

Software[edit | edit source]

Subsystem	Options
Operating System	Linux
Distribution	Yocto, Petalinux
Applications	SoftPLC

Block Diagram[edit | edit source]

The following picture shows BORA Xpress EVB block diagram:

BoraXEVB simplified block diagram

Configurable routing options[edit | edit source]

FPGA banks #12, #34 and #35 supports different routing options as shown in the following picture.

For a detailed description of FMC connector routing, please refer to this section.

BoraX[edit | edit source]

Configurable routing options diagram

Bora Lite[edit | edit source]

Configurable routing options diagram for BoraLite SoM

Interfaces and Connectors[edit | edit source]

Power Supply[edit | edit source]

Power supply - JP2[edit | edit source]

Power is provided through the JP2 connector.

JP2 connector is a standard 2.1mm/5.5mm DC power jack with positive center pin

Pin#	Pin name	Function	Notes
1	VIN	Power supply	Nominal: +12V
2 , 3	DGND	Ground	-

Voltage selections[edit | edit source]

PL's I/O banks voltage can be selected via configuration jumpers. It is worth remembering that:

each bank must be powered even if none of its I/Os is used
voltage selection must be done before powering up the board.

The following table recaps the characteristics of the PL's I/O banks, in terms of allowable power supplies.

SoM	Zynq p/n	Bank #34		Bank #13		Bank #35
SoM	Zynq p/n	Type [1]	I/O voltage setting	Type [1]	I/O voltage setting	Type [1]	I/O voltage setting
BoraX	7015 (CLG485 package)	HR (1.2 - 3.3V)	User defined	HR (1.2 - 3.3V)	User defined	HR (1.2 - 3.3V)	User defined
BoraX	7030 (SBG485 package)	HP (1.2 - 1.8V)	User defined	HR (1.2 - 3.3V)	User defined	HP (1.2 - 1.8V)	User defined
Bora Lite	7007S/7010 (CLG400 package)	HR (1.2 - 3.3V)	User defined	HR (1.2 - 3.3V)	User defined	HR (1.2 - 3.3V)	User defined
Bora Lite	7014S/7020 (CLG400 package)	HR (1.2 - 3.3V)	User defined	HR (1.2 - 3.3V)	User defined	HR (1.2 - 3.3V)	User defined

[1]

HR = High Range
HP = High Performance

BoraXEVB voltage selection jumpers[edit | edit source]

BoraXEVB provides several configuration jumpers that allow to easily select the voltages used for PL's I/O banks. The following tables lists some of the allowed combinations used to select the most common voltage values. There are other combination available. However, some of them are not allowed and may cause permanent hardware damages to the Zynq part.

Since characteristics of PL's I/O banks differ between Zynq 7015 and 7030 parts, the valid combinations are not the same for all of the BoraX models. Please refer to the following sections for more details.

Even if PL's banks are independent, default configuration of BoraXEVB is such that

bank 34 and bank 35 have the same supply voltage
this voltage is selected via JP28.

This configuration is in accordance with default routing of signals used for FMC connector.

Examples of valid combinations for Zynq 7030-based SOMs (default option for BXELK)[edit | edit source]

Bank #13 (HR)
Nominal voltage [V]	JP25.1-2	JP25.3-4	JP25.5-6	JP25.7-8	JP25.9-10	JP25.11-12
1.2	open	open	closed	closed	closed	open
1.5	open	closed	open	closed	open	open
1.8	open	closed	closed	open	closed	open
2.5	closed	open	closed	open	open	open
3.3	closed	closed	closed	open	open	open

Bank #35 (HP)
Nominal voltage [V]	JP27.1-2	JP27.3-4	JP27.5-6	JP27.7-8	JP27.9-10	JP27.11-12
1.2	open	open	closed	closed	closed	open
1.5	open	closed	open	closed	open	open
1.8	open	closed	closed	open	closed	open

Bank #34 (HP)
Nominal voltage [V]	JP28.1-2	JP28.3-4	JP28.5-6	JP28.7-8	JP28.9-10	JP28.11-12
1.2	open	open	open	open	closed	open
1.5	open	open	open	closed	open	open
1.8	open	open	closed	open	open	open

Examples of valid combinations for Zynq 7015-based SOMs[edit | edit source]

Bank #13 (HR)
Nominal voltage [V]	JP25.1-2	JP25.3-4	JP25.5-6	JP25.7-8	JP25.9-10	JP25.11-12
1.2	open	open	closed	closed	closed	open
1.5	open	closed	open	closed	open	open
1.8	open	closed	closed	open	closed	open
2.5	closed	open	closed	open	open	open
3.3	closed	closed	closed	open	open	open

Bank #35 (HR)
Nominal voltage [V]	JP27.1-2	JP27.3-4	JP27.5-6	JP27.7-8	JP27.9-10	JP27.11-12
1.2	open	open	closed	closed	closed	open
1.5	open	closed	open	closed	open	open
1.8	open	closed	closed	open	closed	open
2.5	closed	open	closed	open	open	open
3.3	closed	closed	closed	open	open	open

Bank #34 (HR)
Nominal voltage [V]	JP28.1-2	JP28.3-4	JP28.5-6	JP28.7-8	JP28.9-10	JP28.11-12
1.2	open	open	open	open	closed	open
1.5	open	open	open	closed	open	open
1.8	open	open	closed	open	open	open
2.5	open	closed	open	open	open	open
3.3	closed	open	open	open	open	open

Advanced information about voltage selection connectors[edit | edit source]

Bank 13 VDDIO selection connector (JP25)[edit | edit source]

JP25 is a 12-pin 6x2x2.54 pitch vertical header used for the selection - through jumpers - of the bank supply voltages. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
2	LDO_B13_1V6	adds +1.6V to VDDIO_BANK13	-
4	LDO_B13_800mV	adds +800mV to VDDIO_BANK13	-
6	LDO_B13_400mV	adds +400mV to VDDIO_BANK13	-
8	LDO_B13_200mV	adds +200mV to VDDIO_BANK13	-
10	LDO_B13_100mV	adds +100mV to VDDIO_BANK13	-
12	LDO_B13_50mV	adds +50mV to VDDIO_BANK13	-
1, 3, 5, 7, 9, 11	DGND	-	-

The jumper configurations are:

No jumpers installed -> DC output for VDDIO_BANK13 is 500mV
Jumper on 1-2 -> adds 1.6V to VDDIO_BANK13 above the default 500mV
Jumper on 3-4 -> adds 800mV to VDDIO_BANK13 above the default 500mV
Jumper on 5-6 -> adds 400mV to VDDIO_BANK13 above the default 500mV
Jumper on 7-8 -> adds 200mV to VDDIO_BANK13 above the default 500mV
Jumper on 9-10 -> adds 100mV to VDDIO_BANK13 above the default 500mV
Jumper on 11-12 -> adds 50mV to VDDIO_BANK13 above the default 500mV

The default configuration is VDDIO_BANK13 @ 1.8V (500mV + 800mV + 400mV + 100mV):

Jumper on 3-4 -> adds 800mV to VDDIO_BANK13 above the default 500mV
Jumper on 5-6 -> adds 400mV to VDDIO_BANK13
Jumper on 9-10 -> adds 100mV to VDDIO_BANK13

Bank 35 VDDIO selection connector (JP27)[edit | edit source]

JP27 is a 12-pin 6x2x2.54 pitch vertical header used for the selection - through jumpers - of the bank supply voltages. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
2	LDO_B35_1V6	adds +1.6V to VDDIO_BANK35	-
4	LDO_B35_800mV	adds +800mV to VDDIO_BANK35	-
6	LDO_B35_400mV	adds +400mV to VDDIO_BANK35	-
8	LDO_B35_200mV	adds +200mV to VDDIO_BANK35	-
10	LDO_B35_100mV	adds +100mV to VDDIO_BANK35	-
12	LDO_B35_50mV	adds +50mV to VDDIO_BANK35	-
1, 3, 5, 7, 9, 11	DGND	-	-

The jumper configurations are:

No jumpers installed -> DC output for VDDIO_BANK35 is 500mV
Jumper on 1-2 -> adds 1.6V to VDDIO_BANK35 above the default 500mV
Jumper on 3-4 -> adds 800mV to VDDIO_BANK35 above the default 500mV
Jumper on 5-6 -> adds 400mV to VDDIO_BANK35 above the default 500mV
Jumper on 7-8 -> adds 200mV to VDDIO_BANK35 above the default 500mV
Jumper on 9-10 -> adds 100mV to VDDIO_BANK35 above the default 500mV
Jumper on 11-12 -> adds 50mV to VDDIO_BANK35 above the default 500mV

The DEFAULT configuration is VDDIO_BANK35 @ 1.8V (500mV + 800mV + 400mV + 100mV):

Jumper on 3-4 -> adds 800mV to VDDIO_BANK35 above the default 500mV
Jumper on 5-6 -> adds 400mV to VDDIO_BANK35
Jumper on 9-10 -> adds 100mV to VDDIO_BANK35

Please note that by default VDDIO_BANK35 is supplied by VADJ Regulator. For using a dedicated VDDIO_BANK35, it is required to remove R343 and mount R344: check BORA Xpress Evaluation Kit schematics page 10.
Then, check and/or properly configure JP27 for selecting the required VDDIO_BANK35

Bank 34 and VADJ VDDIO selection connector (JP28)[edit | edit source]

JP28 is a 12-pin 6x2x2.54 pitch vertical header used for the selection - through jumpers - of the bank supply voltages. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
2	VADJ_FB (22K)	selects 3.3V VADJ	-
4	VADJ_FB (30K9)	selects 2.5V VADJ	-
6	VADJ_FB (51K1)	selects 1.8V VADJ	-
8	VADJ_FB (68K)	selects 1.5V VADJ	-
10	VADJ_FB (100K)	selects 1.2V VADJ	-
12	RFU	Reserved	-
1, 3, 5, 7, 9, 11	DGND	-	-

The jumper configurations are:

Jumper on 1-2 -> supply VADJ with 3.3V
Jumper on 3-4 -> supply VADJ with 2.5V
Jumper on 5-6 -> supply VADJ with 1.8V
Jumper on 7-8 -> supply VADJ with 1.5V
Jumper on 9-10 -> supply VADJ with 1.2V

The default configuration is:

Jumper on 5-6 -> supply VADJ with 1.8V

CPU connectors[edit | edit source]

J1,J2 and J3[edit | edit source]

The pinout of the J1, J2 and J3 connectors of the Bora Xpress EVB is the same of the counterpart connectors on BORA Xpress module.

FMC[edit | edit source]

FPGA Mezzanine Card (FMC) Connector - J27[edit | edit source]

J27 is a 400 pins ANSI/VITA 57.1-2008 FPGA Mezzanine Card Connector that allows to connect to standard I/O mezzanine cards.

Please note that BoraXpress EVB FMC Connector is:

fully compliant to FMC LPC
partially compliant to FMC HPC because HPC side is not fully populated.

The following tables detail how BORA Xpress signals have been routed to FMC connector. At this link a spreadsheet providing the same information is available for download.

For more information about I/O voltage of single-ended signals available on FMC connector, please refer to this section.

HPC Row A[edit | edit source]

Pin#	Pin name	Function
A1	DGND	GND
A2	MGTxRXP1	DP1_M2C_P
A3	MGTxRXN1	DP1_M2C_N
A4	DGND	GND
A5	DGND	GND
A6	MGTxRXP2	DP2_M2C_P
A7	MGTxRXN2	DP2_M2C_N
A8	DGND	GND
A9	DGND	GND
A10	MGTxRXP3	DP3_M2C_P
A11	MGTxRXN3	DP3_M2C_N
A12	DGND	GND
A13	DGND	GND
A14	not connected	DP4_M2C_P
A15	not connected	DP4_M2C_N
A16	DGND	GND
A17	DGND	GND
A18	not connected	DP5_M2C_P
A19	not connected	DP5_M2C_N
A20	DGND	GND
A21	DGND	GND
A22	MGTxTXP1	DP1_C2M_P
A23	MGTxTXN1	DP1_C2M_N
A24	DGND	GND
A25	DGND	GND
A26	MGTxTXP2	DP2_C2M_P
A27	MGTxTXN2	DP2_C2M_N
A28	DGND	GND
A29	DGND	GND
A30	MGTxTXP3	DP3_C2M_P
A31	MGTxTXN3	DP3_C2M_N
A32	DGND	GND
A33	DGND	GND
A34	not connected	DP4_C2M_P
A35	not connected	DP4_C2M_N
A36	DGND	GND
A37	DGND	GND
A38	not connected	DP5_C2M_P
A39	not connected	DP5_C2M_N
A40	DGND	GND

HPC Row B[edit | edit source]

Pin#	Pin name	Function
B1	RSVD	RES1
B2	DGND	GND
B3	DGND	GND
B4	not connected	DP9_M2C_P
B5	not connected	DP9_M2C_N
B6	DGND	GND
B7	DGND	GND
B8	not connected	DP8_M2C_P
B9	not connected	DP8_M2C_N
B10	DGND	GND
B11	DGND	GND
B12	not connected	DP7_M2C_P
B13	not connected	DP7_M2C_N
B14	DGND	GND
B15	DGND	GND
B16	not connected	DP6_M2C_P
B17	not connected	DP6_M2C_N
B18	DGND	GND
B19	DGND	GND
B20	MGTREFCLK1P	GBTCLK1_M2C_P
B21	MGTREFCLK1N	GBTCLK1_M2C_N
B22	DGND	GND
B23	DGND	GND
B24	not connected	DP9_C2M_P
B25	not connected	DP9_C2M_N
B26	DGND	GND
B27	DGND	GND
B28	not connected	DP8_C2M_P
B29	not connected	DP8_C2M_N
B30	DGND	GND
B31	DGND	GND
B32	not connected	DP7_C2M_P
B33	not connected	DP7_C2M_N
B34	DGND	GND
B35	DGND	GND
B36	not connected	DP6_C2M_P
B37	not connected	DP6_C2M_N
B38	DGND	GND
B39	DGND	GND
B40	RSVD	RES0

LPC Row C[edit | edit source]

Pin#	Pin name	Function
C1	DGND	GND
C2	MGTxTXP0	DP0_C2M_P
C3	MGTxTXN0	DP0_C2M_N
C4	DGND	GND
C5	DGND	GND
C6	MGTxRXP0	DP0_M2C_P
C7	MGTxRXN0	DP0_M2C_N
C8	DGND	GND
C9	DGND	GND
C10	IO_L23P_T3_34	LA06_P
C11	IO_L23N_T3_34	LA06_N
C12	DGND	GND
C13	DGND	GND
C14	IO_L2P_T0_34	LA10_P
C15	IO_L2N_T0_34	LA10_N
C16	DGND	GND
C17	DGND	GND
C18	IO_L1P_T0_34	LA14_P
C19	IO_L1N_T0_34	LA14_N
C20	DGND	GND
C21	DGND	GND
C22	IO_L16P_T2_34	LA18_P_CC
C23	IO_L16N_T2_34	LA18_N_CC
C24	DGND	GND
C25	DGND	GND
C26	IO_L6P_T0_35	LA27_P
C27	IO_L6N_T0_VREF_35	LA27_N
C28	DGND	GND
C29	DGND	GND
C30	I2C0_SCL	SCL
C31	I2C0_SDA	SDA
C32	DGND	GND
C33	DGND	GND
C34	GA0	GA0
C35	FMC_12P0V	12P0V
C36	DGND	GND
C37	FMC_12P0V	12P0V
C38	DGND	GND
C39	FMC_3P3V	3P3V
C40	DGND	GND

LPC Row D[edit | edit source]

Pin#	Pin name	Function
D1	IO_25_VRP_34	PG_C2M
D2	DGND	GND
D3	DGND	GND
D4	MGTREFCLK0P	GBTCLK0_M2C_P
D5	MGTREFCLK0N	GBTCLK0_M2C_N
D6	DGND	GND
D7	DGND	GND
D8	IO_L14P_T2_SRCC_34	LA01_P_CC
D9	IO_L14N_T2_SRCC_34	LA01_N_CC
D10	DGND	GND
D11	IO_L9P_T1_DQS_34	LA05_P
D12	IO_L9N_T1_DQS_34	LA05_N
D13	DGND	GND
D14	IO_L6P_T0_34	LA09_P
D15	IO_L6N_T0_VREF_34	LA09_N
D16	DGND	GND
D17	IO_L20P_T3_34	LA13_P
D18	IO_L20N_T3_34	LA13_N
D19	DGND	GND
D20	IO_L15P_T2_DQS_34	LA17_P_CC
D21	IO_L15N_T2_DQS_34	LA17_N_CC
D22	DGND	GND
D23	IO_L2P_T0_AD8P_35	LA23_P
D24	IO_L2N_T0_AD8N_35	LA23_N
D25	DGND	GND
D26	IO_L5P_T0_AD9P_35	LA26_P
D27	IO_L5N_T0_AD9N_35	LA26_N
D28	DGND	GND
D29	JTAG_TCK	TCK
D30	JTAG_TDI	TDI
D31	FMC_TDO_ZYNQ_TDI	TDO
D32	FMC_3P3VAUX	3P3VAUX
D33	JTAG_TMS	TMS
D34	JTAG_TRSTn	TRST_L
D35	GA0	GA1
D36	FMC_3P3V	3P3V
D37	DGND	GND
D38	FMC_3P3V	3P3V
D39	DGND	GND
D40	FMC_3P3V	3P3V

HPC Row E[edit | edit source]

Pin#	Pin name	Function
E1	DGND	GND
E2	IO_L14P_T2_AD4P_SRCC_35	HA01_P_CC
E3	IO_L14N_T2_AD4N_SRCC_35	HA01_N_CC
E4	DGND	GND
E5	DGND	GND
E6	IO_L20P_T3_AD6P_35	HA05_P
E7	IO_L20N_T3_AD6N_35	HA05_N
E8	DGND	GND
E9	IO_L24P_T3_AD15P_35	HA09_P
E10	IO_L24N_T3_AD15N_35	HA09_N
E11	DGND	GND
E12	not connected	HA13_P
E13	not connected	HA13_N
E14	DGND	GND
E15	not connected	HA16_P
E16	not connected	HA16_N
E17	DGND	GND
E18	not connected	HA20_P
E19	not connected	HA20_N
E20	DGND	GND
E21	not connected	HB03_P
E22	not connected	HB03_N
E23	DGND	GND
E24	not connected	HB05_P
E25	not connected	HB05_N
E26	DGND	GND
E27	not connected	HB09_P
E28	not connected	HB09_N
E29	DGND	GND
E30	not connected	HB13_P
E31	not connected	HB13_N
E32	DGND	GND
E33	not connected	HB19_P
E34	not connected	HB19_N
E35	DGND	GND
E36	not connected	HB21_P
E37	not connected	HB21_N
E38	DGND	GND
E39	FMC_VADJ	VADJ
E40	DGND	GND

HPC Row F[edit | edit source]

Pin#	Pin name	Function
F1	IO_0_VRN_35	PG_M2C
F2	DGND	GND
F3	DGND	GND
F4	IO_L13P_T2_MRCC_35	HA00_P_CC
F5	IO_L13N_T2_MRCC_35	HA00_N_CC
F6	DGND	GND
F7	IO_L19P_T3_35	HA04_P
F8	IO_L19N_T3_VREF_35	HA04_N
F9	DGND	GND
F10	IO_L23P_T3_35	HA08_P
F11	IO_L23N_T3_35	HA08_N
F12	DGND	GND
F13	not connected	HA12_P
F14	not connected	HA12_N
F15	DGND	GND
F16	not connected	HA15_P
F17	not connected	HA15_N
F18	DGND	GND
F19	not connected	HA19_P
F20	not connected	HA19_N
F21	DGND	GND
F22	not connected	HB02_P
F23	not connected	HB02_N
F24	DGND	GND
F25	not connected	HB04_P
F26	not connected	HB04_N
F27	DGND	GND
F28	not connected	HB08_P
F29	not connected	HB08_N
F30	DGND	GND
F31	not connected	HB12_P
F32	not connected	HB12_N
F33	DGND	GND
F34	not connected	HB16_P
F35	not connected	HB16_N
F36	DGND	GND
F37	not connected	HB20_P
F38	not connected	HB20_N
F39	DGND	GND
F40	FMC_VADJ	VADJ

LPC Row G[edit | edit source]

Pin#	Pin name	Function
G1	DGND	GND
G2	IO_L11P_T1_SRCC_34	CLK0_C2M_P
G3	IO_L11N_T1_SRCC_34	CLK0_C2M_N
G4	DGND	GND
G5	DGND	GND
G6	IO_L13P_T1_MRCC_34	LA00_P_CC
G7	IO_L13N_T1_MRCC_34	LA00_N_CC
G8	DGND	GND
G9	IO_L4P_T0_34	LA03_P
G10	IO_L4N_T0_34	LA03_N
G11	DGND	GND
G12	IO_L3P_T0_DQS_PUDC_B_34	LA08_P
G13	IO_L3N_T0_DQS_34	LA08_N
G14	DGND	GND
G15	IO_L22P_T3_34	LA12_P
G16	IO_L22N_T3_34	LA12_N
G17	DGND	GND
G18	IO_L19P_T3_34	LA16_P
G19	IO_L19N_T3_VREF_34	LA16_N
G20	DGND	GND
G21	IO_L17P_T2_34	LA20_P
G22	IO_L17N_T2_34	LA20_N
G23	DGND	GND
G24	IO_L1P_T0_AD0P_35	LA22_P
G25	IO_L1N_T0_AD0N_35	LA22_N
G26	DGND	GND
G27	IO_L4P_T0_35	LA25_P
G28	IO_L4N_T0_35	LA25_N
G29	DGND	GND
G30	IO_L8P_T1_AD10P_35	LA29_P
G31	IO_L8N_T1_AD10N_35	LA29_N
G32	DGND	GND
G33	IO_L10P_T1_AD11P_35	LA31_P
G34	IO_L10N_T1_AD11N_35	LA31_N
G35	DGND	GND
G36	IO_L16P_T2_35	LA33_P
G37	IO_L16N_T2_35	LA33_N
G38	DGND	GND
G39	FMC_VADJ	VADJ
G40	DGND	GND

LPC Row H[edit | edit source]

Pin#	Pin name	Function
H1	FMC_VREF_A_M2C	VREF_A_M2C
H2	FMC_PRSNT_M2C_L	PRSNT_M2C_L
H3	DGND	GND
H4	IO_L12P_T1_MRCC_34	CLK0_M2C_P
H5	IO_L12N_T1_MRCC_34	CLK0_M2C_N
H6	DGND	GND
H7	IO_L7P_T1_34	LA02_P
H8	IO_L7N_T1_34	LA02_N
H9	DGND	GND
H10	IO_L5P_T0_34	LA04_P
H11	IO_L5N_T0_34	LA04_N
H12	DGND	GND
H13	IO_L8P_T1_34	LA07_P
H14	IO_L8N_T1_34	LA07_N
H15	DGND	GND
H16	IO_L21P_T3_DQS_34	LA11_P
H17	IO_L21N_T3_DQS_34	LA11_N
H18	DGND	GND
H19	IO_L18P_T2_34	LA15_P
H20	IO_L18N_T2_34	LA15_N
H21	DGND	GND
H22	IO_L24P_T3_34	LA19_P
H23	IO_L24N_T3_34	LA19_N
H24	DGND	GND
H25	IO_L10P_T1_34	LA21_P
H26	IO_L10N_T1_34	LA21_N
H27	DGND	GND
H28	IO_L3P_T0_DQS_AD1P_35	LA24_P
H29	IO_L3N_T0_DQS_AD1N_35	LA24_N
H30	DGND	GND
H31	IO_L7P_T1_AD2P_35	LA28_P
H32	IO_L7N_T1_AD2N_35	LA28_N
H33	DGND	GND
H34	IO_L9P_T1_DQS_AD3P_35	LA30_P
H35	IO_L9N_T1_DQS_AD3N_35	LA30_N
H36	DGND	GND
H37	IO_L15P_T2_DQS_AD12P_35	LA32_P
H38	IO_L15N_T2_DQS_AD12N_35	LA32_N
H39	DGND	GND
H40	FMC_VADJ	VADJ

HPC Row J[edit | edit source]

Pin#	Pin name	Function
J1	DGND	GND
J2	IO_L11P_T1_SRCC_35	CLK1_C2M_P
J3	IO_L11N_T1_SRCC_35	CLK1_C2M_N
J4	DGND	GND
J5	DGND	GND
J6	IO_L18P_T2_AD13P_35	HA03_P
J7	IO_L18N_T2_AD13N_35	HA03_N
J8	DGND	GND
J9	IO_L22P_T3_AD7P_35	HA07_P
J10	IO_L22N_T3_AD7N_35	HA07_N
J11	DGND	GND
J12	not connected	HA11_P
J13	not connected	HA11_N
J14	DGND	GND
J15	not connected	HA14_P
J16	not connected	HA14_N
J17	DGND	GND
J18	not connected	HA18_P
J19	not connected	HA18_N
J20	DGND	GND
J21	not connected	HA22_P
J22	not connected	HA22_N
J23	DGND	GND
J24	not connected	HB01_P
J25	not connected	HB01_N
J26	DGND	GND
J27	not connected	HB07_P
J28	not connected	HB07_N
J29	DGND	GND
J30	not connected	HB11_P
J31	not connected	HB11_N
J32	DGND	GND
J33	not connected	HB15_P
J34	not connected	HB15_N
J35	DGND	GND
J36	not connected	HB18_P
J37	not connected	HB18_N
J38	DGND	GND
J39	not connected	VIO_B_M2C
J40	DGND	GND

HPC Row K[edit | edit source]

Pin#	Pin name	Function
K1	not connected	VREF_B_M2C
K2	DGND	GND
K3	DGND	GND
K4	IO_L12P_T1_MRCC_35	CLK1_M2C_P
K5	IO_L12N_T1_MRCC_35	CLK1_M2C_N
K6	DGND	GND
K7	IO_L17P_T2_AD5P_35	HA02_P
K8	IO_L17N_T2_AD5N_35	HA02_N
K9	DGND	GND
K10	IO_L21P_T3_DQS_AD14P_35	HA06_P
K11	IO_L21N_T3_DQS_AD14N_35	HA06_N
K12	DGND	GND
K13	IO_25_VRP_35	HA10_P
K14	not connected	HA10_N
K15	DGND	GND
K16	not connected	HA17_P_CC
K17	not connected	HA17_N_CC
K18	DGND	GND
K19	not connected	HA21_P
K20	not connected	HA21_N
K21	DGND	GND
K22	not connected	HA23_P
K23	not connected	HA23_N
K24	DGND	GND
K25	not connected	HB00_P_CC
K26	not connected	HB00_N_CC
K27	DGND	GND
K28	not connected	HB06_P_CC
K29	not connected	HB06_N_CC
K30	DGND	GND
K31	not connected	HB10_P
K32	not connected	HB10_N
K33	DGND	GND
K34	not connected	HB14_P
K35	not connected	HB14_N
K36	DGND	GND
K37	not connected	HB17_P_CC
K38	not connected	HB17_N_CC
K39	DGND	GND
K40	not connected	VIO_B_M2C

JTAG[edit | edit source]

JTAG port is available as two different mechanical connectors:

2.00mm-pitch 7x2 header (Xilinx standard)
2.54mm-pitch 10x2 header (ARM standard): http://www2.lauterbach.com/pdf/arm_app_jtag.pdf
This port is connected to Zynq's native JTAG signals. Please note that Zynq's internal JTAG chain supports differents configurations, depending on bootstrap signals. In case split mode is selected, CPU JTAG can be routed separately via PL. For more details please refer to Zynq Technical Reference Manual.
JTAG on BORA Xpress EVB is also connected to the FMC connector. For more details on how to connect JTAG on a custom FMC card please refer to ANSI/VITA FPGA Mezzanine Card (FMC) Standard.

JTAG XILINX - J13[edit | edit source]

J13 is a 14-pin 7x2x2 pitch vertical header. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1, 3, 5, 7, 9, 11, 13	DGND	-	-
2	3.3V	-	-
4	JTAG_TMS	-	-
6	JTAG_TCK	-	-
8	JTAG_TDO	-	-
10	JTAG_TDI	-	-
12	N.C.	-	-
14	JTAG_TRSTn	-	-

JTAG ARM - J18[edit | edit source]

J18 is a 20-pin 10x2x2.54 pitch vertical header. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1	3.3V	-	-
2	3.3V	-	-
3, 11, 17, 19	N.C.	-	-
4, 6 ,8 ,10 ,12, 14, 16, 18, 20	DGND	-	-
5	JTAG_TDI	-	-
7	JTAG_TMS	-	-
9	JTAG_TCK	-	-
13	JTAG_TDO	-	-
15	JTAG_TRSTn	-	-

Ethernet[edit | edit source]

Ethernet port #0 (ETH0) - J8[edit | edit source]

J8 is a RJ45 Gigabit Ethernet connector - incorporating magnetics - connected to the Bora Xpress integrated ethernet controller and PHY.

Pin#	Pin name	Function	Notes
1	CT_TRD3	center tap TRD3	-
2	ETH_TXRX2_M	-	-
3	ETH_TXRX2_P	-	-
4	ETH_TXRX1_P	-	-
5	ETH_TXRX1_M	-	-
6	CT_TRD2	center tap TRD2	-
7	CT_TRD4	center tap TRD4	-
8	ETH_TXRX3_P	-	-
9	ETH_TXRX3_M	-	-
10	ETH_TXRX0_M	-	-
11	ETH_TXRX0_P	-	-
12	CT_TRD1	center tap TRD1	-
13	3.3V_ETH0_LED2	-	-
15	3.3V_ETH0_LED1	-	-
14, 16	+3.3V	-	-

Ethernet port #1 (ETH1) - J9[edit | edit source]

J9 is a RJ45 Gigabit Ethernet connector - incorporating magnetics - connected to Micrel KSZ9031 PHY (Gigabit Ethernet Transceiver). This, in turn, is connected to PL's bank 13 via RGMII interface. This is an example of EMIO routing showing how to route PS's MAC signals via PL subsystem.

Pin#	Pin name	Function	Notes
1	CT_TRD3	center tap TRD3	-
2	ETH1_TXRX2_M	-	-
3	ETH1_TXRX2_P	-	-
4	ETH1_TXRX1_P	-	-
5	ETH1_TXRX1_M	-	-
6	CT_TRD2	center tap TRD2	-
7	CT_TRD4	center tap TRD4	-
8	ETH1_TXRX3_P	-	-
9	ETH1_TXRX3_M	-	-
10	ETH1_TXRX0_M	-	-
11	ETH1_TXRX0_P	-	-
12	CT_TRD1	center tap TRD1	-
13	3.3V_ETH1_LED2	-	-
15	3.3V_ETH1_LED1	-	-
14, 16	+3.3V	-	-

Console[edit | edit source]

UART1 - J17[edit | edit source]

J17 is a standard DB9 connector that routes the signals coming from the RS232 transceiver that is connected to the PS MIO signals of the UART1 port.

Pin#	Pin name	Function	Notes
1, 6, 4, 9	N.C.	N.C.
2	UART_EXT_RX	Receive line	Connected to protection diode array
3	UART_EXT_TX	Transmit line	Connected to protection diode array
5	DGND	Ground
7, 8	N.C.	N.C.	Connected to protection diode array

SD[edit | edit source]

MicroSD - J21[edit | edit source]

J21 is a microSD memory card connector. It is connected to the BORA Xpress SOM through a bidirectional 1.8V/3.3V voltage-level translator mounted on the BORA Xpress EVB. Level shifter is required because MIO signals are 1.8V. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1	PS_SD0_DAT2	-	-
2	PS_SD0_DAT3	-	-
3	PS_SD0_CMD	-	-
4	3.3V	-	-
5	PS_SD0_CLK	-	-
6, 9, 10, 11, 12	DGND	-	-
7	PS_SD0_DAT0	-	-
8	PS_SD0_DAT1	-	-
3.3V	-		Pull up to 3.3V with 10K Ohm -

USB[edit | edit source]

USB OTG - J19[edit | edit source]

J19 is a standard USB MICRO AB connector. It is connected to the BORA Xpress USB 2.0 OTG peripheral. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1	USB_OTG_VBUS	-	-
2	USBM1	-	-
3	USBP1	-	-
4	OTG_ID	-	-
5	USB_OTG_DGND	-	-
6, 7, 8, 9	USB_OTG_SHIELD	-	-

LVDS[edit | edit source]

LVDS - J26[edit | edit source]

J26 is a vertical double row straight 20-pin 1.25mm pitch header. This interface shows how to implement a differential connection to an LCD screen. As known, Zynq does not implement an LCD controller, however this can be integrated in FPGA fabric as shown by this example: https://wiki.analog.com/resources/tools-software/linux-drivers/platforms/zynq. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1, 2	3.3V_LCD	-	-
3, 4, 7, 10, 13, 16, 19	DGND	Ground	-
5	LCD_LVDS_D0-	-	-
6	LCD_LVDS_D0+	-	-
8	LCD_LVDS_D1-	-	-
9	LCD_LVDS_D1+	-	-
11	LCD_LVDS_D2-	-	-
12	LCD_LVDS_D2+	-	-
14	LCD_LVDS_CLK-	-	-
15	LCD_LVDS_CLK+	-	-
17	LCD_P17	-	-
18	LCD_P18	-	-
20	LCD_P20	-	-
21,22	DGND	Ground	Shield

Touchscreen[edit | edit source]

Touch screen - J25[edit | edit source]

J25 is a ZIF 4-pin 1.0mm pitch connector that connects the touchscreen drive lines to the touch screen controller on the BoORA Xpress EVB. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1	TSC_YP	-	-
2	TSC_XP	-	-
3	TSC_YM	-	-
4	TSC_XM	-	-

CAN[edit | edit source]

CAN - J24[edit | edit source]

J24 is a 10-pin 5x2x2.54mm pitch vertical header directly connected to BORA Xpress SoM's transceiver for the CAN interface. This 2.5mm-pitch header is compatible with commonly available IDC-10/DB9 flat cables. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1, 6, 7, 8, 9, 10	N.C.	-	-
2, 5	CAN_SHIELD	-	-
3	CAN_L	-	-
4	CAN_H	-	-

The S7 switch enables the insertion of a 120ohm CAN termination resistor at the transmitter side.

RTC[edit | edit source]

FPGA, WatchDog, RTC, RST - JP22[edit | edit source]

JP22 is a 16-pin 8x2x2.54 pitch vertical header. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1	FPGA_INIT_B	-	-
2	RTC_32KHZ	-	-
3	FPGA_PROGRAM_B	-	-
4	RTC_RST	-	-
5	FPGA_DONE	-	-
6	RTC_INT/SQW	-	-
7, 8	DGND	Ground	-
9	WD_SET0	-	-
10	SYS_RSTn	-	-
11	WD_SET1	-	-
12	PORSTn	-	-
13	WD_SET2	-	-
14	MRSTn	-	-
15	PS_MIO15_500	-	-
16	CB_PWR_GOOD	-	-

Watchdog[edit | edit source]

WatchDog Settings - S1, S2 and S3[edit | edit source]

S1, S2 and S3 are dip-switch to override the default startup delay and timeout of the BORA Xpress module watchdog. For more details please refer to this page.

	S1.1	S1.2
WD_SET0 SOM default	OFF	OFF
WD_SET0 = '1'	ON	OFF
WD_SET0 = '0'	OFF	ON

	S2.1	S2.2
WD_SET1 SOM default	OFF	OFF
WD_SET1 = '1'	ON	OFF
WD_SET1 = '0'	OFF	ON

	S3.1	S3.2
WD_SET2 SOM default	OFF	OFF
WD_SET2 = '1'	ON	OFF
WD_SET2 = '0'	OFF	ON

DWM[edit | edit source]

DWM (DAVE Wifi/BT module) socket - J23[edit | edit source]

J23 is a 52991-0308 connector type (30 pins, vertical, 0.50mm picth). This socket connects the DWM Wireless Module (optional) to the BORA Xpress EVB. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1, 2	5V	-	-
3, 4	3.3V	-	-
5, 6, 9, 10, 19	DGND	-	-
7	DWM_SD_CMD	-	-
8	DWM_SD_CLK	-	-
11	DWM_SD_DAT0	-	-
12, 14, 16, 18, 20, 22	N.C.	-	-
13	DWM_SD_DAT1	-	-
15	DWM_SD_DAT2	-	-
17	DWM_SD_DAT3	-	-
21	DWM_UART_RX	-	-
23	DWM_UART_CTS	-	-
24	DWM_BT_F5	-	-
25	DWM_UART_TX	-	-
26	DWM_BT_F2	-	-
27	DWM_UART_RTS	-	-
28	DWM_WIFI_IRQ	-	-
29	DWM_BT_EN	-	-
30	DWM_WIFI_EN	-	-

PMOD[edit | edit source]

Digilent Pmod™ Compatible headers[edit | edit source]

Please note that:

Digilent Pmod™ Interface Specification - defined by Digilent Inc. - allows to quickly connect several pre-built I/O modules to PL:
- http://www.digilentinc.com/Products/Catalog.cfm?NavPath=2,401&Cat=9&CFID=3145471&CFTOKEN=69407812
- http://www.maximintegrated.com/products/evkits/fpga-modules/
Signals used to implement LVDS LCD interface can alternatively routed to Digilent Pmod™ Compatible compatible connector

Digilent Pmod™ Compatible - JP17[edit | edit source]

JP17 is a 12-pin 6x2x2.54 pitch vertical header. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1	PMOD_A0		-
2	PMOD_A4		-
3	PMOD_A1		-
4	PMOD_A5		-
5	PMOD_A2		-
6	PMOD_A6		-
7	PMOD_A3		-
8	PMOD_A7		-
9, 10	DGND	Ground	-
11, 12	3.3V		-

Digilent Pmod™ Compatible - JP23[edit | edit source]

JP23 is a 12-pin 6x2x2.54 pitch vertical header. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1	PMOD_B0	-	-
2	PMOD_B4	-	-
3	PMOD_B1	-	-
4	PMOD_B5	-	-
5	PMOD_B2	-	-
6	PMOD_B6	-	-
7	PMOD_B3	-	-
8	PMOD_B7	-	-
9, 10	DGND	Ground	-
11, 12	3.3V	-	-

Pin strip[edit | edit source]

Pin strip connectors[edit | edit source]

SPI,NAND - JP13[edit | edit source]

JP13 is a 12-pin 6x2x2.54 pitch vertical header. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1, 4, 9, 12	DGND	Ground	-
2	SPI0_CS0n	-	-
3	ZYNQ_SPI0_SCLK/NAND_IO1	-	-
5	ZYNQ_SPI0_DQ0/NAND_ALE	-	-
6	NAND_CS0/SPI0_CS1	-	-
7	ZYNQ_SPI0_DQ2/NAND_IO2	-	-
8	ZYNQ_SPI0_DQ1/NAND_WE	-	-
10	ZYNQ_SPI0_DQ3/NAND_IO0	-	-
11	ZYNQ_NAND_RD_B	-	-

Voltage Monitor - JP15[edit | edit source]

JP15 is a 16-pin 8x2x2.54 pitch vertical header. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1	MON_VCCPLL	-	-
2	MON_3.3V	-	-
3	MON_XADC_VCC	-	-
4	MON_1V2_ETH	-	-
5	MON_FPGA_VDDIO_BANK35	-	-
6	MON_VDDQ_1V5	-	-
7	MON_FPGA_VDDIO_BANK34	-	-
8	MON_1.8V	-	-
9	MON_FPGA_VDDIO_BANK13	-	-
10	MON_1.0V	-	-
11	MON_1.8V_IO	-	-
12	MON_MGTAVCC	-	-
13	MON_MGTAVTT	-	-
14	MON_MGTAVCCAUX	-	-
15, 16	DGND	Ground	-

Ethernet GPIO - JP18[edit | edit source]

JP18 is a 16-pin 8x2x2.54 pitch vertical header. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1, 2, 5, 6, 16	DGND	Ground	-
3	CLK125_NDO	-	-
4	ETH1_CLK125_NDO	-	-
7	ETH_MDC	-	-
8	ETH1_MDC	-	-
9	ETH_MDIO	-	-
10	ETH1_MDIO	-	-
11	ETH_INTn	-	-
12	ETH1_INTn	-	-
13	PS_MIO51_501	-	-
14	ETH1_RESETn	-	-
15	PS_MIO50_501	-	-

SPI,NAND - JP19[edit | edit source]

JP19 is a 12-pin 6x2x2.54 pitch vertical header. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1, 11, 12	DGND	Ground	-
2	NAND_BUSY	-	-
3	ZYNQ_NAND_CLE	-	-
4	NAND_IO3	-	-
5	NAND_IO4	-	-
6	NAND_IO5	-	-
7	NAND_IO6	-	-
8	NAND_IO7	-	-
9	CONN_SPI_RSTn	-	-
10	MEM_WPn	-	-

FPGA, WatchDog, RTC, RST - JP22[edit | edit source]

JP22 is a 16-pin 8x2x2.54 pitch vertical header. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1	FPGA_INIT_B	-	-
2	RTC_32KHZ	-	-
3	FPGA_PROGRAM_B	-	-
4	RTC_RST	-	-
5	FPGA_DONE	-	-
6	RTC_INT/SQW	-	-
7, 8	DGND	Ground	-
9	WD_SET0	-	-
10	SYS_RSTn	-	-
11	WD_SET1	-	-
12	PORSTn	-	-
13	WD_SET2	-	-
14	MRSTn	-	-
15	PS_MIO15_500	-	-
16	CB_PWR_GOOD	-	-

AUX PINs - JP29[edit | edit source]

JP29 is a 16-pin 8x2x2.54 pitch vertical header. The following table reports the pinout of the connector:

Pin#	Pin name	Function	Notes
1	EVB_1.8V	-	-
2	3.3V	-	-
3	PS_I2C0_DAT	-	-
4	I2C0_SDA	-	-
5	PS_I2C0_CK	-	-
6	I2C0_SCL	-	-
7, 8, 13	DGND	Ground	-
9	EXT_VMON2_V1	-	Mount option
10, 16	XADC_AGND	Analog Ground	-
11	EXT_VMON2_V2	-	Mount option
12	XADC_VN_R	-	-
14	XADC_VP_R	-	-
15	INA_ALERT	-	-

Please note that:

Three devices are connected to I2C0 bus (this is level shifted from 1.8V to 3.3V):
- Silicon Labs Si571 programmable clock generator: this clock si connected to PL to allow the user to easily experiment his/her own peripherals and IPs on FPGA
- resistive touch screen controller for LCD screen
- consumption monitor: this is connected to shunt resistor put in series on BORA power rail, allowing to measure SoM consumption

ADC - JP30, JP31, JP32[edit | edit source]

JP30, JP31, JP32 are 16-pin 8x2x2.54 pitch vertical header. The following tables reports the pinout of the connectors:

JP30:

Pin#	Pin name	Function	Notes
2	FPGA_BANK35_AD0N	AD0_N	Mount option
3	FPGA_BANK35_AD1P	AD1_P	Mount option
4	FPGA_BANK35_AD0P	AD0_P	Mount option
5	FPGA_BANK35_AD1N	AD1_N	Mount option
8	FPGA_BANK35_AD2P	AD2_P	Mount option
9	FPGA_BANK35_AD3P	AD3_P	Mount option
10	FPGA_BANK35_AD2N	AD2_N	Mount option
11	FPGA_BANK35_AD3N	AD3_N	Mount option
14	FPGA_BANK35_AD4P	AD4_P	Mount option
15	FPGA_BANK35_AD5P	AD5_P	Mount option
16	FPGA_BANK35_AD4N	AD4_N	Mount option
1, 6, 7, 12, 13	DGND	-	-

JP31:

Pin#	Pin name	Function	Notes
1	FPGA_BANK35_AD5N	AD5_N	Mount option
4	FPGA_BANK35_AD6P	AD6_P	Mount option
5	FPGA_BANK35_AD7P	AD7_P	Mount option
6	FPGA_BANK35_AD6N	AD6_N	Mount option
7	FPGA_BANK35_AD7N	AD7_N	Mount option
10	FPGA_BANK35_AD8P	AD8_P	Mount option
11	FPGA_BANK35_AD9P	AD9_P	Mount option
12	FPGA_BANK35_AD8N	AD8_N	Mount option
13	FPGA_BANK35_AD9N	AD9_N	Mount option
16	FPGA_BANK35_AD10P	AD10_P	Mount option
2, 3, 8, 9, 14, 15	DGND	-	-

JP32:

Pin#	Pin name	Function	Notes
1	FPGA_BANK35_AD11P	AD11_P	Mount option
2	FPGA_BANK35_AD10N	AD10_N	Mount option
3	FPGA_BANK35_AD11N	AD11_N	Mount option
6	FPGA_BANK35_AD12P	AD12_P	Mount option
7	FPGA_BANK35_AD13P	AD13_P	Mount option
8	FPGA_BANK35_AD12N	AD12_N	Mount option
9	FPGA_BANK35_AD13N	AD13_N	Mount option
12	FPGA_BANK35_AD14P	AD14_P	Mount option
13	FPGA_BANK35_AD15P	AD15_P	Mount option
14	FPGA_BANK35_AD14N	AD14_N	Mount option
15	FPGA_BANK35_AD15N	AD15_N	Mount option
4, 5, 10, 11, 16	DGND	-	-

Electrical and Mechanical Documents[edit | edit source]

Schematics[edit | edit source]

ORCAD: BORAXEVB-1.6.1-BELK-dsn.zip
PDF : BoraXEVB-S-EVBBX0000C0R-1.6.1.pdf

Mechanical[edit | edit source]

BORA Xpress SOM/BORA Xpress Evaluation Kit/pdf

Contents

Getting started[edit | edit source]

Kit Identification Codes[edit | edit source]

Unboxing[edit | edit source]

Kit Contents[edit | edit source]

Order codes[edit | edit source]

microSD Layout[edit | edit source]

Kit contents[edit | edit source]

Order codes[edit | edit source]

Target setup and first boot[edit | edit source]

Target configuration for the development stage (net_nfs)[edit | edit source]

microSD layout[edit | edit source]

Boot mode selection - S5[edit | edit source]

Reset Button[edit | edit source]

Reset button - S6[edit | edit source]

Carrier board Design[edit | edit source]

Carrier board design guidelines[edit | edit source]

Basic guidelines[edit | edit source]

Schematics[edit | edit source]

PCB[edit | edit source]

PCB Tecnology[edit | edit source]

PCB Basics Guidelines[edit | edit source]

SOM Connectors[edit | edit source]

SO-DIMM[edit | edit source]

Power-up sequence[edit | edit source]

Interfaces Guidelines[edit | edit source]

Ethernet 10/100/1000[edit | edit source]

Case #1: PHY is integrated on SOM[edit | edit source]

Schematics[edit | edit source]

PCB[edit | edit source]

Case #2: PHY is not integrated on SOM and a RGMII PHY is used[edit | edit source]

Schematics[edit | edit source]

PCB[edit | edit source]

Case #3: PHY is not integrated on SOM and a RMII PHY is used[edit | edit source]

Schematics[edit | edit source]

PCB[edit | edit source]

USB[edit | edit source]

Schematics[edit | edit source]

PCB[edit | edit source]

HDMI[edit | edit source]

Schematics[edit | edit source]

PCB[edit | edit source]

SATA[edit | edit source]

Schematics[edit | edit source]

PCB[edit | edit source]

PCI Express[edit | edit source]

PCB[edit | edit source]

LVDS[edit | edit source]

PCB[edit | edit source]

LCD Interface[edit | edit source]

Schematics[edit | edit source]

PCB[edit | edit source]

VIN Interface[edit | edit source]

Schematics[edit | edit source]

PCB[edit | edit source]

TVOUT[edit | edit source]

Schematics[edit | edit source]

PCB[edit | edit source]

I2C Interface[edit | edit source]

Schematics[edit | edit source]

PCB[edit | edit source]

SD/MMC Interface[edit | edit source]

CAN Interface[edit | edit source]

Functional guidelines[edit | edit source]

Sudden power off management[edit | edit source]

Thermal Management[edit | edit source]

Integration guide[edit | edit source]

Advanced routing and carrier board design guidelines[edit | edit source]

Suggested PCB specifications[edit | edit source]

Power rails[edit | edit source]

Main SD/MMC interface[edit | edit source]

Main Gigabit Ethernet interface (ETH0)[edit | edit source]

CAN interface[edit | edit source]

XADC interface[edit | edit source]

Connecting the PUDC_B pin[edit | edit source]

PS' I²C buses[edit | edit source]

How to implement workaround suggested by Xilinx on BoraEVB[edit | edit source]

Test on BoraEVB[edit | edit source]

Test on BoraXEVB[edit | edit source]

Target configuration for the development stage (`net_nfs`)[edit | edit source]