AURA SOM/Part number composition

History
Issue Date	Notes
15/05/2023	Preliminary information
31/08/2023	Official release

Part number composition

AURA SOM module part number is identified by the following digit-code table:

Part number structure	Options	Description
Family	DAU	Family prefix code
SOC	A: PIMX9352CVUXMAA 1.7GHz Dual Core Tj: (-40+105) FCPBGA, Rev.1.0, Full Feature(sample) B: MIMX9352DVVxMAB 1.7GHz Dual Core Tj: (0+95) FCPBGA, Rev.2.0, Full Feature(MP) C: MIMX9352CVVxMAB 1.7GHz Dual Core Tj: (-40+105) FCPBGA, Rev.2.0, Full Feature(MP) D: MIMX9352XVVxMAB 1.7GHz Dual Core Tj: (-40+125) FCPBGA, Rev.2.0, Full Feature(MP) E: MIMX9351DVVxMAB 1.7GHz Single Core Tj: (0+95) FCPBGA, Rev.2.0, Full Feature(MP) F: MIMX9351CVVxMAB 1.7GHz Single Core Tj: (-40+105) FCPBGA, Rev.2.0, Full Feature(MP) G: MIMX9351XVVxMAB 1.7GHz Single Core Tj: (-40+125) FCPBGA, Rev.2.0, Full Feature(MP) H: MIMX9332DVVxMAB 1.7GHz Dual Core Tj: (0+95) FCPBGA, Rev.2.0, No NPU (MP) I: MIMX9332CVVxMAB 1.7GHz Dual Core Tj: (-40+105) FCPBGA, Rev.2.0, No NPU (MP) J: MIMX9332XVVxMAB 1.7GHz Dual Core Tj: (-40+125) FCPBGA, Rev.2.0, No NPU (MP) K: MIMX9331DVVxMAB 1.7GHz Single Core Tj: (0+95) FCPBGA, Rev.2.0, No NPU (MP) L: MIMX9331CVVxMAB 1.7GHz Single Core Tj: (-40+105) FCPBGA, Rev.2.0, No NPU (MP) M: MIMX9331XVVxMAB 1.7GHz Single Core Tj: (-40+125) FCPBGA, Rev.2.0, No NPU (MP) N: MIMX9302DVVxDAB 900 MHz Dual Core Tj: (0+95) FCPBGA, Rev.2.0, Reduced Features (MP) O: MIMX9302CVVxDAB 900 MHz Dual Core Tj: (-40+105) FCPBGA, Rev.2.0, Reduced Features (MP) P: MIMX9301DVVxDAB 900 MHz Single Core Tj: (0+95) FCPBGA, Rev.2.0, Reduced Features (MP) Q: MIMX9301CVVxDAB 900 MHz Single Core Tj: (-40+105) FCPBGA, Rev.2.0, Reduced Features (MP)	These options depends on NXP P/N description available here. Other versions can be available, please contact technical support
RAM	1: 1GB LPDDR4 2: 2GB LPDDR4
Storage eMMC/NAND/QSPI	0: No Storage on board 1: 16MB NOR SPI, 8GB eMMC 2: 256MB NAND, 8GB eMMC 3: 8GB eMMC, no NAND/NOR (SD3 available) 4: 256MB NAND, no eMMC (SD1 available) 5: 4GB eMMC, no NAND/NOR (SD3 available) 6: 16MB NOR SPI, 4GB eMMC	SPI NOR and NAND are alternatives mounting options
Boot Mode:	0: on board SPI NOR 1: on board eMMC 2: on board SPI NAND
RFU	0: RFU
RFU	0: RFU
Temperature range	C - Commercial grade: suitable for 0-70°C envirronment I - Industrial grade: suitable for 40 - 85°C envirronment
PCB revision	0: first version	PCB release may change for manufacturing purposes (i.e. text fixture adaptation)
Manufacturing option	R: RoHS compliant	typically connected to production process and quality
Software Configuration	-00: standard factory u-boot pre-programmed	If customers require custom SW deployed this section should be defined and agreed. Please contact technical support

Example

AURA SOM code DAUA13100I0R-00

• A -
• 1 - 1GB LPDDR4
• 3 - 8GB eMMC
• 1 - eMMC boot
• 0 - RFU
• 0 - RFU
• I - Industrial grade: -40 to +85°C
• 0 - first version
• R - RoHS compliant
• -00 -

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