AURA SOM/Part number composition

History
Issue Date	Notes
2023/05/17	Preliminary information
2023/08/31	Official release
2024/02/09	Added more details about P/N structure.
2024/09/17	Added eMMC storage option.
2024/12/11	Added boot mode option for ADP006.

Part number composition

AURA SOM module part number is composed by several fields as follows.

[Family][SOC][RAM][Storage][Boot Mode][RFU][RFU][Temperature range][PCB revision][Manufacturing option][Software Configuration]

Each field is detailed in the following table.

Part number structure	Options	Description
Family	DAU	Family prefix code
SOC	A: PIMX9352CVUXMAA 1.7GHz Dual Core Tj: (-40+105) Full Feature (Preliminary samples) B: MIMX9352DVVXMAB 1.7GHz Dual Core Tj: (0+95) Full Feature C: MIMX9352CVVXMAB 1.7GHz Dual Core Tj: (-40+105) Full Feature D: MIMX9352XVVXMAB 1.7GHz Dual Core Tj: (-40+125) Full Feature E: MIMX9351DVVXMAB 1.7GHz Single Core Tj: (0+95) Full Feature F: MIMX9351CVVXMAB 1.7GHz Single Core Tj: (-40+105) Full Feature G: MIMX9351XVVXMAB 1.7GHz Single Core Tj: (-40+125) Full Feature H: MIMX9332DVVXMAB 1.7GHz Dual Core Tj: (0+95) No NPU I: MIMX9332CVVXMAB 1.7GHz Dual Core Tj: (-40+105) No NPU J: MIMX9332XVVXMAB 1.7GHz Dual Core Tj: (-40+125) No NPU K: MIMX9331DVVXMAB 1.7GHz Single Core Tj: (0+95) No NPU L: MIMX9331CVVXMAB 1.7GHz Single Core Tj: (-40+105) No NPU M: MIMX9331XVVXMAB 1.7GHz Single Core Tj: (-40+125) No NPU N: MIMX9302DVVXDAB 900 MHz Dual Core Tj: (0+95) Reduced Features O: MIMX9302CVVXDAB 900 MHz Dual Core Tj: (-40+105) Reduced Features P: MIMX9301DVVXDAB 900 MHz Single Core Tj: (0+95) Reduced Features Q: MIMX9301CVVXDAB 900 MHz Single Core Tj: (-40+105) Reduced Features	These options depends on NXP P/N description available here. Other versions can be available, please contact technical support
RAM	1: 1GB LPDDR4 2: 2GB LPDDR4
Storage eMMC/NAND/QSPI	0: No Storage on board 1: 16MB NOR SPI, 8GB eMMC 2: 256MB NAND, 8GB eMMC 3: 8GB eMMC, no NAND/NOR (SD3 available) 4: 256MB NAND, no eMMC (SD1 available) 5: 4GB eMMC, no NAND/NOR (SD3 available) 6: 16MB NOR SPI, 4GB eMMC 7: 16GB eMMC, no NAND/NOR (SD3 available)	SPI NOR and NAND are alternatives mounting options
Boot Mode:	0: on board SPI NOR / SD2 (uSD) 1: on board eMMC / SD2 (uSD) 2: on board SPI NAND / SD2 (uSD) 3: with S-ADP006's booting options 4: user defined	The boot modes listed here are "single boot", meaning that the Cortex-A55 is the first core to boot. Other options are available on-demand, however. DAVE Embedded Systems' team is available for additional information on this matter. If necessary, please contact sales@dave.eu.
RFU	0: RFU
RFU	0: RFU
Temperature range	C - Commercial grade: suitable for 0-70°C envirronment I - Industrial grade: suitable for 40 - 85°C envirronment
PCB revision	0: first version 1: second version	PCB release may change for manufacturing purposes (i.e. text fixture adaptation)
Manufacturing option	R: RoHS compliant	typically connected to production process and quality
Software Configuration	-00: standard factory u-boot pre-programmed	If customers require custom SW deployed this section should be defined and agreed. Please contact technical support

Example

AURA SOM code DAUB13100I0R-00

• B: MIMX9352DVVxMAB 1.7GHz Dual Core Tj: (0+95) Full Feature
• 1: 1GB LPDDR4
• 3: 8GB eMMC
• 1: eMMC boot
• 0: RFU
• 0: RFU
• I: Industrial grade: -40 to +85°C
• 0: first version
• R: RoHS compliant
• -00: standard factory u-boot pre-programmed

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