AURA SOM/AURA Hardware/Part number composition

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History
Issue Date Notes

2023/05/17

Preliminary information

2023/08/31

Official release

2024/02/09

Added more details about P/N structure.
2024/09/17 Added eMMC storage option


Part number composition[edit | edit source]

AURA SOM module part number is composed by several fields as follows.

[Family][SOC][RAM][Storage][Boot Mode][RFU][RFU][Temperature range][PCB revision][Manufacturing option][Software Configuration]

Each field is detailed in the following table.

Part number structure Options Description
Family DAU Family prefix code
SOC
A: PIMX9352CVUXMAA 1.7GHz Dual Core Tj: (-40+105) Full Feature

(Preliminary samples)

B: MIMX9352DVVXMAB 1.7GHz Dual Core Tj: (0+95) Full Feature
C: MIMX9352CVVXMAB 1.7GHz Dual Core Tj: (-40+105) Full Feature
D: MIMX9352XVVXMAB 1.7GHz Dual Core Tj: (-40+125) Full Feature
E: MIMX9351DVVXMAB 1.7GHz Single Core Tj: (0+95) Full Feature
F: MIMX9351CVVXMAB 1.7GHz Single Core Tj: (-40+105) Full Feature
G: MIMX9351XVVXMAB 1.7GHz Single Core Tj: (-40+125) Full Feature
H: MIMX9332DVVXMAB 1.7GHz Dual Core Tj: (0+95) No NPU
I: MIMX9332CVVXMAB 1.7GHz Dual Core Tj: (-40+105) No NPU
J: MIMX9332XVVXMAB 1.7GHz Dual Core Tj: (-40+125) No NPU
K: MIMX9331DVVXMAB 1.7GHz Single Core Tj: (0+95) No NPU
L: MIMX9331CVVXMAB 1.7GHz Single Core Tj: (-40+105) No NPU
M: MIMX9331XVVXMAB 1.7GHz Single Core Tj: (-40+125) No NPU
N: MIMX9302DVVXDAB 900 MHz Dual Core Tj: (0+95) Reduced Features
O: MIMX9302CVVXDAB 900 MHz Dual Core Tj: (-40+105) Reduced Features
P: MIMX9301DVVXDAB 900 MHz Single Core Tj: (0+95) Reduced Features
Q: MIMX9301CVVXDAB 900 MHz Single Core Tj: (-40+105) Reduced Features
These options depends on NXP P/N description available here. Other versions can be available, please contact technical support
RAM
  • 1: 1GB LPDDR4
  • 2: 2GB LPDDR4
Storage

eMMC/NAND/QSPI

  • 0: No Storage on board
  • 1: 16MB NOR SPI, 8GB eMMC
  • 2: 256MB NAND, 8GB eMMC
  • 3: 8GB eMMC, no NAND/NOR (SD3 available)
  • 4: 256MB NAND, no eMMC (SD1 available)
  • 5: 4GB eMMC, no NAND/NOR (SD3 available)
  • 6: 16MB NOR SPI, 4GB eMMC
  • 7: 16GB eMMC, no NAND/NOR (SD3 available)
SPI NOR and NAND are alternatives mounting options
Boot Mode:
  • 0: on board SPI NOR / SD2 (uSD)
  • 1: on board eMMC / SD2 (uSD)
  • 2: on board SPI NAND / SD2 (uSD)
The boot modes listed here are "single boot", meaning that the Cortex-A55 is the first core to boot.

Other options are available on-demand, however. DAVE Embedded Systems' team is available for additional information on this matter. If necessary, please contact sales@dave.eu.

RFU
  • 0: RFU
RFU
  • 0: RFU
Temperature range
  • C - Commercial grade: suitable for 0-70°C envirronment
  • I - Industrial grade: suitable for 40 - 85°C envirronment
PCB revision
  • 0: first version
PCB release may change for manufacturing purposes (i.e. text fixture adaptation)
Manufacturing option
  • R: RoHS compliant
typically connected to production process and quality
Software Configuration
  • -00: standard factory u-boot pre-programmed
If customers require custom SW deployed this section should be defined and agreed. Please contact technical support

Example[edit | edit source]

AURA SOM code DAUB13100I0R-00

  • B MIMX9352DVVxMAB 1.7GHz Dual Core Tj: (0+95) Full Feature
  • 1 - 1GB LPDDR4
  • 3 - 8GB eMMC
  • 1 - eMMC boot
  • 0 - RFU
  • 0 - RFU
  • I - Industrial grade: -40 to +85°C
  • 0 - first version
  • R - RoHS compliant
  • -00 -