ORCA SOM/ORCA Hardware/Electrical Thermal and Mechanical Features/Thermal management and heat dissipation
< ORCA SOM | ORCA Hardware
| HOME | SOMs | SBCs | ToloMEO Embedded Assistant |  GET A QUOTE
|
 ONLINE HELPDESK
|
| Roadmap | IoT Services | ML/AI services | Embedded Design Services |
| History | |||
|---|---|---|---|
| Version | Issue Date | Notes | |
| 1.0.0 | Feb 2021 | First release | |
Thermal management[edit | edit source]
The ORCA SOM is designed to support the maximum available temperature range declared by the manufacturer.
The customer shall define and conduct a reasonable number of tests and verification in order to qualify the DUT capabilities to manage the heat dissipation.
Any heatsink, fan etc shall be defined case by case.
DAVE Embedded Systems' team is available for any additional information, please contact sales@dave.eu.
A general overview snapshot[edit | edit source]
For your information, please see below a snapshot in stress conditions (with about 10W power consumption) with a standard heatsink on top of SOC:
Software thermal protection[edit | edit source]
|
Section not completed yet |
