Difference between revisions of "ORCA SOM/ORCA Hardware/Electrical Thermal and Mechanical Features/Thermal management and heat dissipation"

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! colspan="4" style="width:100%; text-align:left" ; border-bottom:solid 2px #ededed" |History
 
! colspan="4" style="width:100%; text-align:left" ; border-bottom:solid 2px #ededed" |History
 
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! style="border-left:solid 2px #73B2C7; border-right:solid 2px #73B2C7;border-top:solid 2px #73B2C7; border-bottom:solid 2px #73B2C7; background-color:#73B2C7; padding:5px; color:white" |Version
 
 
! style="border-left:solid 2px #73B2C7; border-right:solid 2px #73B2C7;border-top:solid 2px #73B2C7; border-bottom:solid 2px #73B2C7; background-color:#73B2C7; padding:5px; color:white" |Issue Date
 
! style="border-left:solid 2px #73B2C7; border-right:solid 2px #73B2C7;border-top:solid 2px #73B2C7; border-bottom:solid 2px #73B2C7; background-color:#73B2C7; padding:5px; color:white" |Issue Date
 
! style="border-left:solid 2px #73B2C7; border-right:solid 2px #73B2C7;border-top:solid 2px #73B2C7; border-bottom:solid 2px #73B2C7; background-color:#73B2C7; padding:5px; color:white" |Notes
 
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| style="border-left:solid 2px #73B2C7; border-right:solid 2px #73B2C7;border-top:solid 2px #73B2C7; border-bottom:solid 2px #73B2C7; background-color:#edf8fb; padding:5px; color:#000000" |First release
 
| style="border-left:solid 2px #73B2C7; border-right:solid 2px #73B2C7;border-top:solid 2px #73B2C7; border-bottom:solid 2px #73B2C7; background-color:#edf8fb; padding:5px; color:#000000" |First release
 
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! style="border-left:solid 2px #73B2C7; border-right:solid 2px #73B2C7;border-top:solid 2px #73B2C7; border-bottom:solid 2px #73B2C7; background-color:#ededed; padding:5px; color:#000000" |Add thermography picture
 
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<section end="History" /><section begin="Body" />TBD: da definire a valle della validazione SW
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<section end="History" /><section begin="Body" />
  
 
== Thermal management ==
 
== Thermal management ==
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DAVE Embedded Systems' team is available for any additional information, please contact [mailto:sales@dave.eu sales@dave.eu].
 
DAVE Embedded Systems' team is available for any additional information, please contact [mailto:sales@dave.eu sales@dave.eu].
 +
 +
=== A general overview snapshot ===
 +
For your information, please see below a snapshot in stress conditions (with about 10W power consumption) with a standard heatsink on top of SOC:
 +
[[File:Tcam mito top IR.jpg|none|thumb|416x416px]]
  
 
===Software thermal protection ===
 
===Software thermal protection ===
  
In DESK-MX8-L, two software thermal protection mechanisms are implemented. Both are based on the processor's temperature sensor. It is worth remembering that maximum junction temperature (also denoted as Tj in the rest of the document) is:
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{| style="color:#000000; border:solid 2px #73B2C7; background-color:#ededed;font-size:95%; vertical-align:middle;"
 
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|[[File:TBD.png|30px]]
*95°C for commercial parts
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|'''Section not completed yet'''
*105°C for extended commercial and industrial parts
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|}
*125°C for automotive parts.
 
 
 
====U-Boot====
 
At U-Boot level, automatic boot procedure is halted until Tj is smaller than (following temperatures might seem excessively low but they take into account the intrinsic poor precision of the temperature sensor to provide a reasonable safe margin):
 
 
 
*80°C for commercial parts
 
*90 for extended commercial and industrial parts
 
*110°C for automotive parts.
 
 
 
====Linux kernel====
 
At Linux level, a more sophisticated protection mechanism is implemented. Please refer to the following sections for more details.
 
 
 
The default temperature thresholds depend on the silicon grade, as follows:
 
 
 
*for commercial parts
 
** passive threshold: 85°C
 
** critical threshold: 90°C
 
*for extended commercial and industrial parts
 
** passive threshold: 95°C
 
** critical threshold: 100°C
 
*for automotive parts
 
** passive threshold: 115°C
 
** critical threshold: 120°C.
 
 
 
Practically speaking, for DESK-MX8-L this mechanism makes use of two different thresholds, denoted as <code>trip_point0</code> (also known as ''passive threshold'') and <code>trip_point1</code> (also known as ''critical threshold''.
 
 
 
When Tj reaches <code>trip_point0</code>, Linux kernel scales down processor frequency:
 
 
 
<pre>
 
System is too hot. GPU3D will work at 1/64 clock.
 
</pre>
 
 
 
If Tj reaches <code>trip_point1</code>, a complete shutdown is triggered:
 
 
 
<pre>
 
thermal thermal_zone0: critical temperature reached(100 C),shutting down
 
</pre>
 
 
 
By default, temperature thresholds are set up as follows:
 
*<code>trip_point0</code>: 85°C
 
*<code>trip_point1</code>: 100°C.
 
 
 
Trip point thresholds can be accessed via <code>sysfs</code> interface from user space. The following example shows how to read the values of the trip points:
 
<pre>
 
root@axel-lite:~# cat /sys/devices/virtual/thermal/thermal_zone0/trip_point_0_temp
 
85000
 
root@axel-lite:~# cat /sys/devices/virtual/thermal/thermal_zone0/trip_point_1_temp
 
100000
 
</pre>
 
This example shows how to set trip points 0 and 1 to 95°C and 100°C respectively:
 
<pre>
 
echo 95000 > /sys/class/thermal/thermal_zone0/trip_point_0_temp
 
echo 100000 > /sys/class/thermal/thermal_zone0/trip_point_1_temp
 
</pre>
 
{{ImportantMessage|text=Please note that
 
*it is possible to set up trip points greater than the maximum junction temperature indicated by manufacturer datasheet
 
*exceeding maximum junction temperature indicated by manufacturer datasheet may cause permanent damage
 
}}
 
 
 
To read current processor temperature please issue this command (reported temperature is 36.676°C in the example):
 
 
 
<pre>
 
root@axel-lite:~# cat /sys/class/thermal/thermal_zone0/temp
 
36676
 
</pre>
 
 
 
For more details about this functionality, please refer to <code>Documentation/thermal/sysfs-api.txt</code> in the kernel sources.
 
  
 
----
 
----
  
 
[[Category:ORCA]]
 
[[Category:ORCA]]

Latest revision as of 18:44, 28 December 2023

History
Issue Date Notes

2021/02/04

First release
2023/11/09 Add thermography picture


Thermal management[edit | edit source]

The ORCA SOM is designed to support the maximum available temperature range declared by the manufacturer.

The customer shall define and conduct a reasonable number of tests and verification in order to qualify the DUT capabilities to manage the heat dissipation.

Any heatsink, fan etc shall be defined case by case.

DAVE Embedded Systems' team is available for any additional information, please contact sales@dave.eu.

A general overview snapshot[edit | edit source]

For your information, please see below a snapshot in stress conditions (with about 10W power consumption) with a standard heatsink on top of SOC:

Tcam mito top IR.jpg

Software thermal protection[edit | edit source]

TBD.png Section not completed yet