BORA SOM/BORA Hardware/Electrical Thermal management and heat dissipation
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| 1.0.0 | Oct 2021 | New documentation layout | |
Thermal management[edit | edit source]
Bora product is designed to support the maximum available temperature range declared by the manufacturer. The customer shall define and conduct a reasonable number of tests and verification in order to qualify the DUT capabilities to manage the heat dissipation.
For example, in the previous test cases:
- Testbed 1 : when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junction temperature
- Testbed 2 : when Tamb has been set to +75°C, the Bora SOM has been coupled to a fan-cooled heat sink to prevent exceeding maximum Zynq's junction temperature
Any heatsink, fan etc shall be defined case by case depending on the various use conditions like: air cooling (forced or not), enclosure dimensions, mechanical/thermal coupling with heatsink. A proper thermal analysis must be investigated on the real use scenario which depends on FPGA design, frequency configurations, working signals, etc.
