BORA SOM/BORA Hardware/Electrical Thermal management and heat dissipation
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Thermal management[edit | edit source]
Bora product is designed to support the maximum available temperature range declared by the manufacturer. The customer shall define and conduct a reasonable number of tests and verification in order to qualify the DUT capabilities to manage the heat dissipation.
For example, in the previous test cases:
- Testbed 1 : when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junction temperature
- Testbed 2 : when Tamb has been set to +75°C, the Bora SOM has been coupled to a fan-cooled heat sink to prevent exceeding maximum Zynq's junction temperature
Any heatsink, fan etc shall be defined case by case depending on the various use conditions like: air cooling (forced or not), enclosure dimensions, mechanical/thermal coupling with heatsink. A proper thermal analysis must be investigated on the real use scenario which depends on FPGA design, frequency configurations, working signals, etc.
DAVE Embedded Systems' team is available for any additional information, please contact sales@dave.eu.
