Difference between revisions of "BORA SOM/BORA Hardware/Electrical Thermal and Mechanical Features/Operational characteristics"

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(Created page with "{{subst:Operational_characteristics | nome-som=BORA | kit-code=BELK}}")
 
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<section end=History/>
 
<section end=History/>
 
<section begin=Body/>
 
<section begin=Body/>
−
 
−
''TBD: riportare i valori delle tabelle corretti''
 
  
 
== Operational characteristics  ==
 
== Operational characteristics  ==
Line 36: Line 25:
 
|-
 
|-
 
|Main power supply voltage
 
|Main power supply voltage
−
|-0.3
+
| 3.14
−
|3.3
+
| 3.3
−
|3.6
+
| 3.46
 
|V
 
|V
 
|}
 
|}
Line 51: Line 40:
 
|-
 
|-
 
|Main power supply voltage
 
|Main power supply voltage
−
|3.135
+
|
 
|3.3
 
|3.3
−
|3.465
+
|
 
|V
 
|V
 
|}
 
|}
  
 
=== Power consumption ===
 
=== Power consumption ===
−
Providing theoretical maximum power consumption value would be useless for the majority of system designers building their application upon BORA module.  
+
Providing theoretical maximum power consumption value would be useless for the majority of system designers building their application upon BORA module because, in most cases, this would lead to an over-sized power supply unit.
−
Practically speaking, these figures would be of no help when it comes to size power supply unit or to perform thermal design of real systems.
+
Several configurations have been tested in order to provide figures that are measured on real-world use cases instead.
 +
Please note that BORA platform is so flexible that it is virtually impossible to test for all possible configurations and applications on the market.
 +
The use cases here presented should cover most of real-world scenarios. However actual customer application might require more power than values reported here.
 +
Generally speaking, application specific requirements have to be taken into consideration in order to size power supply unit and to implement thermal management properly.
  
−
Instead, several configurations have been tested in order to provide figures that are measured on real-world use cases.
+
====Configuration #1====
 +
=====Testbed=====
  
−
Please note that BORA platform is so flexible that it is virtually impossible to test for all possible configurations and applications on the market.  
+
Measurements have been performed on the BORA SOM under test is equipped with:
−
The use cases here presented should cover most of real-world scenarios.  
+
 
−
However actual customer's application might require more power than values reported here or customer's use case may be differ significantly with respect to the ones here considered.  
+
* Bora SOM: DBRD5110I1R this model is based on Zynq XC7Z020-1I (Tj: -40°C / +100°C)
 +
* carrier board: BoraEVB
 +
* processor frequency: 667 MHz
 +
* FPGA frequency
 +
** 30 MHz (Tamb = +85°C)
 +
** 150 MHz (Tamb = +-40°C)
 +
* U-Boot: 2014.07-00067-g4b98484 (Oct 24 2014 - 17:28:32) [belk-2.1.0]
 +
* Linux kernel: 3.15.0-bora-2.1.0-xilinx-00044-g372fcab #5 SMP PREEMPT Thu Oct 23 13:54:38 CEST 2014 armv7l GNU/Linux
 +
* root file system mounted over Gigabit Ethernet link.
  
−
Therefore, application-specific requirements have always to be taken into consideration in order to size power supply unit and to implement thermal management properly.
+
Please note that, when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junction
 +
temperature.
 +
At the application level, PS executes concurrently several tasks including:
 +
* two instances of burnCortexA9
 +
* periodic reading of I2C RTC (Maxim DS3232M)
 +
* periodic reading of Zynq's ADCs
 +
* periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail
 +
* one instance of memtester, exercising 50 MByte of SDRAM
 +
* endless loop of writing/reading/verifying operations on microSD card
 +
* periodic reading of I2C remote temperature sensor (Texas Instruments TMP421)
 +
* endless loop of writing/reading/verifying operations on memory stick connected to the USB port
  
−
==== Use cases results ====
+
At the application level, PS executes concurrently several tasks including:
 +
*two instances of [https://github.com/Explorer09/cpustress-sources/blob/master/cpuburn/cpuburn-1.4a/ARM/burnCortexA9.s <code>burnCortexA9</code>]
 +
*periodic reading of I2C RTC (Maxim DS3232M)
 +
*periodic reading of Zynq's ADCs
 +
*periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail
 +
*one instance of [http://pyropus.ca/software/memtester/ <code>memtester</code>], exercising 50 MByte of SDRAM
 +
*endless loop of writing/reading/verifying operations on microSD card
 +
*periodic reading of I2C remote temperature sensor (Texas Instruments TMP421)
 +
*endless loop of writing/reading/verifying operations on memory stick connected to the USB port.
 +
=====Results=====
 +
*Tamb: temperature of the ambient surrounding the DUT
 +
*Tj_max: maximum Zynq's junction temperature measured during the test
 +
*P_max: maximum power absorption of Bora SOM
  
−
Measurements have been performed on the BORA SOM under test is equipped with:
+
{| class="wikitable" border="1"
 +
!Tamb [°C]
 +
!Tj_max [°C]
 +
!FPGA clock frequency [MHz]
 +
!P_max [W]
 +
|-
 +
|85
 +
|123.7 [1]
 +
|30
 +
|5.7
 +
|-
 +
| -40
 +
|22.8
 +
|150
 +
|7.0
 +
|-
 +
|}
  
−
''TBD: definire la configurazione del SOM in uso''
+
[1] In spite of the use of heat sink, this value exceeds maximum valued declared by the manufacturer. This is acceptable in case of stress tests, where it is possible that parts of the DUT get damaged.
  
−
• i.MX6 DualLite (p.n. MCIMX6U7CVM08AC)
+
====Configuration #2====
−
• 1 GB DDR3L SDRAM
+
=====Testbed=====
−
• 4 GB eMMC
+
Measurements have been performed on the following platform:
 +
* Bora SOM: DBRF5110C1R
 +
**this model is based on Zynq XC7Z020-3E (Tj: '''0 / +100°C''')
 +
* carrier board: [[BoraEVB]]
 +
* processor frequency: '''867 MHz'''
 +
* FPGA frequency
 +
**10 MHz (Tamb = +75°C)
 +
**150 MHz (Tamb = +-40°C)
 +
*U-Boot: <code>2014.07-00068-g9070bdc (Oct 28 2014 - 10:18:52) [belk-2.1.0]</code>
 +
*Linux kernel: <code>3.15.0-bora-2.1.0-xilinx-00044-g372fcab #5 SMP PREEMPT Thu Oct 23 13:54:38 CEST 2014 armv7l GNU/Linux</code>
 +
*root file system mounted over Gigabit Ethernet link.
 +
Please note that, when Tamb has been set to +75°C, the Bora SOM has been coupled to a fan-cooled heat sink to prevent exceeding maximum Zynq's junction temperature.
  
−
1 Gbps Ethernet link has been always active during the test.
+
At application level, PS executes concurrently several tasks including:
 +
*two instances of [https://github.com/Explorer09/cpustress-sources/blob/master/cpuburn/cpuburn-1.4a/ARM/burnCortexA9.s <code>burnCortexA9</code>]
 +
*periodic reading of I2C RTC (Maxim DS3232M)
 +
*periodic reading of Zynq's ADCs
 +
*periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail
 +
*one instance of [http://pyropus.ca/software/memtester/ <code>memtester</code>], exercising 50 MByte of SDRAM
 +
*endless loop of writing/reading/verifying operations on microSD card
 +
*periodic reading of I2C remote temperature sensor (TExas Instruments TMP421)
 +
*endless loop of writing/reading/verifying operations on memory stick connected to USB port.
 +
=====Results=====
 +
*Tamb: temperature of the ambient surrounding the DUT
 +
*Tj_max: maximum Zynq's junction temperature measured during the test
 +
*P_max: maximum power absorption of Bora SOM
 +
{| class="wikitable" border="1"
 +
!Tamb [°C]
 +
!Tj_max [°C]
 +
!FPGA clock frequency [MHz]
 +
!P_max [W]
 +
|-
 +
|75
 +
|100.8
 +
|10
 +
|4.1
 +
|-
 +
| -40
 +
|34.7
 +
|150
 +
|7.3
 +
|-
 +
|}
 +
====Configuration #3====
 +
=====Testbed=====
 +
Measurements have been performed on the following platform:
 +
* Bora SOM: DBRD4110Q2P-01
 +
**this model is based on Zynq XQ7Z020-1Q (Tj: '''-40°C / +125°C''')
 +
* carrier board: [[BoraEVB]]
 +
* processor frequency: '''667 MHz'''
 +
* FPGA frequency
 +
**40 MHz (Tamb = +85°C)
 +
**150 MHz (Tamb = +-40°C)
 +
*U-Boot: <code>2013.04 (Aug 25 2014 - 23:52:57) [belk-2.1.0]</code>
 +
*Linux kernel: <code>3.17.0-bora-2.1.0-xilinx-00053-gb95579a</code>
 +
*root file system mounted over Gigabit Ethernet link.
 +
Please note that, when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junction temperature.
  
−
The table below reports the power consumption measurements for the considered use cases.
+
At the application level, PS executes concurrently several tasks including:
 +
*two instances of [https://github.com/Explorer09/cpustress-sources/blob/master/cpuburn/cpuburn-1.4a/ARM/burnCortexA9.s <code>burnCortexA9</code>]
 +
*periodic reading of I2C RTC (Maxim DS3232M)
 +
*periodic reading of Zynq's ADCs
 +
*periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail
 +
*one instance of [http://pyropus.ca/software/memtester/ <code>memtester</code>], exercising 50 MByte of SDRAM
 +
*endless loop of writing/reading/verifying operations on microSD card
 +
*periodic reading of I2C remote temperature sensor (Texas Instruments TMP421)
 +
*endless loop of writing/reading/verifying operations on memory stick connected to the USB port
 +
*endless loop of writing/reading/verifying operations on NAND flash memory.
 +
====Results====
 +
*Tamb: temperature of the ambient surrounding the DUT
 +
*Tj_max: maximum Zynq's junction temperature measured during the test
 +
*P_max: maximum power absorption of Bora SOM
  
−
{| class="wikitable"  
+
{| class="wikitable" border="1"
−
! latexfontsize="scriptsize"| Checkpoint
+
!Tamb [°C]
−
! latexfontsize="scriptsize"| Power (mW)
+
!Tj_max [°C]
−
|-
+
!FPGA clock frequency [MHz]
−
|U-boot prompt
+
!P_max [W]
−
| xxxx
 
 
|-
 
|-
−
|Linux prompt
+
|85
−
| xxxx
+
|140.0 [1]
 +
|40
 +
|7.0
 
|-
 
|-
−
|Stress App test (*)
+
| -40
−
| xxxx
+
|35.5
 +
|150
 +
|7.3
 
|-
 
|-
 
|}
 
|}
  
−
(*) Stressful Application Test: https://github.com/stressapptest/stressapptest
+
[1] In spite of the use of heat sink, this value exceeds maximum valued declared by the manufacturer. This is acceptable in case of stress tests, where it is possible that parts of the DUT get damaged.
  
 
----
 
----
  
 
[[Category:BORA]]
 
[[Category:BORA]]

Revision as of 13:31, 29 October 2021

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History
Version Issue Date Notes
1.0.0 Oct 2021 New documentation layout


Operational characteristics[edit | edit source]

Maximum ratings[edit | edit source]

Parameter Min Typ Max Unit
Main power supply voltage 3.14 3.3 3.46 V

Recommended ratings[edit | edit source]

Parameter Min Typ Max Unit
Main power supply voltage 3.3 V

Power consumption[edit | edit source]

Providing theoretical maximum power consumption value would be useless for the majority of system designers building their application upon BORA module because, in most cases, this would lead to an over-sized power supply unit. Several configurations have been tested in order to provide figures that are measured on real-world use cases instead. Please note that BORA platform is so flexible that it is virtually impossible to test for all possible configurations and applications on the market. The use cases here presented should cover most of real-world scenarios. However actual customer application might require more power than values reported here. Generally speaking, application specific requirements have to be taken into consideration in order to size power supply unit and to implement thermal management properly.

Configuration #1[edit | edit source]

Testbed[edit | edit source]

Measurements have been performed on the BORA SOM under test is equipped with:

  • Bora SOM: DBRD5110I1R this model is based on Zynq XC7Z020-1I (Tj: -40°C / +100°C)
  • carrier board: BoraEVB
  • processor frequency: 667 MHz
  • FPGA frequency
    • 30 MHz (Tamb = +85°C)
    • 150 MHz (Tamb = +-40°C)
  • U-Boot: 2014.07-00067-g4b98484 (Oct 24 2014 - 17:28:32) [belk-2.1.0]
  • Linux kernel: 3.15.0-bora-2.1.0-xilinx-00044-g372fcab #5 SMP PREEMPT Thu Oct 23 13:54:38 CEST 2014 armv7l GNU/Linux
  • root file system mounted over Gigabit Ethernet link.

Please note that, when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junction temperature. At the application level, PS executes concurrently several tasks including:

  • two instances of burnCortexA9
  • periodic reading of I2C RTC (Maxim DS3232M)
  • periodic reading of Zynq's ADCs
  • periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail
  • one instance of memtester, exercising 50 MByte of SDRAM
  • endless loop of writing/reading/verifying operations on microSD card
  • periodic reading of I2C remote temperature sensor (Texas Instruments TMP421)
  • endless loop of writing/reading/verifying operations on memory stick connected to the USB port

At the application level, PS executes concurrently several tasks including:

  • two instances of burnCortexA9
  • periodic reading of I2C RTC (Maxim DS3232M)
  • periodic reading of Zynq's ADCs
  • periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail
  • one instance of memtester, exercising 50 MByte of SDRAM
  • endless loop of writing/reading/verifying operations on microSD card
  • periodic reading of I2C remote temperature sensor (Texas Instruments TMP421)
  • endless loop of writing/reading/verifying operations on memory stick connected to the USB port.
Results[edit | edit source]
  • Tamb: temperature of the ambient surrounding the DUT
  • Tj_max: maximum Zynq's junction temperature measured during the test
  • P_max: maximum power absorption of Bora SOM
Tamb [°C] Tj_max [°C] FPGA clock frequency [MHz] P_max [W]
85 123.7 [1] 30 5.7
-40 22.8 150 7.0

[1] In spite of the use of heat sink, this value exceeds maximum valued declared by the manufacturer. This is acceptable in case of stress tests, where it is possible that parts of the DUT get damaged.

Configuration #2[edit | edit source]

Testbed[edit | edit source]

Measurements have been performed on the following platform:

  • Bora SOM: DBRF5110C1R
    • this model is based on Zynq XC7Z020-3E (Tj: 0 / +100°C)
  • carrier board: BoraEVB
  • processor frequency: 867 MHz
  • FPGA frequency
    • 10 MHz (Tamb = +75°C)
    • 150 MHz (Tamb = +-40°C)
  • U-Boot: 2014.07-00068-g9070bdc (Oct 28 2014 - 10:18:52) [belk-2.1.0]
  • Linux kernel: 3.15.0-bora-2.1.0-xilinx-00044-g372fcab #5 SMP PREEMPT Thu Oct 23 13:54:38 CEST 2014 armv7l GNU/Linux
  • root file system mounted over Gigabit Ethernet link.

Please note that, when Tamb has been set to +75°C, the Bora SOM has been coupled to a fan-cooled heat sink to prevent exceeding maximum Zynq's junction temperature.

At application level, PS executes concurrently several tasks including:

  • two instances of burnCortexA9
  • periodic reading of I2C RTC (Maxim DS3232M)
  • periodic reading of Zynq's ADCs
  • periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail
  • one instance of memtester, exercising 50 MByte of SDRAM
  • endless loop of writing/reading/verifying operations on microSD card
  • periodic reading of I2C remote temperature sensor (TExas Instruments TMP421)
  • endless loop of writing/reading/verifying operations on memory stick connected to USB port.
Results[edit | edit source]
  • Tamb: temperature of the ambient surrounding the DUT
  • Tj_max: maximum Zynq's junction temperature measured during the test
  • P_max: maximum power absorption of Bora SOM
Tamb [°C] Tj_max [°C] FPGA clock frequency [MHz] P_max [W]
75 100.8 10 4.1
-40 34.7 150 7.3

Configuration #3[edit | edit source]

Testbed[edit | edit source]

Measurements have been performed on the following platform:

  • Bora SOM: DBRD4110Q2P-01
    • this model is based on Zynq XQ7Z020-1Q (Tj: -40°C / +125°C)
  • carrier board: BoraEVB
  • processor frequency: 667 MHz
  • FPGA frequency
    • 40 MHz (Tamb = +85°C)
    • 150 MHz (Tamb = +-40°C)
  • U-Boot: 2013.04 (Aug 25 2014 - 23:52:57) [belk-2.1.0]
  • Linux kernel: 3.17.0-bora-2.1.0-xilinx-00053-gb95579a
  • root file system mounted over Gigabit Ethernet link.

Please note that, when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junction temperature.

At the application level, PS executes concurrently several tasks including:

  • two instances of burnCortexA9
  • periodic reading of I2C RTC (Maxim DS3232M)
  • periodic reading of Zynq's ADCs
  • periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail
  • one instance of memtester, exercising 50 MByte of SDRAM
  • endless loop of writing/reading/verifying operations on microSD card
  • periodic reading of I2C remote temperature sensor (Texas Instruments TMP421)
  • endless loop of writing/reading/verifying operations on memory stick connected to the USB port
  • endless loop of writing/reading/verifying operations on NAND flash memory.

Results[edit | edit source]

  • Tamb: temperature of the ambient surrounding the DUT
  • Tj_max: maximum Zynq's junction temperature measured during the test
  • P_max: maximum power absorption of Bora SOM
Tamb [°C] Tj_max [°C] FPGA clock frequency [MHz] P_max [W]
85 140.0 [1] 40 7.0
-40 35.5 150 7.3

[1] In spite of the use of heat sink, this value exceeds maximum valued declared by the manufacturer. This is acceptable in case of stress tests, where it is possible that parts of the DUT get damaged.

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