BORA Xpress SOM/BORA Xpress Hardware/Electrical Thermal management and heat dissipation
< BORA Xpress SOM | BORA Xpress Hardware| HOME | SOMs | SBCs | ToloMEO Embedded Assistant |  GET A QUOTE
|
 ONLINE HELPDESK
|
| Roadmap | IoT Services | ML/AI services | Embedded Design Services |
| History | |||
|---|---|---|---|
| Version | Issue Date | Notes | |
| 1.0.0 | Nov 2021 | New documentation layout | |
Thermal managementEdit
BORA Xpress product is designed to support the maximum available temperature range declared by the manufacturer. The customer shall define and conduct a reasonable number of tests and verification in order to qualify the DUT capabilities to manage the heat dissipation.
Any heatsink, fan etc shall be defined case by case depending on the various use conditions like: air cooling (forced or not), enclosure dimensions, mechanical/thermal coupling with heatsink. A proper thermal analysis must be investigated on the real use scenario which depends on FPGA design, frequency configurations, working signals, etc.
DAVE Embedded Systems' team is available for any additional information, please contact sales@dave.eu.