Changes

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The heart of Bora module is composed of the following components:

This chapter shortly describes the main Bora components.

The Zynq™-7000 family is based on the Xilinx Extensible Processing Platform (EPP) architecture. These products integrate a feature-rich dual-core ARM® Cortex™-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single device. The ARM Cortex-A9 CPUs are the heart of the PS and also include on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces.

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DDR3 SDRAM memory bank is composed by 2x 16-bit width chips resulting in a 32-bit combined width bank. The following table reports the SDRAM specifications:

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NOR flash is a Serial Peripheral Interface (SPI) device. By default this device is connected to SPI channel 0 and acts as boot memory. The following table reports the NOR flash specifications:

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On board main storage memory is a 8-bit wide NAND flash. By default it is connected to chip select. The following table reports the NAND flash specifications:

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Bora, as the other Ultra Line CPU modules, embeds all the elements required for powering the unit, therefore power sequencing is self-contained and simplified. Nevertheless, power must be provided from carrier board, and therefore users should be aware of the ranges power supply can assume as well as all other parameters. For detailed information, please refer to [[Power_(Bora)]].

All interface signals Bora provides are routed through three 140 pin 0.6mm pitch stacking connectors (named J1, J2 and J3). The dedicated carrier board must mount the mating connectors and connect the desired peripheral interfaces according to Bora pinout specifications.