Difference between revisions of "Power consumption (Bora)"
| Line 20: | Line 20: | ||
**this model is based on Zynq XC7Z020-1I (Tj: -40° / +100°) | **this model is based on Zynq XC7Z020-1I (Tj: -40° / +100°) | ||
* carrier board: [[BoraEVB]] | * carrier board: [[BoraEVB]] | ||
| − | * processor frequency: | + | * processor frequency: 667 MHz |
* FPGA frequency | * FPGA frequency | ||
**30 MHz (Tamb = +85°C) | **30 MHz (Tamb = +85°C) | ||
| Line 27: | Line 27: | ||
*Linux kernel: <code>3.15.0-bora-2.1.0-xilinx-00044-g372fcab #5 SMP PREEMPT Thu Oct 23 13:54:38 CEST 2014 armv7l GNU/Linux</code> | *Linux kernel: <code>3.15.0-bora-2.1.0-xilinx-00044-g372fcab #5 SMP PREEMPT Thu Oct 23 13:54:38 CEST 2014 armv7l GNU/Linux</code> | ||
*root file system mounted over Gigabit Ethernet link. | *root file system mounted over Gigabit Ethernet link. | ||
| − | Please note that, when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive | + | Please note that, when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junction temperature. |
At application level, PS executes concurrently several tasks including: | At application level, PS executes concurrently several tasks including: | ||
| Line 69: | Line 69: | ||
**this model is based on Zynq XC7Z020-3E (Tj: 0 / +100°) | **this model is based on Zynq XC7Z020-3E (Tj: 0 / +100°) | ||
* carrier board: [[BoraEVB]] | * carrier board: [[BoraEVB]] | ||
| − | * processor frequency: | + | * processor frequency: 867 MHz |
* FPGA frequency | * FPGA frequency | ||
**10 MHz (Tamb = +75°C) | **10 MHz (Tamb = +75°C) | ||
| Line 108: | Line 108: | ||
|- | |- | ||
|} | |} | ||
| + | ==Configuration #3== | ||
| + | ===Testbed=== | ||
| + | Measurements have been performed on the following platform: | ||
| + | * Bora SOM: DBRD4110Q2P-01 | ||
| + | **this model is based on Zynq XQ7Z020-1Q (Tj: -40° / +125°) | ||
| + | * carrier board: [[BoraEVB]] | ||
| + | * processor frequency: 667 MHz | ||
| + | * FPGA frequency | ||
| + | **30 MHz (Tamb = +85°C) | ||
| + | **150 MHz (Tamb = +-40°C) | ||
| + | *U-Boot: <code>2013.04 (Aug 25 2014 - 23:52:57) [belk-2.1.0]</code> | ||
| + | *Linux kernel: <code>3.17.0-bora-2.1.0-xilinx-00053-gb95579a</code> | ||
| + | *root file system mounted over Gigabit Ethernet link. | ||
| + | Please note that, when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junction temperature. | ||
| + | |||
| + | At application level, PS executes concurrently several tasks including: | ||
| + | *two instances of <code>burnCortexA9</code> | ||
| + | *periodic reading of I2C RTC (Maxim DS3232M) | ||
| + | *periodic reading of Zynq's ADCs | ||
| + | *periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail | ||
| + | *one instance of <code>memtester</code> over 50 MByte of SDRAM | ||
| + | *endless loop of writing/reading/verifying operations on microSD card | ||
| + | *periodic reading of I2C remote temperature sensor (TExas Instruments TMP421) | ||
| + | *endless loop of writing/reading/verifying operations on memory stick connected to USB port | ||
| + | *endless loop of writing/reading/verifying operations on NAND flash memory. | ||
| + | ===Results=== | ||
| + | *Tamb: temperature of the ambient surrounding the DUT | ||
| + | *Tj_max: maximum Zynq's junction temperature measured during the test | ||
| + | *P_max: maximum power absorption of Bora SOM | ||
| + | |||
| + | {| class="wikitable" border="1" | ||
| + | !Tamb [°C] | ||
| + | !Tj_max [°C] | ||
| + | !FPGA clock frequency [MHz] | ||
| + | !P_max [W] | ||
| + | |- | ||
| + | |85 | ||
| + | |140.0 [1] | ||
| + | |40 | ||
| + | |7.0 | ||
| + | |- | ||
| + | | -40 | ||
| + | |35.5 | ||
| + | |150 | ||
| + | |7.3 | ||
| + | |- | ||
| + | |} | ||
| + | |||
| + | [1] In spite of the use of heat sink, this value exceeds maximum valued declared by manufacturer. This is acceptable in case of stress tests, where it is possible that the parts of the DUT get damaged. | ||
Revision as of 10:39, 2 September 2016
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Contents
Introduction[edit | edit source]
Providing theoretical maximum power consumption value would be useless for the majority of system designers building their application upon Bora module because, in most cases, this would lead to an oversized power supply unit.
Several configurations have been tested in order to provide figures that are measured on real-world use cases instead. Please note that Bora platform is so flexible that is virtually impossible to test for all possible configurations and applications on the market. The use cases here presented should cover most of real-world scenarios. However actual customer application might require more power than values reported here. Generally speaking, application specific requirements have to be taken into consideration in order to size power supply unit and to implement thermal management properly.
The following sections describe in details the test beds that have been used. All of them make use of a specific FPGA bistream that has been developed to perform stress tests on Bora platforms [1]. These tests are condicted in a climatic chamber that allows to set environment temperature surrounding DUT, denoted in the rest of the document as Tamb. Tj denotes Zynq's junction temperature instead.
FPGA bitstream - that in turn is built upon this core - allocates most of FPGA resources. All of them are clocked by one clock signal whose frequency is selectable by processor - also denoted as Processing System or PS for short - at runtime. This allows to flexibly change DUT current absorption and, consequently, generated heat.
[1] These tests verify proper operating of the DUT under extremely heavy conditions of usage. Data here reported have been excerpted from the logs generated by such tests.
Configuration #1[edit | edit source]
Testbed[edit | edit source]
Measurements have been performed on the following platform:
- Bora SOM: DBRD5110I1R
- this model is based on Zynq XC7Z020-1I (Tj: -40° / +100°)
- carrier board: BoraEVB
- processor frequency: 667 MHz
- FPGA frequency
- 30 MHz (Tamb = +85°C)
- 150 MHz (Tamb = +-40°C)
- U-Boot:
2014.07-00067-g4b98484 (Oct 24 2014 - 17:28:32) [belk-2.1.0] - Linux kernel:
3.15.0-bora-2.1.0-xilinx-00044-g372fcab #5 SMP PREEMPT Thu Oct 23 13:54:38 CEST 2014 armv7l GNU/Linux - root file system mounted over Gigabit Ethernet link.
Please note that, when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junction temperature.
At application level, PS executes concurrently several tasks including:
- two instances of
burnCortexA9 - periodic reading of I2C RTC (Maxim DS3232M)
- periodic reading of Zynq's ADCs
- periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail
- one instance of
memtesterover 50 MByte of SDRAM - endless loop of writing/reading/verifying operations on microSD card
- periodic reading of I2C remote temperature sensor (TExas Instruments TMP421)
- endless loop of writing/reading/verifying operations on memory stick connected to USB port.
Results[edit | edit source]
- Tamb: temperature of the ambient surrounding the DUT
- Tj_max: maximum Zynq's junction temperature measured during the test
- P_max: maximum power absorption of Bora SOM
| Tamb [°C] | Tj_max [°C] | FPGA clock frequency [MHz] | P_max [W] |
|---|---|---|---|
| 85 | 123.7 [1] | 30 | 5.7 |
| -40 | 22.8 | 150 | 7.0 |
[1] In spite of the use of heat sink, this value exceeds maximum valued declared by manufacturer. This is acceptable in case of stress tests, where it is possible that the parts of the DUT get damaged.
Configuration #2[edit | edit source]
Testbed[edit | edit source]
Measurements have been performed on the following platform:
- Bora SOM: DBRF5110C1R
- this model is based on Zynq XC7Z020-3E (Tj: 0 / +100°)
- carrier board: BoraEVB
- processor frequency: 867 MHz
- FPGA frequency
- 10 MHz (Tamb = +75°C)
- 150 MHz (Tamb = +-40°C)
- U-Boot:
2014.07-00068-g9070bdc (Oct 28 2014 - 10:18:52) [belk-2.1.0] - Linux kernel:
3.15.0-bora-2.1.0-xilinx-00044-g372fcab #5 SMP PREEMPT Thu Oct 23 13:54:38 CEST 2014 armv7l GNU/Linux - root file system mounted over Gigabit Ethernet link.
Please note that, when Tamb has been set to +75°C, the Bora SOM has been coupled to a fan-cooled heat sink to prevent exceeding maximum Zynq's junction temperature.
At application level, PS executes concurrently several tasks including:
- two instances of
burnCortexA9 - periodic reading of I2C RTC (Maxim DS3232M)
- periodic reading of Zynq's ADCs
- periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail
- one instance of
memtesterover 50 MByte of SDRAM - endless loop of writing/reading/verifying operations on microSD card
- periodic reading of I2C remote temperature sensor (TExas Instruments TMP421)
- endless loop of writing/reading/verifying operations on memory stick connected to USB port.
Results[edit | edit source]
- Tamb: temperature of the ambient surrounding the DUT
- Tj_max: maximum Zynq's junction temperature measured during the test
- P_max: maximum power absorption of Bora SOM
| Tamb [°C] | Tj_max [°C] | FPGA clock frequency [MHz] | P_max [W] |
|---|---|---|---|
| 75 | 100.8 | 30 | 4.1 |
| -40 | 34.7 | 150 | 7.3 |
Configuration #3[edit | edit source]
Testbed[edit | edit source]
Measurements have been performed on the following platform:
- Bora SOM: DBRD4110Q2P-01
- this model is based on Zynq XQ7Z020-1Q (Tj: -40° / +125°)
- carrier board: BoraEVB
- processor frequency: 667 MHz
- FPGA frequency
- 30 MHz (Tamb = +85°C)
- 150 MHz (Tamb = +-40°C)
- U-Boot:
2013.04 (Aug 25 2014 - 23:52:57) [belk-2.1.0] - Linux kernel:
3.17.0-bora-2.1.0-xilinx-00053-gb95579a - root file system mounted over Gigabit Ethernet link.
Please note that, when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junction temperature.
At application level, PS executes concurrently several tasks including:
- two instances of
burnCortexA9 - periodic reading of I2C RTC (Maxim DS3232M)
- periodic reading of Zynq's ADCs
- periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail
- one instance of
memtesterover 50 MByte of SDRAM - endless loop of writing/reading/verifying operations on microSD card
- periodic reading of I2C remote temperature sensor (TExas Instruments TMP421)
- endless loop of writing/reading/verifying operations on memory stick connected to USB port
- endless loop of writing/reading/verifying operations on NAND flash memory.
Results[edit | edit source]
- Tamb: temperature of the ambient surrounding the DUT
- Tj_max: maximum Zynq's junction temperature measured during the test
- P_max: maximum power absorption of Bora SOM
| Tamb [°C] | Tj_max [°C] | FPGA clock frequency [MHz] | P_max [W] |
|---|---|---|---|
| 85 | 140.0 [1] | 40 | 7.0 |
| -40 | 35.5 | 150 | 7.3 |
[1] In spite of the use of heat sink, this value exceeds maximum valued declared by manufacturer. This is acceptable in case of stress tests, where it is possible that the parts of the DUT get damaged.
