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Thermal tests and measurements (SBCX)

Revision as of 16:39, 10 October 2016 by U0001 (talk | contribs)

WorkInProgress.gif

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SBC-AXEL-02.png Applies to SBC AXEL


Contents

HistoryEdit

Version Date Notes
First public release

IntroductionEdit

This document describes the tests that have been performed on SBCX board to characterize thermal behavior of some configurations. The results here presented can be used by integrators building systems upon SBCX board as a basis for comparison. In fact, as stated in the SBCX's Hardware Manual, systems integrators have to perform thermal analysis on the application's definitive configuration that generally differs significantly with respect to the use cases here described, in terms of both hardware and software.

Test bedsEdit

Five different test beds have been considered. From the electronics point of view, all of them are based on the following parts:

  • SBCX equipped iMX6 Dual Lite processor (maximum frequency = TBD) and 1GB SDRAM
  • LCD TBD.

Common settings:

  • Linux governor:
  • LCD backlight intensity: 100%
  • test bed #1
    • Tamb = TBD °C
    • system layout - SBCX

tbd inserire foto

  • test bed #2:
    • Tamb = TBD °C
    • system layout - SBCX

tbd inserire foto

  • test bed #3:
    • Tamb = TBD °C
    • system layout - SBCX

tbd inserire foto

  • test bed #4:
    • Tamb = TBD °C
    • system layout - SBCX

tbd inserire foto

  • test bed #5:
    • Tamb = TBD °C
    • system layout - SBCX

tbd inserire foto

ResultsEdit

Test bed #1Edit

Test bed #2Edit

Test bed #3Edit

Test bed #4Edit

Test bed #5Edit

Useful linksEdit