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→Processor heating and lifetime
==Processor heating and lifetime==
Use of internal LDOs increases the power dissipation on processor side significantly. As a consequence, operating junction temperature increases as well. This fact has to be taken into consideration at system integration level, as it affects directly is strictly related to expected processor lifetime. For more details please refer to
<ref name="AN4724">Freescale Semiconductor, Inc., ''AN4724 i.MX 6Dual/6Quad Product Lifetime Usage Estimates''</ref>
and
<ref name="AN4725">Freescale Semiconductor, Inc., ''AN4725 i.MX 6Solo/6DualLite Product Lifetime Usage Estimates''</ref>.
==References==
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