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==Articles in this series==
*Part 1 (this document)
*[[ML-TN-003_—_AI_at_the_edge:_visual_inspection_of_assembled_PCBs_for_defect_detection_—_Part_2|Part 2 ]] talks about the classification of surface-mounted components on printed circuit boards.*[[ML-TN-003_—_AI_at_the_edge:_visual_inspection_of_assembled_PCBs_for_defect_detection_—_Part_3|Part 3 ]] deals with the issue of data scarcity.
==Useful links==
*Young-Gyu Kim, Tae-Hyoung Park, [https://res.mdpi.com/d_attachment/applsci/applsci-10-04598/article_deploy/applsci-10-04598.pdf ''SMT Assembly Inspection Using Dual-Stream Convolutional Networks and Two Solder Regions''], July 2020.
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