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*[[ML-TN-003_—_AI_at_the_edge:_visual_inspection_of_assembled_PCBs_for_defect_detection_—_Part_2|Part 2]] talks about the classification of surface-mounted components on printed circuit boards.
*[[ML-TN-003_—_AI_at_the_edge:_visual_inspection_of_assembled_PCBs_for_defect_detection_—_Part_3|Part 3]] deals with the issue of data scarcity.
==Test Bed==
==Dataset==
==Models==
===ResNet50===
<gallery mode="packed">
</gallery>
===ResNet101===
===ResNet152===
===InceptionV4===
===Inception ResNet V1===
===Inception ResNet V2===
==Comparison==
==Useful links==
*Young-Gyu Kim, Tae-Hyoung Park, [https://res.mdpi.com/d_attachment/applsci/applsci-10-04598/article_deploy/applsci-10-04598.pdf ''SMT Assembly Inspection Using Dual-Stream Convolutional Networks and Two Solder Regions''], July 2020.
