Difference between revisions of "Carrier board design guidelines (SOM)"

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{{Applies To Diva}}
 
{{Applies To Diva}}
 
{{InfoBoxBottom}}
 
{{InfoBoxBottom}}
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 +
{{WarningMessage|text=The information here provided are preliminary and subject to change.}}
 +
 +
==Introduction==
 +
This page provides useful information and resources to system designers in order to design an efficient host board for DAVE SOM module.
 +
 +
This guidelines are provided with the goal to help designers to design compliant systems with DAVE module and they cover schematics and PCB aspects.
 +
 +
== Basics Guidelines ==
 +
 +
In this section we want to analyze basics HW guidelines valid for all DAVE SOMs.
 +
 +
=== Schematics ===
 +
* Check mirroring and pinout for every connector on the board
 +
* Check for TX and RX lines
 +
* Add series resitor as interface needs (see interface details)
 +
* TBD
 +
=== PCB ===
 +
==== PCB Tecnology ====
 +
Use a PCB tecnology as advised in the following table
 +
{| {{table border=1}}
 +
| align="center" style="background:#f0f0f0;"|''' '''
 +
| align="center" style="background:#f0f0f0;"|'''Min'''
 +
| align="center" style="background:#f0f0f0;"|'''Typ'''
 +
| align="center" style="background:#f0f0f0;"|'''Max'''
 +
|-
 +
| Layers(number)||4||6||-
 +
|-
 +
| Power Layers||2||2||-
 +
|-
 +
| Clearence(mils)||4||6||-
 +
|-
 +
| Vias hole (mechanical)||0,3||||-
 +
|-
 +
| Minimum number of via for each power signal layer changes||2||3||-
 +
|-
 +
| Minimum number of via for each power signal SOM connector pin||1||2||-
 +
|-
 +
| Component package size||0402||0603||-
 +
|-
 +
| PCB Height(mm)||1,4||1,6||-
 +
|-
 +
|}
 +
 +
* If vias less than minimum advised size are used, take care to maintain an adeguate number of via when you change layer on each power signal.<br/>
 +
* PCB heights less than minimum advised can produce PCB heating and mechanical issues.
 +
==== PCB Basics Guidelins ====
 +
* Avoid stubs
 +
* Isolate clock and HI-SPEED signal (differential lines i.e.) for at least two times trace width or gap for differential lines
 +
* Avoid voids on planes
 +
== Interfaces Guidelines ==
 +
This section provides guidelines for the most used interfaces on DAVE's SOMs module. Please refer to SOM's detailed pages for specific additional information.
 +
=== ETHERNET 10/100 ===
 +
==== Schematics ====
 +
* If LAN connector with integrated magnetic are used:
 +
** predispose some protection diodes on ethernet lines
 +
** Connect connector shield to an adeguate GND or shield Plane
 +
==== PCB ====
 +
{| {{table border=1}}
 +
| align="center" style="background:#f0f0f0;"|''''''
 +
| align="center" style="background:#f0f0f0;"|'''Min'''
 +
| align="center" style="background:#f0f0f0;"|'''Typ'''
 +
| align="center" style="background:#f0f0f0;"|'''Max'''
 +
|-
 +
| Differential Impedance(ohm)||76||95||114
 +
|-
 +
| Common Mode Impedance||46,75||55||63,25
 +
|-
 +
| Gap between TX and RX lines||2xseparation||4xseparation||-
 +
|-
 +
| Gap between other signal||2xseparation||2xseparation||-
 +
|-
 +
| Intra pair matching(mils)||-||240||-
 +
|-
 +
| TX and RX via mismatch||0||0||1
 +
|-
 +
|}
 +
* If LAN connector with integrated magnetic are used:
 +
** do not route traces under the connettor, neither on opposite side
 +
** place filter diode near connector
 +
** place others signals far from connector.
 +
** Connect connector shield to an adeguate GND or shield Plane or Copper through numerous vias if necessary
 +
* If on board magnetic are used
 +
** adeguately isolate system GND from magnetic connector side
 +
* try to match as best as possible each differential pair
 +
* no TX and RX matching required

Revision as of 15:31, 11 October 2012

WorkInProgress.gif

Info Box
Naon am387x-dm814x.png Applies to Naon
Maya 03.png Applies to Maya
Lizard.jpg Applies to Lizard
Diva-am335x-overview.png Applies to Diva


Warning-icon.png The information here provided are preliminary and subject to change. Warning-icon.png

Introduction[edit | edit source]

This page provides useful information and resources to system designers in order to design an efficient host board for DAVE SOM module.

This guidelines are provided with the goal to help designers to design compliant systems with DAVE module and they cover schematics and PCB aspects.

Basics Guidelines[edit | edit source]

In this section we want to analyze basics HW guidelines valid for all DAVE SOMs.

Schematics[edit | edit source]

  • Check mirroring and pinout for every connector on the board
  • Check for TX and RX lines
  • Add series resitor as interface needs (see interface details)
  • TBD

PCB[edit | edit source]

PCB Tecnology[edit | edit source]

Use a PCB tecnology as advised in the following table

Min Typ Max
Layers(number) 4 6 -
Power Layers 2 2 -
Clearence(mils) 4 6 -
Vias hole (mechanical) 0,3 -
Minimum number of via for each power signal layer changes 2 3 -
Minimum number of via for each power signal SOM connector pin 1 2 -
Component package size 0402 0603 -
PCB Height(mm) 1,4 1,6 -
  • If vias less than minimum advised size are used, take care to maintain an adeguate number of via when you change layer on each power signal.
  • PCB heights less than minimum advised can produce PCB heating and mechanical issues.

PCB Basics Guidelins[edit | edit source]

  • Avoid stubs
  • Isolate clock and HI-SPEED signal (differential lines i.e.) for at least two times trace width or gap for differential lines
  • Avoid voids on planes

Interfaces Guidelines[edit | edit source]

This section provides guidelines for the most used interfaces on DAVE's SOMs module. Please refer to SOM's detailed pages for specific additional information.

ETHERNET 10/100[edit | edit source]

Schematics[edit | edit source]

  • If LAN connector with integrated magnetic are used:
    • predispose some protection diodes on ethernet lines
    • Connect connector shield to an adeguate GND or shield Plane

PCB[edit | edit source]

' Min Typ Max
Differential Impedance(ohm) 76 95 114
Common Mode Impedance 46,75 55 63,25
Gap between TX and RX lines 2xseparation 4xseparation -
Gap between other signal 2xseparation 2xseparation -
Intra pair matching(mils) - 240 -
TX and RX via mismatch 0 0 1
  • If LAN connector with integrated magnetic are used:
    • do not route traces under the connettor, neither on opposite side
    • place filter diode near connector
    • place others signals far from connector.
    • Connect connector shield to an adeguate GND or shield Plane or Copper through numerous vias if necessary
  • If on board magnetic are used
    • adeguately isolate system GND from magnetic connector side
  • try to match as best as possible each differential pair
  • no TX and RX matching required