Changes

With respect to the NOR flash memories, NAND devices are known to be quite challenging with regard to the reliability. This is especially true when the NAND flash is used as the boot device. Several techniques such as wear leveling and bad block management have to be implemented to achieve an acceptable reliability.

This document describes some details provides information about the NAND devicemanagement, in order to handle it properly when it is used as the boot device on NXP i.MX6-based products.

Even though the examples example shown here refers to an i.MX6SoloX board, the approach is substantially the same across all the i.MX6 family.

The test bed used in this example consists of an i.MX6SoloX-board equipped with a 512MB 8-bit asynchronous 1-bit ECC SLC NAND memory which is connected to the EIM bus of the SoC. The boot firmware image is the U-Boot bootloaderbinary file (<code>mx6sx_board_nand_u-boot.imx</code>). Its size is about 400 kB. From the point of view of MTD partitions, the boot partition is <code>mtd0</code> which is 8MB.

***The first copy of the firmware***The second copy of the firmware. For more details about the bootrom e the NAND boot process, please refer to the ''System Boot'' chapter of the Reference Manual of the specific i.MX6 Application Processor.

The burning of the {{WarningMessage|text=This application note was validated before '''XELK 4''' kit version which is using u-boot partition is typically performed by the SPL. Instruction ha to be modified according to [[https://github.com/NXPmicro/imx-kobs <code>kobs-ng</code> toolStandalone_boot_(XELK)#NAND_flash | Standalone boot from NAND]]page.}}