Difference between revisions of "LCC USB SSD (DUL)"
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* From the mechanical standpoint adoption of LCC outline guarantees a solid and firm mating with carrier board hosting DUL | * From the mechanical standpoint adoption of LCC outline guarantees a solid and firm mating with carrier board hosting DUL | ||
* About power supply, two inputs are provided: | * About power supply, two inputs are provided: | ||
| − | ** VIN: this is main power supply input. See [ | + | ** VIN: this is main power supply input. See [Pinout] section for more information about voltage range. |
** VIN_AUX (available on request): this input is provided to implement a second power supply unit on carrier board (for example based on supercap or battery) that prevents power cut in case main supply experiences a glitch or a power cut. This option is a powerful weapon to face unpredictable power loss and to guarantee data integrity. | ** VIN_AUX (available on request): this input is provided to implement a second power supply unit on carrier board (for example based on supercap or battery) that prevents power cut in case main supply experiences a glitch or a power cut. This option is a powerful weapon to face unpredictable power loss and to guarantee data integrity. | ||
* NAND flash: by default NAND technology is SLC. MLC memories are available on request. | * NAND flash: by default NAND technology is SLC. MLC memories are available on request. | ||
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** to prevent data corruption in case of power failure | ** to prevent data corruption in case of power failure | ||
** to recover from unexpected power-off . | ** to recover from unexpected power-off . | ||
| + | |||
==Specification== | ==Specification== | ||
* Package outline: Leadless Chip Carrier aka LCC-68 (JEDEC MS004), 9 actual leads per side | * Package outline: Leadless Chip Carrier aka LCC-68 (JEDEC MS004), 9 actual leads per side | ||
* Operating temperature range: -40/+85°C | * Operating temperature range: -40/+85°C | ||
===Pinout=== | ===Pinout=== | ||
Revision as of 16:25, 26 July 2012
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 Please note that information here provided are preliminary and subject to change. |
Introduction[edit | edit source]
DUL belongs to the Dave Solid State Disk (SSD) product family. These devices implements SSD solutions that are conceived for use in embedded systems operating in harsh environments where no compromises are tolerated about relibility. On the other hand, they are designed in order to ease the use from the system integrator's standpoint, in terms of hardware issues and software compatibility. These characteritcs make them suited for use in combination with a wide range of host devices, from low-cost microcontrollers to high-end embedded processors.
SSD product family is composed by several subfamilies. Two major factors distinguish subfamilies: mechanical outline and host interface. DUL comes in Leadless Chip Carrier (LCC) package. Host interface is USB. Non-volatile storage is based on NAND flash tecnology.
Reliability[edit | edit source]
This section highlights product characteristics and features that have been adopted at design stage in order to push intrinsic reliability to the maximum possible extent.
- From the mechanical standpoint adoption of LCC outline guarantees a solid and firm mating with carrier board hosting DUL
- About power supply, two inputs are provided:
- VIN: this is main power supply input. See [Pinout] section for more information about voltage range.
- VIN_AUX (available on request): this input is provided to implement a second power supply unit on carrier board (for example based on supercap or battery) that prevents power cut in case main supply experiences a glitch or a power cut. This option is a powerful weapon to face unpredictable power loss and to guarantee data integrity.
- NAND flash: by default NAND technology is SLC. MLC memories are available on request.
- read-only modes: two signals are provided in order to inhibit any write operation on NAND flash. See #Pinout section for more details.
- NAND controller: the controller implements specific algorithms designed
- to prevent data corruption in case of power failure
- to recover from unexpected power-off .
Specification[edit | edit source]
- Package outline: Leadless Chip Carrier aka LCC-68 (JEDEC MS004), 9 actual leads per side
- Operating temperature range: -40/+85°C
