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→Design Overview
= Design Overview =
The heart of Bora module is composed of the following components:
* Xilinx Zynq Z-7010 (XC7Z010) / Z-7020 (XC7Z020) SoC
* Power supply unit
* DDR memory banks
* NOR and NAND flash banks
* 3x 140 pin connectors with interfaces signals
This chapter shortly describes the main Bora components.
== Processor Info ==
The Zynq™-7000 family is based on the Xilinx Extensible Processing Platform (EPP) architecture. These products integrate a feature-rich dual-core ARM® Cortex™-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single device. The ARM Cortex-A9 CPUs are the heart of the PS and also include on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces.
The Zynq-7000 family offers the flexibility and scalability of an FPGA, while providing performance, power, and ease of use typically associated with ASIC and ASSPs. The range of devices in the Zynq-7000 AP SoC family enables designers to target cost-sensitive as well as high-performance applications from a single platform using industry-standard tools. While each device in the Zynq-7000 family contains the same PS, the PL and I/O resources vary between the devices. As a result, the Zynq-7000 AP SoC devices are able to serve a wide range of applications including:
* Automotive driver assistance, driver information, and infotainment
* Broadcast camera
* Industrial motor control, industrial networking, and machine vision
* IP and Smart camera
* LTE radio and baseband
* Medical diagnostics and imaging
* Multifunction printers
* Video and night vision equipment
The following table shows a comparison between the devices, highlighting the differences:
== RAM memory bank ==
