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'''A''': As a starting point, you can refer to the [[Carrier_board_design_guidelines_(SOM)]] page, that will highlight some best practices that applies to all SOMs. For specific information on Naon, please refer to the [[Integration_guide_(Naon) | Naon integration guide]].
=== Q: What is Naon power consumption? === '''A''': Naon platform is so flexible that is virtually impossible to test for all possible configurations and applications on the market. Generally speaking, application specific requirements have to be taken into consideration in order to size power supply unit and to implement thermal management properly. However, we've performed some tests that should cover most of real-world scenarios and we've reported the results on the [[Power_consumption_(Naon)]] page. === Q: How can I reduce power consumption? === '''A''': The Linux kernel provided with the NELK implements some power management features, in particular: * CPU heats up during Governor Usage* Operating Performance Points* Subsystem frequency selection* Standby mode For a full description of the power management strategies, please refer to the [[NELK Power Management]] page. === Q: During operation, the CPU is rather hot. Is it normal? Can you suggest some strategies for thermal management? === '''A''': Yes, it is normal. DM814x/AM387x thermal behavior is strictly related to the process (known as “Hi-Performance / Hi-Leakage”) used to produce the die. The manufacturer chose to focus on maximizing the performance, at the expense of power consumption because the component was conceived to penetrate the high-definition video market segment, which is known to be highly demanding in terms of hardware resources. Please refer to the [[Thermal_management_(Naon)]] page for more information on the thermal management strategies.
= Using NELK =
