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{{Applies To Bora}}

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Providing maximum power consumption of a system-on-module (SOM for short) is virtually impossible because it is extremely hard to define the worst case. This is even more true in case of Bora, where this is affected by the software running on Processing System (PS) side and the Programmable Logic (PL) configuration.

[1] These tests are part of the standard qualification procedure of DAVE Embedded Systems products. Their primary goal is to verify the proper operating of the DUT under conditions of usage that are extremely demanding. Data reported here were excerpted from the logs generated by such tests.

Measurements have been performed on the following platform:

* Bora SOM: DBRD5110I1R

*periodic reading of I2C remote temperature sensor (Texas Instruments TMP421)

*endless loop of writing/reading/verifying operations on memory stick connected to the USB port.

*Tamb: temperature of the ambient surrounding the DUT

*Tj_max: maximum Zynq's junction temperature measured during the test

[1] In spite of the use of heat sink, this value exceeds maximum valued declared by the manufacturer. This is acceptable in case of stress tests, where it is possible that parts of the DUT get damaged.

Measurements have been performed on the following platform:

* Bora SOM: DBRF5110C1R

*periodic reading of I2C remote temperature sensor (TExas Instruments TMP421)

*endless loop of writing/reading/verifying operations on memory stick connected to USB port.

*Tamb: temperature of the ambient surrounding the DUT

*Tj_max: maximum Zynq's junction temperature measured during the test

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Measurements have been performed on the following platform:

* Bora SOM: DBRD4110Q2P-01

[1] In spite of the use of heat sink, this value exceeds maximum valued declared by the manufacturer. This is acceptable in case of stress tests, where it is possible that parts of the DUT get damaged.