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Thermal tests and measurements (SBCX)

423 bytes added, 08:55, 11 October 2016
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==Test beds==
Five different test beds have been considered. From the electronics point of view, all of them are based on the following parts:
*SBCX equipped with industrial iMX6 Dual Lite processor in plastic package (maximum frequency = TBD800 MHz) and 1GB SDRAM
*LCD Ampire AM-800480SETMQW-TA1H.
*still air flow
*software load [1]
** TBDIperf test on 100M ethernet link** StressAppTest with the following parameters <code>-M 340 -s 86400 -C 4 -m 4 -W</code>.For more details please refer to StressAppTest [https://github.com/stressapptest/stressapptest/blob/master/README.md README]** Write/read/verify 100MB binary file on Fat32 partition on uSD** Write/read/verify 100MB binary file on Fat32 partition on USB memory stick** QT Vector Deformation Demo
===Test bed #1===
*Tamb = TBD 22.5 °C
*system layout and configuration
**SBCX and LCD lie on a table horizontally (see also the following picture)
===Test bed #2===
*Tamb = TBD 22.5 °C
*system layout and configuration
**SBCX and LCD are enclosed in a metal box that lies on a table horizontally (see also the following picture)
===Test bed #3===
*Tamb = TBD 22.5 °C
*system layout and configuration
**SBCX and LCD are enclosed in a metal box that is positioned vertically (see also the following picture)
===Test bed #4===
*Tamb = TBD 22.5 °C
*system layout and configuration
**SBCX and LCD are enclosed in a metal box that lies on a table horizontally (see also the following picture)
===Test bed #5===
*Tamb = TBD 22 °C
*system layout and configuration
**sytem layout is the same used in test bed #4, apart from the orientation: in this case the box is vertical
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