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→Introduction
==Introduction==
This document describes the tests that have been performed on SBCX board to characterize thermal behavior of some configurations. The results here presented can be used by integrators building systems upon SBCX board as a basis for comparison. In fact, as stated in the SBCX's Hardware Manual, '''systems integrators have always to perform thermal analysis on the application's definitive configuration. Generally this differs significantly with respect to the use cases here described, in terms of both hardware and software'''.
In the rest of the document:
*Tj denotes the junction temperature of the iMX6 processor
*Tamb denotes the ambient temperature of the space in which the DUT (Device Under Test) has been placed
*ΔT denotes the difference between Tj and Tamb (one the steady-state has been reached).
==Test beds==
