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Thermal tests and measurements (SBCX)

70 bytes added, 07:52, 11 October 2016
Test beds
===Test bed #2===
*Tamb = TBD °C
*system layoutand configuration
**SBCX and LCD are enclosed in a metal box that lies on a table horizontally (see also the following picture)
**iMX6 processor is thermally coupled with an heat sink (Wakefield-Vette 624-60AB-T4E) through TBD
===Test bed #3===
*Tamb = TBD °C
*system layoutand configuration
**SBCX and LCD are enclosed in a metal box that is positioned vertically (see also the following picture)
**iMX6 processor is thermally coupled with an heat sink (TBD) through TBD
===Test bed #4===
*Tamb = TBD °C
*system layoutand configuration
**SBCX and LCD are enclosed in a metal box that lies on a table horizontally (see also the following picture)
**Axel Lite SOM is thermally coupled with to an aluminium heat pipe
***heat pipe dimensions are: 40x22x16.5mm
***on SOM side, heat pipe is placed on the iMX6 processor and top side SDRAM chips; and it is coupled with 40x22x2.03mm gap filler (Hala Thermal TGF-FUS2030-SI)***in turn, heat pipe is thermally coupled with to the metal box with Wakefield non-silicone thermal joint compound Type 126
tbd inserire foto
===Test bed #5===
*Tamb = TBD °C
*system layoutand configuration
**sytem layout is the same used in test bed #4, apart from the orientation: in this case the box is vertical
tbd inserire foto
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