===Test bed #1===
**Tamb = TBD °C**system layout and configuration***SBCX and LCD lie on a table horizontally (see also the following picture)
tbd inserire foto
===Test bed #2===
**Tamb = TBD °C**system layout***SBCX and LCD are enclosed in a metal box that lies on a table horizontally (see also the following picture)***iMX6 processor is thermally coupled with an heat sink (Wakefield-Vette 624-60AB-T4E) through TBD
tbd inserire foto
===Test bed #3===
**Tamb = TBD °C**system layout***SBCX and LCD are enclosed in a metal box that is positioned vertically (see also the following picture)***iMX6 processor is thermally coupled with an heat sink (TBD) through TBD
tbd inserire foto
===Test bed #4===
**Tamb = TBD °C**system layout***SBCX and LCD are enclosed in a metal box that lies on a table horizontally (see also the following picture)***Axel Lite SOM is thermally coupled with an aluminium heat pipe****heat pipe dimensions are: 40x22x16.5mm****on SOM side, heat pipe is placed on the iMX6 processor and top side SDRAM chips; it is coupled with 40x22x2.03mm gap filler (Hala Thermal TGF-FUS2030-SI)
***in turn, heat pipe is thermally coupled with the metal box with Wakefield non-silicone thermal joint compound Type 126
tbd inserire foto
===Test bed #5===
**Tamb = TBD °C**system layout***sytem layout is the same used in test bed #4, apart from the orientation: in this case the box is vertical
tbd inserire foto
