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Five different test beds have been considered. From the electronics point of view, all of them are based on the following parts:
*SBCX equipped iMX6 Dual Lite processor (maximum frequency = TBD) and 1GB SDRAM
*LCD TBDAmpire AM-800480SETMQW-TA1H.
Settings common to all test beds:
===Test bed #1===
**Tamb = TBD °C
**system layoutand configuration
***SBCX and LCD lie on a table horizontally (see also the following picture)
tbd inserire foto
**system layout
***SBCX and LCD are enclosed in a metal box that lies on a table horizontally (see also the following picture)
***iMX6 processor is thermally coupled with an heat sink (TBDWakefield-Vette 624-60AB-T4E) through TBD
tbd inserire foto
****heat pipe dimensions are: 40x22x16.5mm
****on SOM side, heat pipe is placed on the iMX6 processor and top side SDRAM chips; it is coupled with 40x22x2.03mm gap filler (Hala Thermal TGF-FUS2030-SI)
tbd inserire foto