Bureaucrats, dave_user, Administrators
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*software load [1]
** TBD.
===Test bed #1===
**system layout
***SBCX and LCD are enclosed in a metal box that lies on a table horizontally (see also the following picture)
***iMX6 processor Axel Lite SOM is thermally coupled with an aluminium heat pipe ****heat pipe dimensions are: 40x22x16.5mm****on SOM side, heat pipe is placed on the iMX6 processor and top side SDRAM chips; it is coupled with 40x22x2.03mm gap filler (TBDHala Thermal TGF-FUS2030-SI) through TBD****heat pipe is thermally coupled with the metal box with
***in turn, heat pipe is thermally coupled with the box through TBD
tbd inserire foto
**Tamb = TBD °C
**system layout
***SBCX and LCD are enclosed in a metal box that sytem layout is positioned vertically (see also the following picture)***iMX6 processor is thermally coupled with an aluminium heat pipe (TBD) through TBD***same used in turntest bed #4, heat pipe is thermally coupled with apart from the orientation: in this case the box through TBDis vertical
tbd inserire foto
