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{{AppliesToSBCX}}
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__FORCETOC__
Settings common to all test beds:
*SBCX supply voltage: 12V
*Linux governor: TBDperformance*LCD backlight intensity: 100%(in terms of power, this is about 1.6W)
*still air flow
*software load [1]
*system layout and configuration
**SBCX and LCD lie on a table horizontally (see also the following picture)
===Test bed #2===
*system layout and configuration
**SBCX and LCD are enclosed in a metal box that lies on a table horizontally (see also the following picture)
**iMX6 processor is thermally coupled with an heat sink (Wakefield-Vette 624-60AB-T4E) through TBDthe provided adhesive tapetbd inserire foto[[File:SBCX thermal test bed 2.jpg|thumb|center|400px|Test bed #2]]
===Test bed #3===
*Tamb = 22.5 °C
*system layout and configuration
**SBCX and LCD are enclosed in a metal box (Stainless Steel AISI430) that is positioned vertically (see also the following picture)**iMX6 processor is thermally coupled with an heat sink (TBDWakefield-Vette 624-60AB-T4E) through TBDthe provided adhesive tape [[File:SBCX thermal test bed 3 front.jpg|thumb|center|400px|Test bed #3 front view]]tbd inserire foto[[File:SBCX thermal test bed 3 back.jpg|thumb|center|400px|Test bed #3 back view]]
===Test bed #4===
*Tamb = 22.5 °C
*system layout and configuration
**SBCX and LCD are enclosed in a metal box that lies on a table horizontally (see also the following picturelike test bed #2)
**Axel Lite SOM is thermally coupled to an aluminium heat pipe
***heat pipe dimensions are: 40x22x16.5mm[1]
**on SOM side, heat pipe is placed on the iMX6 processor and top side SDRAM chips and it is coupled with 40x22x2.03mm gap filler (Hala Thermal TGF-FUS2030-SI)
***in turn, heat pipe is thermally coupled to the metal box with Wakefield -Vette non-silicone thermal joint compound Type 126
[[File:Heat-pipe-thermal-coupling.png|thumb|center|600px|Test bed #4: thermal couplings]]
===Test bed #5===
*Tamb = 22 °C
*system layout and configuration
**sytem layout is the same used in test bed #4, apart from the orientation: in this case the box is verticallike test bed #3tbd inserire foto [1] Original dimensions. Heat pipe has been tailored to fit enclosure shape.
==Results==
*test bed #1
**overall power consumption (steady state): TBD 6.27 W (max 7.47 W) [1]**SOM power consumption (steady state): TBD 2.85 W (max 3.68 W) [1]**Tj = TBD 83 °C**∆T = Tj - Tamb = TBD 60.5 °C
*test bed #2
**overall power consumption (steady state): TBD 6.5 W (max 7.72 W) [1]**SOM power consumption (steady state): TBD 2.9 W (max 3.8 W) [1]**Tj = TBD 87 °C**∆T = Tj - Tamb = TBD 64.5 °C
*test bed #3
**overall power consumption (steady state): TBD 6.5 W (max 7.68 W) [1]**SOM power consumption (steady state): TBD 2.9 W (max 3.72 W) [1]**Tj = TBD 83 °C**∆T = Tj - Tamb = TBD 60.5 °C
*test bed #4
**overall power consumption (steady state): TBD 6.37 W (max 7.55 W) [1]**SOM power consumption (steady state): TBD 2.8 W (max 3.65 W) [1]**Tj = TBD 66 °C**∆T = Tj - Tamb = TBD 43.5 °C
*test bed #5
**overall power consumption (steady state): TBD 6.39 W (max 7.48 W) [1]**SOM power consumption (steady state): TBD 2.8 W (max 3.61 W) [1]**Tj = TBD 66 °C**∆T = Tj - Tamb = TBD 44 °C
[1] Even if the software load is the same for all of the test beds, overall and SOM power consumptions may differ across the test beds. This is due to the silicon static power consumption that is a function of the temperature itself.
==Useful links==
*[[Power management (Axel)]]