This document describes the tests that have been performed on SBCX board to characterize thermal behavior of some configurations. The results here presented can be used by integrators building systems upon SBCX board as a basis for comparison. In fact, as stated in the SBCX's Hardware Manual, '''systems integrators have always to perform thermal analysis on the application's definitive configuration that generally . Generally this differs significantly with respect to the use cases here described, in terms of both hardware and software'''. In the rest of the document:*Tj denotes the junction temperature of the iMX6 processor*Tamb denotes the ambient temperature of the space in which the DUT (Device Under Test) has been placed*ΔT denotes the difference between Tj and Tamb (one the steady-state has been reached).

*SBCX equipped with industrial iMX6 Dual Lite processor in plastic package (maximum frequency = TBD800 MHz) and 1GB SDRAM

*Linux governor: TBDperformance*LCD backlight intensity: 100%(in terms of power, this is about 1.6W)

** TBDIperf test on 100M ethernet link** StressAppTest with the following parameters <code>-M 340 -s 86400 -C 4 -m 4 -W</code>.For more details please refer to StressAppTest [https://github.com/stressapptest/stressapptest/blob/master/README.md README]** Write/read/verify 100MB binary file on Fat32 partition on uSD** Write/read/verify 100MB binary file on Fat32 partition on USB memory stick** QT Vector Deformation Demo

*Tamb = TBD 22.5 °C

*Tamb = TBD 22.5 °C

**iMX6 processor is thermally coupled with an heat sink (Wakefield-Vette 624-60AB-T4E) through TBDthe provided adhesive tapetbd inserire foto[[File:SBCX thermal test bed 2.jpg|thumb|center|400px|Test bed #2]]

*Tamb = TBD 22.5 °C

**SBCX and LCD are enclosed in a metal box (Stainless Steel AISI430) that is positioned vertically (see also the following picture)**iMX6 processor is thermally coupled with an heat sink (TBDWakefield-Vette 624-60AB-T4E) through TBDthe provided adhesive tape [[File:SBCX thermal test bed 3 front.jpg|thumb|center|400px|Test bed #3 front view]]tbd inserire foto[[File:SBCX thermal test bed 3 back.jpg|thumb|center|400px|Test bed #3 back view]]

*Tamb = TBD 22.5 °C

**SBCX and LCD are enclosed in a metal box that lies on a table horizontally (see also the following picturelike test bed #2)

***heat pipe dimensions are: 40x22x16.5mm[1]

***in turn, heat pipe is thermally coupled to the metal box with Wakefield -Vette non-silicone thermal joint compound Type 126tbd inserire foto [[File:Heat-pipe-thermal-coupling.png|thumb|center|600px|Test bed #4: thermal couplings]]

*Tamb = TBD 22 °C

**sytem layout is the same used in test bed #4, apart from the orientation: in this case the box is verticallike test bed #3tbd inserire foto  [1] Original dimensions. Heat pipe has been tailored to fit enclosure shape.

**overall power consumption (steady state): TBD 6.27 W (max 7.47 W) [1]**SOM power consumption (steady state): TBD 2.85 W (max 3.68 W) [1]**Tj = TBD 83 °C**∆T = Tj - Tamb = TBD 60.5 °C

**overall power consumption (steady state): TBD 6.5 W (max 7.72 W) [1]**SOM power consumption (steady state): TBD 2.9 W (max 3.8 W) [1]**Tj = TBD 87 °C**∆T = Tj - Tamb = TBD 64.5 °C

**overall power consumption (steady state): TBD 6.5 W (max 7.68 W) [1]**SOM power consumption (steady state): TBD 2.9 W (max 3.72 W) [1]**Tj = TBD 83 °C**∆T = Tj - Tamb = TBD 60.5 °C

**overall power consumption (steady state): TBD 6.37 W (max 7.55 W) [1]**SOM power consumption (steady state): TBD 2.8 W (max 3.65 W) [1]**Tj = TBD 66 °C**∆T = Tj - Tamb = TBD 43.5 °C

**overall power consumption (steady state): TBD 6.39 W (max 7.48 W) [1]**SOM power consumption (steady state): TBD 2.8 W (max 3.61 W) [1]**Tj = TBD 66 °C**∆T = Tj - Tamb = TBD 44 °C