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**this model is based on Zynq XC7Z020-1I (Tj: -40° / +100°)
* carrier board: [[BoraEVB]]
* processor frequency: 666 667 MHz
* FPGA frequency
**30 MHz (Tamb = +85°C)
*Linux kernel: <code>3.15.0-bora-2.1.0-xilinx-00044-g372fcab #5 SMP PREEMPT Thu Oct 23 13:54:38 CEST 2014 armv7l GNU/Linux</code>
*root file system mounted over Gigabit Ethernet link.
Please note that, when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heatsink heat sink to prevent exceeding maximum Zynq's junction temperature.
At application level, PS executes concurrently several tasks including:
**this model is based on Zynq XC7Z020-3E (Tj: 0 / +100°)
* carrier board: [[BoraEVB]]
* processor frequency: 866 867 MHz
* FPGA frequency
**10 MHz (Tamb = +75°C)
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==Configuration #3==
===Testbed===
Measurements have been performed on the following platform:
* Bora SOM: DBRD4110Q2P-01
**this model is based on Zynq XQ7Z020-1Q (Tj: -40° / +125°)
* carrier board: [[BoraEVB]]
* processor frequency: 667 MHz
* FPGA frequency
**30 MHz (Tamb = +85°C)
**150 MHz (Tamb = +-40°C)
*U-Boot: <code>2013.04 (Aug 25 2014 - 23:52:57) [belk-2.1.0]</code>
*Linux kernel: <code>3.17.0-bora-2.1.0-xilinx-00053-gb95579a</code>
*root file system mounted over Gigabit Ethernet link.
Please note that, when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junction temperature.
At application level, PS executes concurrently several tasks including:
*two instances of <code>burnCortexA9</code>
*periodic reading of I2C RTC (Maxim DS3232M)
*periodic reading of Zynq's ADCs
*periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail
*one instance of <code>memtester</code> over 50 MByte of SDRAM
*endless loop of writing/reading/verifying operations on microSD card
*periodic reading of I2C remote temperature sensor (TExas Instruments TMP421)
*endless loop of writing/reading/verifying operations on memory stick connected to USB port
*endless loop of writing/reading/verifying operations on NAND flash memory.
===Results===
*Tamb: temperature of the ambient surrounding the DUT
*Tj_max: maximum Zynq's junction temperature measured during the test
*P_max: maximum power absorption of Bora SOM
{| class="wikitable" border="1"
!Tamb [°C]
!Tj_max [°C]
!FPGA clock frequency [MHz]
!P_max [W]
|-
|85
|140.0 [1]
|40
|7.0
|-
| -40
|35.5
|150
|7.3
|-
|}
[1] In spite of the use of heat sink, this value exceeds maximum valued declared by manufacturer. This is acceptable in case of stress tests, where it is possible that the parts of the DUT get damaged.
