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==Introduction==
This Technical Note (TN for short) belongs to the series introduced [[ML-TN-003 — AI at the edge: visual inspection of assembled PCBs for defect detection — Part 1|here]]. Specifically, it illustrates the attempt of employing ML and image processing techniques in the field of PCB-AVI for building a proprietary dataset of SMD-populated PCBs exhibiting mounting anomalies.
==Building the dataset==
