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==Building the dataset==
===Defects generation and acquisition===
For this first attempt, 5 panels are prepared, each one containing 4 PCBs of the same type and with same template project i.e. the bill of materials (BOM) for the [https://www.dave.eu/en/solutions/system-on-modules/diva-som ''DIVA series 2'']. In this case, it has been decided to mount components only on ''top'' side of the PCB. Furthermore, in order to reduce complexity and simplify the problem for this test, anomalies generation is restricted to 2 contacts SMD passive components i.e. resistors, capacitors, and inductors. The table below reports all plausible anomalies that can be generated by editing the standard template project containing all the positions of the components for the P&P machine, decreasing or increasing the quantity of solder deposited by the serigraphy on the panel or that can be generated directly by the operator.
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Following it is reported a brief description for all the anomalies:
*'''Missing''': the component is not in place according to the PCB design and indeed is not mounted on the board.
*'''Manhattan''': the component is in place but is erected horizontally (the operation has to be performed manually by the operator).
*'''Shift x-axis''': the component is in place according to the PCB design but shows a small shift along its x-axis.
*'''Shift y-axis''': the component is in place according to the PCB design but shows a small shift along its y-axis.
*Shift&Rotation (x+z-axes)''': the component is in place according to the PCB design but is shifted along its x-axis and rotated along its zaxis.
*Rotation (z-axis): the component is in place according to the PCB design but is rotated along its z-axis.
*'''Under soldering''': the amount of deposited solder is higher than normal.
*'''Over soldering''': the amount of deposited solder is less than normal.
The same template for the P&P machine is used for all the 5 panels, but some of them use a different configuration for the program of the serigraph machine:
*2 panels use the normal amount of solder paste;
*1 panel uses more than the normal amount of solder. In this case solder is re-applied several times;
*1 panel uses less than the normal amount of solder;
*1 panel uses the normal amount of solder, but shifts along x and y axes are applied too.
After completing the assembly of all 5 panels, a visual inspection was performed with the AOI machine. A total amount of '''832 anomalies''' were found and the corresponding unmarked images were saved for dataset building.
===Class subdivision and labelling===
[[File:Samples of defects divided by classes.png|center|thumb|500x500px|Examples of four types of defects]]
For labelling labeling the images [https://www.makesense.ai/ ''makesense−ai''] tool was used.
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