dave_user
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==Building the dataset==
===Defects generation and acquisition===
{| class="wikitable" style="text-align:center;"
|- style="font-weight:bold;"
|+'''Anomalies, generation process and numerosity'''
! Anomaly
! P&P
! Serigraphy
! Manual
! Numerosity
|-
| Missing
| ✓
|
|
| 21
|-
| Manhattan
|
|
| ✓
| 4
|-
| Shift x-axis
| ✓
|
|
| 51
|-
| Shift y-axis
| ✓
|
|
| 58
|-
| Shift&Rotation<br />(shift x+z-axes)
| ✓
|
|
| 57
|-
| Rotation<br />(z-axis)
| ✓<br />
|
|
| 55
|-
| Under soldering
|
| ✓
|
| All
|-
| Over soldering
|
| ✓
|
| All
|}
===Class subdivision and labelling===
===Soldering regions extraction===
*Tero Karras, Timo Aila, Samuli Laine, Jaakko Lehtinen, [https://arxiv.org/abs/1710.10196 ''Progressive Growing of GANs for Improved Quality, Stability, and Variation''], February 2018.
* Ishaan Gulrajani, Faruk Ahmed, Martin Arjovsky, Vincent Dumoulin, Aaron Courville, [https://arxiv.org/abs/1704.00028 ''Improved Training of Wasserstein GANs''], December 2017.
*[https://shop.ipc.org/IPC-A-610E-English-D ''IPC-A-610E: Acceptability of Electronic Assemblies''], a standard developed by IPC, April 2010.
