Difference between revisions of "ML-TN-003 — AI at the edge: visual inspection of assembled PCBs for defect detection — Part 3"
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==Introduction== | ==Introduction== | ||
| + | |||
| + | ==Building the dataset== | ||
| + | ===Defects generation and acquisition=== | ||
| + | ===Class subdivision and labelling=== | ||
| + | ===Soldering regions extraction=== | ||
| + | |||
| + | ==Data augmentation with image synthesis== | ||
| + | ===Generative adversarial networks=== | ||
| + | ===Progressive GAN implementation=== | ||
| + | ==Results validation== | ||
==Useful links== | ==Useful links== | ||
Revision as of 09:22, 14 April 2021
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History[edit | edit source]
| Version | Date | Notes |
|---|---|---|
| 1.0.0 | March 2021 | First public release |
