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This Technical Note (TN for short) belongs to the series introduced [[ML-TN-003 — AI at the edge: visual inspection of assembled PCBs for defect detection — Part 1|here]]. Specifically, it illustrates thefirst issue to be considered to implement a device capable to spot mounting defects on an assembled PCB. In ML terminology, we are dealing again with a classification problem. From an engineering perspective, one of the main goals of this work is still the evaluation of the Xilinx's DPU performances on inference tasks in terms of latency and throughput. However, coping with another classification problem also allowed to evaluate how different deep CNN models perform on the same problem.