* From the mechanical standpoint adoption of LCC outline guarantees a solid and firm mating with carrier board hosting DUL

* About power supply, two inputs are provided:

** VIN_AUX (available on request): this input is provided to implement a second power supply unit on carrier board (for example based on supercap or battery) that prevents power cut in case main supply experiences a glitch or a power cut. This option is a powerful weapon to face unpredictable power loss and to guarantee data integrity.

* NAND flash: by default NAND technology is SLC. MLC memories are available on request.

** to prevent data corruption in case of power failure

** to recover from unexpected power-off .

==Specification==

* Package outline: Leadless Chip Carrier aka LCC-68 (JEDEC MS004), 9 actual leads per side

* Operating temperature range: -40/+85°C

===Pinout===