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LCC USB SSD (DUL)

162 bytes added, 13:54, 25 February 2015
Pinout and detailed pin functions
{{ImportantMessage|text=Please note that information here provided are preliminary and subject to change.}}
==Introduction==
DUL belongs to the [[:Category:SSD modules|Dave '''DAVE Embedded Systems''' Solid State Disk (SSD)]] product family. These devices implements SSD solutions that are conceived for use in embedded systems operating in harsh environments where no compromises are tolerated about reliability. On the other hand, they are designed in order to ease the use from the system integrator's standpoint, in terms of hardware issues and software compatibility. These characteristics make them suited for use in combination with a wide range of host devices, from low-cost microcontrollers to high-end embedded processors.
SSD product family is composed by several subfamilies. Two major factors distinguish subfamilies: mechanical outline and host interface. DUL comes in Leadless Chip Carrier (LCC) package. Host interface is USB. Non-volatile storage is based on NAND flash technology.
* From the mechanical standpoint, adoption of LCC outline guarantees a solid and firm mating with carrier board hosting DUL making this product particularly suited for environments where mechanical vibrations are an issue.
* About power supply, two inputs are provided along with status indicators:
** VIN: this is main power supply input. See [[#Pinoutand detailed pin functions|Pinout]] section for more information about voltage range.
** VIN_AUX (available on request): this input is provided to implement a second power supply unit on carrier board (for example based on supercap or battery) that prevents power cut in case main supply experiences a glitch or a power cut. This option is a powerful weapon to face unpredictable power loss and to guarantee data integrity.
** Power rail switch indicator.
** to recover from unexpected power-off
[[File:Dul-ruler.png|thumbnail|center|]]
 
==Specification==
* Package outline: Leadless Chip Carrier LCC-68 (JEDEC MS004); 9 actual leads per side are implemented
| 9||13||NC||||Reserved for future use||-||Please leave unconnected.
|-
| 10||22||STAT2#||Open-drain output||Status indicator for backup power supply. Pulls down when power is drawn from VIN_AUX rail.||||Can be left open or grounded when not used. When used, it must be pulled-hi.
|-
| 11||23||WARN#||Open-drain output||Overcurrent/thermal warning indicator. Pulls down when either main power supply or backup power supply current exceeds its current limit (4A) or die temperature of internal switch (130°C) is close to thermal shutdown.||||Can be left open or grounded when not used. When used, it must be pulled-hi.
|-
| 12||24||STAT1#||Open-drain output||Status indicator for main power supply. Pulls down when power is drawn from VIN_AUX VIN rail.||||Can be left open or grounded when not used. When used, it must be pulled-hi.
|-
| 13||25||NC||||Reserved for future use||-||Please leave unconnected.
==Qualification tests==
===* [[Data integrity===TBD===and I/O performance===TBDtests (DUL)]]