Hardware Manual (Bora)

Info Box Applies to Bora

Preface

About this manual

This Hardware Manual describes the Bora CPU module design and functions. Precise specifications for the Xilinx Zynq processor can be found in the CPU datasheets and/or reference manuals.

Copyright/Trademarks

Ethernet® is a registered trademark of XEROX Corporation.

All other products and trademarks mentioned in this manual are property of their respective owners.

All rights reserved. Specifications may change at any time without notice.

Standards

Dave SrL is certified to ISO 9001 standards.

Disclaimers

DAVE does not assume any responsibility about availability, supplying and support regarding all the products mentioned in this manual that are not strictly part of the Bora CPU module. Bora CPU Modules are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Dave Srl customers who are using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Dave Srl for any damage resulting from such improper use or sale.

Warranty

Bora is warranted against defects in material and workmanship for the warranty period from the date of shipment. During the warranty period, Dave Srl will at its discretion decide to repair or replace defective products. Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed. The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper installation or maintenance. Dave Srl will not be responsible for any defects or damages to other products not supplied by Dave Srl that are caused by a faulty Bora module.

Technical Support

We are committed to making our product easy to use and will help customers use our CPU modules in their systems. Technical support is delivered through email to our valued customers. Support requests can be sent to support-bora@dave.eu. Software upgrades are available for download in the restricted access download area of DAVE web site: http://www.dave.eu/reserved-area. An account is required to access this area and is provided to customers who purchase the development kit (please contact support-bora@dave.eu for account requests).. Please refer to our Web site at http://www.dave.eu/dave-cpu-module-zynq-bora.html for the latest product documentation, utilities, drivers, Product Change Notifications, Board Support Packages, Application Notes, mechanical drawings and additional tools and software.

Related Documents

Table: related documents

Document	Location
Dave Developers' Wiki	http://wiki.dave.eu/index.php/Main_Page

Hardware Manual in PDF format

Please download the Bora Hardware Manual in pdf format

Conventions, Abbreviations, Acronyms

Table: Abbreviations and acronyms used in this manual

Abbreviation	Definition
BTN	Button
GPI	General Purpose Input
GPIO	Generla Purpose Input and Output
GPO	General Purpose Output
BELK	Bora Embedded Linux Kit
PCB	Printed Circuit Board
RTC	Real Time Clock
SOM	System On Module
PMIC	Power Managemente Integrated Circuit

Introduction

BORA is the new top-class Dual Cortex-A9 + FPGA CPU module by DAVE, based on the recent Xilinx Zynq XC7Z010/XC7Z020 application processor. Thanks to BORA, customers are going to save time and resources by using a compact solution that includes both a CPU and an FPGA, avoiding complexities on the carrier PCB. The use of this processor enables extensive system-level differentiation of new applications in many industry fields, where high performances and extremely compact form factor (85mm x 50mm) are key factors. Smarter system designs are made possible, following the trends in functionalities and interfaces of the new, state-of-the-art embedded products. BORA offers great computational power, thanks to the rich set of peripherals, the Dual Cortex-A9 and the Artix-7 FPGA together with a large set of high-speed I/Os (up to 5GHz). BORA enables designers to create rugged products suitable for harsh mechanical and thermal environments, allowing the development of the most advanced and robust products. Thanks to the tight integration between the ARM-based processing system and the on-chip programmable logic, designers are free to add virtually any peripheral or create custom accelerators that extend system performance and better match specific application requirements. BORA is designed and manufactured according to DAVE Ultra Line specifications, in order to guarantee premium quality and technical value for customers who require top performances and flexibility. BORA is suitable for high-end applications such as medical instrumentation, advanced communication systems, critical real-time operations and safety applications.

Product Highlights

• Unmatched performance thanks to dual ARM Cortex-A9 @ 800 MHz
• All memories you need: on-board NOR and NAND Flash
• Enabling smarter system thanks to Artix-7 FPGA integrated on chip
• FPGA banks with wide-range PSU input (from 1.2V to 3.3V)
• Highest security and reliability: internal voltage monitoring and power good enable
• Reduced carrier complexity: dual CAN, USB, Ethernet GB and native 3.3V I/O
• Easy to fi t thanks to its small form factor
• Precise timing application thanks to on-board 5ppm RTC

Block Diagram

The following image shows Bora's block diagram:

Feature Summary

Table: CPU and Memories

Feature	Specifications	Options
CPU	Xilinx Dual ARM Cortex-A9 ZYNQ XC7Z010/ZC7Z020 @ 800MHz
Cache	L1: 32Kbyte instruction, 32Kbyte data L2: 512Kbyte for each core
RAM	DDR3 SDRAM @ 533 MHz Up to 1 GB
Storage	Flash NOR SPI (8, 16, 32 MB) Flash NAND (all sizes, on request)

Table: Peripherals

Feature	Specifications	Options
Coprocessors	NEON™ & Single / Double Precision Floating Point for each processor
USB	Up to 2x 2.0 OTG ports
UARTs	Up to 2x UART ports
GPIO	Up to x lines, shared with other functions (interrupts available)
Networks	Fast Ethernet 10/100Mbps
CAN	2x full CAN 2.0B compliant interfaces
SD/MMC	2x SD/SDIO 2.0/MMC3.31 compliant controllers
Serial buses	2x full-duplex SPI ports with three peripheral chip selects 2x master and slave I²C interfaces
Timers	2x triple timers/counters (TTC)
RTC	On board (DS3232), external battery powered
Debug	JTAG IEEE 1149.1 Test Access Port CoreSight™ and Program Trace Macrocell (PTM)

Table: Electrical, Mechanical and Environmental Specifications

Feature	Specifications	Options
FPGA model	Artix™-7
Logic cells	28K to 56K
LUTs	17K to 53K
Flip flops	35K to 100K
RAM	240KB to 560KB
DSP slices	80 to 220
Differential pairs	Up to 34 differential pairs for high freq. interfaces

Table: Electrical, Mechanical and Environmental Specifications

Feature	Specifications	Options
Supply Voltage	3.3V, on-board voltage regulation
Active power consumption	Please refer to Power consumption section
Dimensions	85mm x 50mm
Weight
MTBF
Operating temperature	0..70 °C -40..+85 °C
Connectors	3 x 140 pins 0.6mm pitch

Design Overview

The heart of Bora module is composed of the following components:

• Xilinx Zynq Z-7010 (XC7Z010) / Z-7020 (XC7Z020) SoC
• Power supply unit
• DDR memory banks
• NOR and NAND flash banks
• 3x 140 pin connectors with interfaces signals

This chapter shortly describes the main Bora components.

Processor Info

The Zynq™-7000 family is based on the Xilinx Extensible Processing Platform (EPP) architecture. These products integrate a feature-rich dual-core ARM® Cortex™-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single device. The ARM Cortex-A9 CPUs are the heart of the PS and also include on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces. The Zynq-7000 family offers the flexibility and scalability of an FPGA, while providing performance, power, and ease of use typically associated with ASIC and ASSPs. The range of devices in the Zynq-7000 AP SoC family enables designers to target cost-sensitive as well as high-performance applications from a single platform using industry-standard tools. While each device in the Zynq-7000 family contains the same PS, the PL and I/O resources vary between the devices. As a result, the Zynq-7000 AP SoC devices are able to serve a wide range of applications including:

• Automotive driver assistance, driver information, and infotainment
• Broadcast camera
• Industrial motor control, industrial networking, and machine vision
• IP and Smart camera
• LTE radio and baseband
• Medical diagnostics and imaging
• Multifunction printers
• Video and night vision equipment

The following table shows a comparison between the devices, highlighting the differences:

Table: XC7-Z0x0 comparison

Processor	Programmable logic cells	LUTs	Flip flops	Extensible block RAM	DSP slices	Peak DSP performance
XC7Z010	28K Logic Cells	17600	35200	240 KB	80	58 GMACs
XC7Z020	85K Logic Cells	53200	106400	560 KB	220	158 GMACs

RAM memory bank

DDR3 SDRAM memory bank is composed by 2x 16-bit width chips resulting in a 32-bit combined width bank.

Table: XC7-Z0x0 comparison

CPU connection	SDRAM bus
Size min	512 MB
Size max	1 GB
Width	32 bit
Speed	533 MHz

NOR flash bank

NOR flash is a Serial Peripheral Interface (SPI) device. By default this device is connected to SPI channel 0 and acts as boot memory.

NAND flash bank

On board main storage memory is a 8-bit wide NAND flash. By default it is connected to chip select.

Memory map

This section will be completed in a future version of this manual.

Power supply unit

Bora, as the other Ultra Line CPU modules, embeds all the elements required for powering the unit, therefore power sequencing is self-contained and simplified. Nevertheless, power must be provided from carrier board, and therefore users should be aware of the ranges power supply can assume as well as all other parameters. For detailed information, please refer to Section 5.1.

CPU module connectors

All interface signals Bora provides are routed through three 140 pin 0.6mm pitch stacking connectors (named J1, J2 and J3). The dedicated carrier board must mount the mating connectors and connect the desired peripheral interfaces according to Bora pinout specifications.

Mechanical specifications

This chapter describes the mechanical characteristics of the Bora module.

Board Layout

The following figure shows the physical dimensions of the Bora module:

The following figure highlights the maximum components' heights on Bora module:

Connectors

The following figure shows the Diva connector layout:

Power, reset and control

Power Supply Unit (PSU) and recommended power-up sequence

The recommended power-up sequence is:

Reset scheme and voltage monitoring

Some of these reset signals are accessible by carrier board circuitry as described below.

Pinout table

This chapter contains the pinout description of the connectors of the Bora module.

Operational Characteristics

Maximum ratings

Parameter	Min	Typ	Max	Unit
Main power supply voltage				V

Recommended ratings

Parameter	Min	Typ	Max	Unit
Main power supply voltage				V

Heat dissipation

This section will be completed in a future version of this manual.

Application notes

Please refer to the following documents available on Dave Developers Wiki:

• Carrier_board_design_guidelines_(SOM)
• Integration_guide_(Bora)