BORA Xilinx ZYNQ XC7Z010/XC7Z020 CPU moduleEdit

BORA is the new top-class Dual Cortex-A9 + FPGA CPU module by DAVE Embedded Systems, based on the recent Xilinx Zynq XC7Z010/XC7Z020 application processor. Thanks to BORA, customers are going to save time and resources by using a compact solution that includes both a CPU and an FPGA, avoiding complexities on the carrier PCB.

BORA is designed and manufactured according to DAVE Embedded Systems Ultra Line specifications, in order to guarantee premium quality and technical value for customers who require top performances and flexibility.

The Hardware Manual (Bora) provides detailed information about hardware interfaces and characteristics. This document will provide a functional overview of the module and will focus on system-related issues.

Please visit BORA Web Page for more product information.

Main FeaturesEdit

• Unmatched performance thanks to dual ARM Cortex-A9 @ 800 MHz
• Up to 1 GB DDR3 SDRAM
• All memories you need: on-board NOR and NAND Flash
• Enabling smarter system thanks to Artix-7 FPGA integrated on chip
• FPGA banks with Wide range of PSU input (from 1.2V to 3.3V)
• Highest security and reliability: internal voltage monitoring and power good enable
• Reduced carrier complexity: DUAL CAN, USB, Ethernet GB and native 3.3V I/O
• Dual-CAN controller
• Gigabit Ethernet LAN and additional GMII/MII interface
• Up to 2x USB OTG
• Up to 2x UART
• Up to 2x I²C
• Up to 2x SPI
• Precise timing application thanks to on-board 5ppm RTC
• Easy to fi t thanks to its Small form factor: 85mm x 50mm
• Industrial (-40/+85°C) operating temperature range

BORA technical specificationEdit

CPU and Memories Feature Specifications Options CPU Xilinx Dual ARM Cortex-A9 ZYNQ XC7Z010/ZC7Z020 @ 800MHz Cache L1: 32Kbyte instruction, 32Kbyte data L2: 512Kbyte for each core RAM DDR3 SDRAM @ 533 MHz Up to 1 GB SRAM On-chip RAM, 256 KB Storage Flash NOR SPI (8, 16 MB) Flash NAND (all sizes, on request - Up to 1GB) Peripherals Feature Specifications Options Coprocessors NEON™ & Single / Double Precision Floating Point for each processor USB Up to 2x 2.0 OTG ports UARTs Up to 2x UART ports GPIO Up to x lines, shared with other functions (interrupts available) Networks Ethernet 10/100/1000 Mbps CAN 2x full CAN 2.0B compliant interfaces SD/MMC 2x SD/SDIO 2.0/MMC3.31 compliant controllers Serial buses 2x full-duplex SPI ports with three peripheral chip selects 2x master and slave I²C interfaces Timers 2x triple timers/counters (TTC) RTC On board (DS3232), external battery powered Debug JTAG IEEE 1149.1 Test Access Port CoreSight™ and Program Trace Macrocell (PTM) Electrical, mechanical and environmentale spesifications Feature Specifications Options FPGA model Artix™-7 Logic cells 28K to 56K LUTs 17K to 53K Flip flops 35K to 100K RAM 240KB to 560KB DSP slices 80 to 220 Differential pairs Up to 34 differential pairs for high freq. interfaces Electrical, mechanical and environmentale spesifications Feature Specifications Options Supply Voltage 3.3V, on-board voltage regulation Active power consumption Please refer to Power consumption section Dimensions 85mm x 50mm Weight MTBF Operating temperature 0..70 °C -40..+85 °C Connectors 3 x 140 pins 0.6mm pitch

BORA Web Page BORA leaflet BORA Block Diagram

Hardware DocumentationEdit

Software DocumentationEdit

BORA Evaluation KitEdit

BORA Evaluation Kit BELK-L-S is a development/test board designed to start working with the BORA platform and experimenting with the implemented features. The carrier board hosts a BORA CPU module.

Please refer to this page for more details.

Stay tuned with updates: BORA RSS FeedEdit

Please subscribe to the Bora Pages Updates RSS Feed using your favourite RSS reader to be notified on wiki pages updates related to BORA.

Please refer to the Keeping updated on DAVE Embedded Systems Developer's wiki pages modifications section for further information on how to subscribe to the RSS feed.

Index of topics about BORA SoMEdit

This category collects all the pages specific to Bora modules and related carrier boards.