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Please Heat is generated by all semiconductors while operating and it is dissipated into the surrounding environment. This amount of heat is a function of the power consumed and the thermal resistance of the device package. Every silicon device on an electronic board must work within the limits of its operating temperature parameters (eg, the junction temperature) as specified by the silicon vendor. Failure to maintain the temperature within safe ranges reduces operating lifetime, reliability, and performances and may cause irreversible damage to the system. Therefore, the product design cycle should include thermal analysis to verify that the device works within its functional limits. If the temperature is too high, component or system-level thermal enhancements are required to dissipate the heat from the system. For detailed information, please refer to the following documents:
→Thermal Management
==Thermal Management==
* [[Thermal management (Naon)]]
* [http://processors.wiki.ti.com/index.php/AM335x_Thermal_Considerations AM335x Thermal Considerations]
