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|-03.314|3.3|3.646

|3.135

|3.465

Providing theoretical maximum power consumption value would be useless for the majority of system designers building their application upon BORA modulebecause, in most cases, this would lead to an over-sized power supply unit. Practically Several configurations have been tested in order to provide figures that are measured on real-world use cases instead.Please note that BORA platform is so flexible that it is virtually impossible to test for all possible configurations and applications on the market. The use cases here presented should cover most of real-world scenarios. However actual customer application might require more power than values reported here. Generally speaking, these figures would application specific requirements have to be of no help when it comes taken into consideration in order to size power supply unit or and to perform implement thermal design of real systemsmanagement properly.

Please note that Measurements have been performed on the BORA platform SOM under test is so flexible that it equipped with: * Bora SOM: DBRD5110I1R this model is virtually impossible to test for all possible configurations and applications based on the marketZynq XC7Z020-1I (Tj: -40°C / +100°C)* carrier board: BoraEVB* processor frequency: 667 MHz* FPGA frequency** 30 MHz (Tamb = +85°C)** 150 MHz (Tamb = +-40°C)* U-Boot: 2014.07-00067-g4b98484 (Oct 24 2014 - 17:28:32) [belk-2.1. 0]The use cases here presented should cover most of real* Linux kernel: 3.15.0-bora-world scenarios2.1. 0-xilinx-00044-g372fcab #5 SMP PREEMPT Thu Oct 23 13:54:38 CEST 2014 armv7l GNU/LinuxHowever actual customer's application might require more power than values reported here or customer's use case may be differ significantly with respect to the ones here considered* root file system mounted over Gigabit Ethernet link.

ThereforePlease note that, when Tamb has been set to +85°C, the Bora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junctiontemperature.At the application-specific requirements have always to be taken into consideration in order level, PS executes concurrently several tasks including:* two instances of burnCortexA9* periodic reading of I2C RTC (Maxim DS3232M)* periodic reading of Zynq's ADCs* periodic reading of voltage/current probe (Texas Instruments INA226) connected to size the SOM's power supply unit and rail* one instance of memtester, exercising 50 MByte of SDRAM* endless loop of writing/reading/verifying operations on microSD card* periodic reading of I2C remote temperature sensor (Texas Instruments TMP421)* endless loop of writing/reading/verifying operations on memory stick connected to implement thermal management properly.the USB port

At the application level, PS executes concurrently several tasks including:*two instances of [https://github.com/Explorer09/cpustress-sources/blob/master/cpuburn/cpuburn-1.4a/ARM/burnCortexA9.s <code>burnCortexA9</code>]*periodic reading of I2C RTC (Maxim DS3232M)*periodic reading of Zynq's ADCs*periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail*one instance of [http://pyropus.ca/software/memtester/ <code>memtester</code>], exercising 50 MByte of SDRAM*endless loop of writing/reading/verifying operations on microSD card*periodic reading of I2C remote temperature sensor (Texas Instruments TMP421)*endless loop of writing/reading/verifying operations on memory stick connected to the USB port.==== Use cases results =Results=====*Tamb: temperature of the ambient surrounding the DUT*Tj_max: maximum Zynq's junction temperature measured during the test*P_max: maximum power absorption of Bora SOM

''TBD: definire la configurazione del SOM [1] In spite of the use of heat sink, this value exceeds maximum valued declared by the manufacturer. This is acceptable in uso''case of stress tests, where it is possible that parts of the DUT get damaged.

• i====Configuration #2=========Testbed=====Measurements have been performed on the following platform:* Bora SOM: DBRF5110C1R**this model is based on Zynq XC7Z020-3E (Tj: '''0 / +100°C''')* carrier board: [[BoraEVB]]* processor frequency: '''867 MHz'''* FPGA frequency**10 MHz (Tamb = +75°C)**150 MHz (Tamb = +-40°C)*U-Boot: <code>2014.MX6 DualLite 07-00068-g9070bdc (pOct 28 2014 - 10:18:52) [belk-2.n1. MCIMX6U7CVM08AC)0]</code>• *Linux kernel: <code>3.15.0-bora-2.1 GB DDR3L SDRAM.0-xilinx-00044-g372fcab #5 SMP PREEMPT Thu Oct 23 13:54:38 CEST 2014 armv7l GNU/Linux</code>*root file system mounted over Gigabit Ethernet link.• 4 GB eMMCPlease note that, when Tamb has been set to +75°C, the Bora SOM has been coupled to a fan-cooled heat sink to prevent exceeding maximum Zynq's junction temperature.

At application level, PS executes concurrently several tasks including:*two instances of [https://github.com/Explorer09/cpustress-sources/blob/master/cpuburn/cpuburn-1 Gbps .4a/ARM/burnCortexA9.s <code>burnCortexA9</code>]*periodic reading of I2C RTC (Maxim DS3232M)*periodic reading of Zynq's ADCs*periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power rail*one instance of [http://pyropus.ca/software/memtester/ <code>memtester</code>], exercising 50 MByte of SDRAM*endless loop of writing/reading/verifying operations on microSD card*periodic reading of I2C remote temperature sensor (TExas Instruments TMP421)*endless loop of writing/reading/verifying operations on memory stick connected to USB port.=====Results=====*Tamb: temperature of the ambient surrounding the DUT*Tj_max: maximum Zynq's junction temperature measured during the test*P_max: maximum power absorption of Bora SOM{| class="wikitable" border="1"!Tamb [°C]!Tj_max [°C]!FPGA clock frequency [MHz]!P_max [W]|-|75|100.8|10|4.1|-| -40|34.7|150|7.3|-|}====Configuration #3=========Testbed=====Measurements have been performed on the following platform:* Bora SOM: DBRD4110Q2P-01**this model is based on Zynq XQ7Z020-1Q (Tj: '''-40°C / +125°C''')* carrier board: [[BoraEVB]]* processor frequency: '''667 MHz'''* FPGA frequency**40 MHz (Tamb = +85°C)**150 MHz (Tamb = +-40°C)*U-Boot: <code>2013.04 (Aug 25 2014 - 23:52:57) [belk-2.1.0]</code>*Linux kernel: <code>3.17.0-bora-2.1.0-xilinx-00053-gb95579a</code>*root file system mounted over Gigabit Ethernet link .Please note that, when Tamb has been always active during set to +85°C, the testBora SOM has been coupled to a passive heat sink to prevent exceeding maximum Zynq's junction temperature.

The table below reports At the application level, PS executes concurrently several tasks including:*two instances of [https://github.com/Explorer09/cpustress-sources/blob/master/cpuburn/cpuburn-1.4a/ARM/burnCortexA9.s <code>burnCortexA9</code>]*periodic reading of I2C RTC (Maxim DS3232M)*periodic reading of Zynq's ADCs*periodic reading of voltage/current probe (Texas Instruments INA226) connected to the SOM's power consumption measurements for rail*one instance of [http://pyropus.ca/software/memtester/ <code>memtester</code>], exercising 50 MByte of SDRAM*endless loop of writing/reading/verifying operations on microSD card*periodic reading of I2C remote temperature sensor (Texas Instruments TMP421)*endless loop of writing/reading/verifying operations on memory stick connected to the considered use casesUSB port*endless loop of writing/reading/verifying operations on NAND flash memory.====Results====*Tamb: temperature of the ambient surrounding the DUT*Tj_max: maximum Zynq's junction temperature measured during the test*P_max: maximum power absorption of Bora SOM

{| class="wikitable" ! latexfontsizeborder="scriptsize1"| Checkpoint! latexfontsize="scriptsize"| Power (mW)Tamb [°C]|-!Tj_max [°C]|U-boot prompt!FPGA clock frequency [MHz]| xxxx!P_max [W]

|Linux prompt85| xxxx140.0 [1]|40|7.0

|Stress App test (*)-40| xxxx35.5|150|7.3

(*) Stressful Application Test: https://github[1] In spite of the use of heat sink, this value exceeds maximum valued declared by the manufacturer. This is acceptable in case of stress tests, where it is possible that parts of the DUT get damaged.com/stressapptest/stressapptest