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Thermal tests and measurements (SBCX)

6 bytes added, 10:28, 11 October 2016
Test bed #4
***heat pipe dimensions are: 40x22x16.5mm [1]
**on SOM side, heat pipe is placed on the iMX6 processor and top side SDRAM chips and it is coupled with 40x22x2.03mm gap filler (Hala Thermal TGF-FUS2030-SI)
***in turn, heat pipe is thermally coupled to the metal box with Wakefield -Vette non-silicone thermal joint compound Type 126
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