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→Test bed #4
**on SOM side, heat pipe is placed on the iMX6 processor and top side SDRAM chips and it is coupled with 40x22x2.03mm gap filler (Hala Thermal TGF-FUS2030-SI)
***in turn, heat pipe is thermally coupled to the metal box with Wakefield non-silicone thermal joint compound Type 126
[[File:Heat-pipe-thermal-coupling.png|thumb|center|600px|Test bed #4: thermal couplings]]
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